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1. 发明申请

US20100308118A1 WIRELESS IC DEVICE, ELECTRONIC APPARATUS, AND METHOD FOR ADJUSTING RESONANT FREQUENCY OF WIRELESS IC DEVICE 有权
标题翻译：无线IC器件，电子设备和调整无线IC器件谐振频率的方法
公开(公告)号：US20100308118A1
公开(公告)日：2010-12-09
申请号：US12861945
申请日：2010-08-24
申请人： Takeshi KATAYA , Noboru KATO , Satoshi ISHINO , Nobuo IKEMOTO , Ikuhei KIMURA , Koji SHIROKI , Yuya DOKAI
发明人： Takeshi KATAYA , Noboru KATO , Satoshi ISHINO , Nobuo IKEMOTO , Ikuhei KIMURA , Koji SHIROKI , Yuya DOKAI
IPC分类号： G06K19/077 , H01P11/00
CPC分类号： H01Q9/40 , H01L2224/16225 , H01L2224/73204 , H01Q1/2225 , H01Q1/38 , H01Q7/00 , H01Q9/285 , H05K1/16 , Y10T29/49016
摘要： A wireless IC device and an electronic apparatus are obtained, which can achieve miniaturization and improve the gain of a radiator plate (electrode) without providing a dedicated antenna. A wireless IC device is provided, in which a loop electrode is provided in a ground electrode provided on a printed wiring circuit board, and in which a wireless IC chip that processes a transmission/reception signal or an electromagnetic coupling module is coupled to the loop electrode. The ground electrode is coupled to the wireless IC chip or the electromagnetic coupling module via the loop electrode, and transmits or receives a high-frequency signal. The ground electrode is formed with a slit for adjusting a resonant frequency thereof.
摘要翻译：获得无线IC器件和电子设备，其可以在不提供专用天线的情况下实现小型化并且提高散热器板（电极）的增益。提供了一种无线IC器件，其中在设置在印刷布线电路板上的接地电极中设置环形电极，并且其中处理发送/接收信号的无线IC芯片或电磁耦合模块耦合到环路电极。接地电极通过环形电极耦合到无线IC芯片或电磁耦合模块，并发送或接收高频信号。接地电极形成有用于调节其谐振频率的狭缝。

2. 发明申请

US20090179810A1 ARTICLE HAVING ELECTROMAGNETIC COUPLING MODULE ATTACHED THERETO 有权
标题翻译：附有电磁耦合模块的文章
公开(公告)号：US20090179810A1
公开(公告)日：2009-07-16
申请号：US12401767
申请日：2009-03-11
申请人： Noboru KATO , Yuya DOKAI , Nobuo IKEMOTO
发明人： Noboru KATO , Yuya DOKAI , Nobuo IKEMOTO
IPC分类号： H01Q13/24
CPC分类号： H04B5/0012 , G06K7/10178 , G06K19/04 , G06K19/07749
摘要： An article having an electromagnetic coupling module attached thereto includes an electromagnetic coupling module and a PET bottle having the electromagnetic coupling module bonded thereto. The electromagnetic coupling module includes a wireless IC chip arranged to process transmission and reception signals and the feed circuit board having the wireless IC chip mounted thereon. The feed circuit board includes a feed circuit including a resonant circuit having a predetermined resonant frequency. The feed circuit performs characteristic impedance matching between the PET bottle and the wireless IC chip. The PET bottle functions as a radiator arranged to radiate a transmission signal supplied from the feed circuit using electromagnetic field coupling and to supply a received reception signal to the feed circuit using electromagnetic field coupling.
摘要翻译：具有附接有电磁耦合模块的物品包括电磁耦合模块和具有与其结合的电磁耦合模块的PET瓶。电磁耦合模块包括布置成处理发送和接收信号的无线IC芯片以及安装有无线IC芯片的馈电电路板。馈电电路板包括具有预定谐振频率的谐振电路的馈电电路。馈电电路执行PET瓶和无线IC芯片之间的特征阻抗匹配。 PET瓶用作散热器，其布置成使用电磁场耦合辐射从馈电电路提供的传输信号，并且使用电磁场耦合将接收到的接收信号提供给馈电电路。

3. 发明申请

US20110127337A1 WIRELESS IC DEVICE AND ELECTRONIC APPARATUS 有权
标题翻译：无线IC设备和电子设备
公开(公告)号：US20110127337A1
公开(公告)日：2011-06-02
申请号：US13022695
申请日：2011-02-08
申请人： Nobuo IKEMOTO , Satoshi ISHINO , Yuya DOKAI , Noboru KATO , Takeshi KATAYA , Ikuhei KIMURA , Mikiko TANAKA
发明人： Nobuo IKEMOTO , Satoshi ISHINO , Yuya DOKAI , Noboru KATO , Takeshi KATAYA , Ikuhei KIMURA , Mikiko TANAKA
IPC分类号： G06K19/077
CPC分类号： H01Q1/243 , H01L2224/13139 , H01L2224/13144 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/1531 , H01L2924/19041 , H01L2924/19042 , H01L2924/19105 , H01Q1/38 , H01Q1/40 , H01Q9/28 , H03H7/38 , H03H2007/386 , H05K1/0237 , H05K1/0239 , H05K1/141 , H05K1/165 , H05K2201/10098 , H01L2924/00012
摘要： A wireless IC device that is miniaturized, allows simple and low-cost mounting of a wireless IC, and eliminates the possibility of damage occurring to the wireless IC due to static electricity, and an electronic apparatus equipped with the wireless IC device, includes a wireless IC chip that processes transmission and reception signals, and a feeder circuit substrate that includes a resonant circuit having an inductance element. Feeder electrodes are provided on a surface of the feeder circuit substrate and are electromagnetically coupled to the resonant circuit. The feeder electrodes and are electromagnetically coupled to radiation plates and provided for a printed wiring board. The wireless IC chip is activated by a signal received by the radiation plates and a response signal from the wireless IC chip is radiated outward from the radiation plates.
摘要翻译：小型化的无线IC器件允许无线IC的简单且低成本的安装，并且消除了由静电引起的对无线IC的损害的可能性，并且配备有无线IC器件的电子设备包括无线处理发送和接收信号的IC芯片，以及包括具有电感元件的谐振电路的馈电电路基板。馈电电极设置在馈电电路基板的表面上，并与谐振电路电磁耦合。馈电电极并且电磁耦合到辐射板并提供给印刷线路板。无线IC芯片由辐射板接收的信号激活，来自无线IC芯片的响应信号从辐射板向外辐射。

4. 发明申请

US20110074584A1 RADIO FREQUENCY IC DEVICE AND ELECTRONIC APPARATUS 有权
标题翻译：无线电频率IC器件和电子设备
公开(公告)号：US20110074584A1
公开(公告)日：2011-03-31
申请号：US12959454
申请日：2010-12-03
申请人： Takeshi KATAYA , Noboru KATO , Satoshi ISHINO , Nobuo IKEMOTO , Ikuhel KIMURA , Yuya DOKAI
发明人： Takeshi KATAYA , Noboru KATO , Satoshi ISHINO , Nobuo IKEMOTO , Ikuhel KIMURA , Yuya DOKAI
IPC分类号： G08B13/14
CPC分类号： G06K19/07749 , G06K19/0775 , H01L2224/16225 , H01L2224/16227 , H01Q1/2225 , H01Q1/38 , H01Q1/48 , H01Q7/00 , H04Q2213/13095 , H05K1/0239 , H05K1/0243 , H05K1/141 , H05K1/16 , H05K2201/10098
摘要： A radio frequency IC device includes a radio frequency IC chip arranged to process a transmitted/received signal, a printed circuit board on which the radio frequency IC chip is mounted, an electrode arrange on the circuit board, and a loop electrode that is arranged on the circuit board so that the loop electrode is electrically connected to the radio frequency IC chip and is coupled to the electrode by electromagnetic coupling. The electrode is coupled to the radio frequency IC chip via the loop electrode so as to transmit or receive a high-frequency signal. A power supply circuit board including a resonance circuit and/or a matching circuit may be disposed between the radio frequency IC chip and the loop electrode.
摘要翻译：射频IC器件包括布置成处理发送/接收信号的射频IC芯片，安装射频IC芯片的印刷电路板，布置在电路板上的电极和布置在电路板上的环形电极电路板，使得环形电极电连接到射频IC芯片，并通过电磁耦合耦合到电极。电极通过环形电极耦合到射频IC芯片，以便发送或接收高频信号。包括谐振电路和/或匹配电路的电源电路板可以设置在射频IC芯片和环形电极之间。

5. 发明申请

US20100103058A1 RADIO IC DEVICE 有权
标题翻译：无线IC设备
公开(公告)号：US20100103058A1
公开(公告)日：2010-04-29
申请号：US12688072
申请日：2010-01-15
申请人： Noboru KATO , Satoshi ISHINO , Takeshi KATAYA , Ikuhei KIMURA , Nobuo IKEMOTO , Yuya DOKAI
发明人： Noboru KATO , Satoshi ISHINO , Takeshi KATAYA , Ikuhei KIMURA , Nobuo IKEMOTO , Yuya DOKAI
IPC分类号： H01Q1/24
CPC分类号： G06K19/07749 , G06K19/06187 , G06K19/0723 , G06K19/07756 , G06K19/07773 , G06K19/07779 , G06K19/07783 , G06K19/07784 , G06K19/07786 , H01L23/49838 , H01L23/552 , H01L23/66 , H01L2223/6655 , H01L2223/6677 , H01L2224/16227 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01Q1/36 , H01Q1/38 , H01Q1/42 , H01Q1/44 , H01Q7/00 , H01Q9/16 , H01Q9/30 , H01Q13/10 , H05K1/0216 , H05K1/0237 , H05K1/0239 , H05K1/141 , H05K1/16 , H05K1/181 , H05K2201/10015 , H05K2201/10022 , H05K2201/1003 , H05K2201/10098 , H05K2201/10371 , H05K2201/10522 , H01L2924/00014 , H01L2924/00
摘要： A radio IC device includes an electromagnetic coupling module includes a radio IC chip arranged to process transmitted and received signals and a feed circuit board including an inductance element. The feed circuit board includes an external electrode electromagnetically coupled to the feed circuit, and the external electrode is electrically connected to a shielding case or a wiring cable. The shielding case or the wiring cable functions as a radiation plate. The radio IC chip is operated by a signal received by the shielding case or the wiring, and the answer signal from the radio IC chip is radiated from the shielding case or the wiring cable to the outside. A metal component functions as the radiation plate, and the metal component may be a ground electrode disposed on the printed wiring board.
摘要翻译：无线IC器件包括：电磁耦合模块，包括布置成处理发送和接收信号的无线IC芯片和包括电感元件的馈电电路板。馈电电路板包括电磁耦合到馈电电路的外部电极，并且外部电极电连接到屏蔽壳体或布线电缆。屏蔽壳或接线电缆用作辐射板。无线IC芯片由屏蔽壳或布线接收到的信号进行操作，来自无线IC芯片的应答信号从屏蔽壳或布线电缆向外部辐射。金属部件用作辐射板，并且金属部件可以是布置在印刷线路板上的接地电极。

6. 发明申请

US20120217312A1 WIRELESS IC DEVICE AND ELECTRONIC APPARATUS 有权
标题翻译：无线IC设备和电子设备
公开(公告)号：US20120217312A1
公开(公告)日：2012-08-30
申请号：US13468058
申请日：2012-05-10
申请人： Nobuo IKEMOTO , Satoshi ISHINO , Yuya DOKAI , Noboru KATO , Takeshi KATAYA , Ikuhei KIMURA , Mikiko TANAKA
发明人： Nobuo IKEMOTO , Satoshi ISHINO , Yuya DOKAI , Noboru KATO , Takeshi KATAYA , Ikuhei KIMURA , Mikiko TANAKA
IPC分类号： G06K19/073
CPC分类号： H01Q1/243 , H01L2224/13139 , H01L2224/13144 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/1531 , H01L2924/19041 , H01L2924/19042 , H01L2924/19105 , H01Q1/38 , H01Q1/40 , H01Q9/28 , H03H7/38 , H03H2007/386 , H05K1/0237 , H05K1/0239 , H05K1/141 , H05K1/165 , H05K2201/10098 , H01L2924/00012
摘要： A wireless IC device that is miniaturized, allows simple and low-cost mounting of a wireless IC, and eliminates the possibility of damage occurring to the wireless IC due to static electricity, and an electronic apparatus equipped with the wireless IC device, includes a wireless IC chip that processes transmission and reception signals, and a feeder circuit substrate that includes a resonant circuit having an inductance element. Feeder electrodes are provided on a surface of the feeder circuit substrate and are electromagnetically coupled to the resonant circuit. The feeder electrodes and are electromagnetically coupled to radiation plates and provided for a printed wiring board. The wireless IC chip is activated by a signal received by the radiation plates and a response signal from the wireless IC chip is radiated outward from the radiation plates.
摘要翻译：小型化的无线IC器件允许无线IC的简单且低成本的安装，并且消除了由静电引起的对无线IC的损害的可能性，并且配备有无线IC器件的电子设备包括无线处理发送和接收信号的IC芯片，以及包括具有电感元件的谐振电路的馈电电路基板。馈电电极设置在馈电电路基板的表面上，并与谐振电路电磁耦合。馈电电极并且电磁耦合到辐射板并提供给印刷线路板。无线IC芯片由辐射板接收的信号激活，来自无线IC芯片的响应信号从辐射板向外辐射。

7. 发明申请

US20100244215A1 WIRELESS IC DEVICE 有权
标题翻译：无线IC器件
公开(公告)号：US20100244215A1
公开(公告)日：2010-09-30
申请号：US12797824
申请日：2010-06-10
申请人： Noboru KATO , Yuya DOKAI , Nobuo IKEMOTO
发明人： Noboru KATO , Yuya DOKAI , Nobuo IKEMOTO
IPC分类号： H01L23/498 , G06K19/07
CPC分类号： G06K19/07749 , G06K19/07758 , G06K19/07786
摘要： A wireless IC device includes a radiating plate, a wireless IC chip, and a feeder circuit board, on which the wireless IC chip is mounted. The feeder circuit board includes a resonant circuit with an inductance element, and the resonant circuit is electromagnetically coupled with the radiating plate. The wireless IC chip is interposed between the radiating plate and the feeder circuit board.
摘要翻译：无线IC器件包括安装无线IC芯片的辐射板，无线IC芯片和馈电电路板。馈电电路板包括具有电感元件的谐振电路，并且谐振电路与辐射板电磁耦合。无线IC芯片插在散热板和馈电电路板之间。

8. 发明申请

US20110199713A1 HIGH-FREQUENCY DEVICE AND WIRELESS IC DEVICE 有权
标题翻译：高频器件和无线IC器件
公开(公告)号：US20110199713A1
公开(公告)日：2011-08-18
申请号：US13094928
申请日：2011-04-27
申请人： Noboru KATO , Nobuo IKEMOTO , Yuya DOKAI , Koji SHIROKI
发明人： Noboru KATO , Nobuo IKEMOTO , Yuya DOKAI , Koji SHIROKI
IPC分类号： H05F3/00
CPC分类号： H01Q9/285 , G06K19/07718 , G06K19/07735 , G06K19/07749 , H01L23/60 , H01L23/642 , H01L23/645 , H01L23/66 , H01L2223/6677 , H01L2924/0002 , H01L2924/3011 , H01Q1/2225 , H01Q1/38 , H01Q9/24 , H01L2924/00
摘要： A high-frequency device includes a wireless IC chip and a board which is coupled to the wireless IC chip and electrically connected to radiator plates, and an inductor and/or a capacitance are provided as a static electricity countermeasure element in the board. The inductor is connected in parallel between the wireless IC chip and the radiator plates, and its impedance at the frequency of static electricity is less than an impedance of the wireless IC chip.
摘要翻译：高频器件包括无线IC芯片和耦合到无线IC芯片并电连接到散热器板的板，并且在板中提供电感器和/或电容作为静电对抗元件。电感器并联在无线IC芯片和散热板之间，其静电频率下的阻抗小于无线IC芯片的阻抗。

9. 发明申请

US20090266900A1 WIRELESS IC DEVICE AND ELECTRONIC APPARATUS 有权
标题翻译：无线IC设备和电子设备
公开(公告)号：US20090266900A1
公开(公告)日：2009-10-29
申请号：US12503188
申请日：2009-07-15
申请人： Nobuo IKEMOTO , Satoshi ISHINO , Yuya DOKAI , Noboru KATO , Takeshi KATAYA , Ikuhei KIMURA , Mikiko TANAKA
发明人： Nobuo IKEMOTO , Satoshi ISHINO , Yuya DOKAI , Noboru KATO , Takeshi KATAYA , Ikuhei KIMURA , Mikiko TANAKA
IPC分类号： G06K19/06
CPC分类号： H01Q1/243 , H01L2224/13139 , H01L2224/13144 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/1531 , H01L2924/19041 , H01L2924/19042 , H01L2924/19105 , H01Q1/38 , H01Q1/40 , H01Q9/28 , H03H7/38 , H03H2007/386 , H05K1/0237 , H05K1/0239 , H05K1/141 , H05K1/165 , H05K2201/10098 , H01L2924/00012
摘要： A wireless IC device that is miniaturized, allows simple and low-cost mounting of a wireless IC, and eliminates the possibility of damage occurring to the wireless IC due to static electricity, and an electronic apparatus equipped with the wireless IC device, includes a wireless IC chip that processes transmission and reception signals, and a feeder circuit substrate that includes a resonant circuit having an inductance element. Feeder electrodes are provided on a surface of the feeder circuit substrate and are electromagnetically coupled to the resonant circuit. The feeder electrodes and are electromagnetically coupled to radiation plates and provided for a printed wiring board. The wireless IC chip is activated by a signal received by the radiation plates and a response signal from the wireless IC chip is radiated outward from the radiation plates.
摘要翻译：小型化的无线IC器件允许无线IC的简单且低成本的安装，并且消除了由静电引起的对无线IC的损害的可能性，并且配备有无线IC器件的电子设备包括无线处理发送和接收信号的IC芯片，以及包括具有电感元件的谐振电路的馈电电路基板。馈电电极设置在馈电电路基板的表面上，并与谐振电路电磁耦合。馈电电极并且电磁耦合到辐射板并提供给印刷线路板。无线IC芯片由辐射板接收的信号激活，来自无线IC芯片的响应信号从辐射板向外辐射。

10. 发明申请

US20090224061A1 WIRELESS IC DEVICE 有权
标题翻译：无线IC器件
公开(公告)号：US20090224061A1
公开(公告)日：2009-09-10
申请号：US12469896
申请日：2009-05-21
申请人： Noboru KATO , Yuya DOKAI , Nobuo IKEMOTO
发明人： Noboru KATO , Yuya DOKAI , Nobuo IKEMOTO
IPC分类号： G06K19/06
CPC分类号： H01Q7/00 , G06K19/07749 , G06K19/07756 , H01Q1/2208
摘要： A wireless IC device includes a radiation plate, a feeding circuit substrate on which a feeding circuit including a resonant circuit including an inductance element is provided, the feeding circuit being electromagnetically coupled to the radiation plate, and a wireless IC chip including a connection electrode, the wireless IC chip being disposed on the feeding circuit substrate. A mounting electrode is provided on the feeding circuit substrate. The frequency of signals sent and received using the radiation plate substantially corresponds to the resonant frequency of the resonant circuit. The wireless IC chip is electromagnetically coupled to the mounting electrode.
摘要翻译：无线IC器件包括辐射板，馈电电路基板，其上设有包括电感元件的谐振电路的馈电电路，馈电电路与放射板电磁耦合;以及无线IC芯片，包括连接电极，无线IC芯片设置在馈电电路基板上。馈电电路基板上设有安装电极。使用辐射板发送和接收的信号的频率基本上对应于谐振电路的谐振频率。无线IC芯片电磁耦合到安装电极。

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