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1. 发明授权

US09684239B2 Photosensitive resin composition, resist laminate, and cured product thereof (2) 有权
公开(公告)号：US09684239B2
公开(公告)日：2017-06-20
申请号：US14437940
申请日：2013-10-25
申请人： Nippon Kayaku Kabushiki Kaisha
发明人： Naoko Imaizumi , Shinya Inagaki , Nao Honda
IPC分类号： G03F7/038 , G03F7/075
CPC分类号： G03F7/0751 , G03F7/038 , G03F7/0755
摘要： The purpose of the present invention is to provide: a photosensitive epoxy resin composition and/or a resist laminate of said resin composition that makes it possible to use photolithography to form an image having a vertical sidewall shape and fine resolution, low stress, and heat/humidity resistance; and a cured product of said resin composition and said resist laminate. The present invention is a photosensitive resin composition comprising: (A) an epoxy resin; (B) a polyphenol compound having a specific structure; (C) a photocationic polymerization initiator; and (D) an epoxy group-containing silane compound. The epoxy resin (A) comprises: an epoxy resin (a) obtained by reacting a phenol derivative that is represented by formula (1) with an epihalohydrin; and an epoxy resin (b) that is represented by formula (2).

2. 发明申请

US20170102614A1 Photosensitive Resin Composition, Resist Laminate, Cured Product Of Photosensitive Resin Composition, And Cured Product Of Resist Laminate (11) 有权
公开(公告)号：US20170102614A1
公开(公告)日：2017-04-13
申请号：US15317666
申请日：2015-06-09
申请人： Nippon Kayaku Kabushiki Kaisha
发明人： Naoko Imaizumi , Yoshiyuki Ono , Takanori Koizumi , Maki Kumagai , Shinya Inagaki
IPC分类号： G03F7/075 , G03F7/004
CPC分类号： G03F7/0758 , C08G59/62 , G03F7/004 , G03F7/0045 , G03F7/038 , G03F7/0382 , G03F7/075 , G03F7/0751
摘要： The purpose of the present invention is to provide: a resin composition, a cured product of which has extremely low residual stress and exhibits excellent adhesion to a metal substrate such as a Pt, LT or Ta substrate after a wet heat test in the fields of semiconductors and MEMS/micromachine applications; a laminate of this resin composition; and a cured product of this resin composition or the laminate. The present invention is a photosensitive resin composition which contains an epoxy resin (A), a compound having a phenolic hydroxyl group (B) and a cationic photopolymerization initiator (C), and wherein: the epoxy resin (A) has a weighted average epoxy equivalent weight of 300 g/eq. or more; 20% by mass or more of the epoxy resin (A) is an epoxy resin represented by formula (1) and having an epoxy equivalent weight of 500-4,500 g/eq.; and the compound having a phenolic hydroxyl group (B) contains a phenolic compound having a specific structure.

3. 发明申请

US20150301450A1 Photosensitive Resin Composition, Resist Laminate, And Cured Product (2) Thereof 有权
标题翻译：感光树脂组合物，抗蚀层压材料和固化产品（2）
公开(公告)号：US20150301450A1
公开(公告)日：2015-10-22
申请号：US14437940
申请日：2013-10-25
申请人： NIPPON KAYAKU KABUSHIKI KAISHA
发明人： Naoko Imaizumi , Shinya Inagaki , Nao Honda
IPC分类号： G03F7/038
CPC分类号： G03F7/0751 , G03F7/038 , G03F7/0755
摘要： The purpose of the present invention is to provide: a photosensitive epoxy resin composition and/or a resist laminate of said resin composition that makes it possible to use photolithography to form an image having a vertical sidewall shape and fine resolution, low stress, and heat/humidity resistance; and a cured product of said resin composition and said resist laminate. The present invention is a photosensitive resin composition comprising: (A) an epoxy resin; (B) a polyphenol compound having a specific structure; (C) a photocationic polymerization initiator; and (D) an epoxy group-containing silane compound. The epoxy resin (A) comprises: an epoxy resin (a) obtained by reacting a phenol derivative that is represented by formula (1) with an epihalohydrin; and an epoxy resin (b) that is represented by formula (2).
摘要翻译：本发明的目的是提供：所述树脂组合物的感光性环氧树脂组合物和/或抗蚀层叠体，其可以使用光刻法形成具有垂直侧壁形状和精细分辨率，低应力和热量的图像 /耐湿性; 和所述树脂组合物和所述抗蚀剂层压体的固化产物。本发明是一种感光性树脂组合物，其含有：（A）环氧树脂; （B）具有特定结构的多酚化合物; （C）光阳离子聚合引发剂; 和（D）含环氧基的硅烷化合物。环氧树脂（A）包括：将由式（1）表示的苯酚衍生物与表卤代醇反应得到的环氧树脂（a）和由式（2）表示的环氧树脂（b）。

4. 发明授权

US10241408B2 Photosensitive resin composition, resist laminate, and cured product thereof (1) 有权
公开(公告)号：US10241408B2
公开(公告)日：2019-03-26
申请号：US14437933
申请日：2013-10-25
申请人： Nippon Kayaku Kabushiki Kaisha
发明人： Naoko Imaizumi , Shinya Inagaki , Nao Honda
IPC分类号： G03F7/075 , G03F7/038 , B32B27/06 , B32B27/38
摘要： The purpose of the present invention is to provide: a photosensitive epoxy resin composition and/or a resist laminate of said resin composition that makes it possible to use photolithography to form an image having a vertical sidewall shape and fine resolution, low stress, and heat/humidity resistance; and a cured product of said resin composition and said resist laminate. The present invention is a photosensitive resin composition comprising: (A) an epoxy resin; (B) a polyol compound having a specific structure; (C) a photocationic polymerization initiator; and (D) an epoxy group-containing silane compound. The epoxy resin (A) comprises: an epoxy resin (a) obtained by reacting a phenol derivative that is represented by formula (1) with an epihalohydrin; and an epoxy resin (b) that is represented by formula (2).

5. 发明授权

US09857685B2 Photosensitive resin composition, resist laminate, cured product of photosensitive resin composition, and cured product of resist laminate (11) 有权
公开(公告)号：US09857685B2
公开(公告)日：2018-01-02
申请号：US15317666
申请日：2015-06-09
申请人： Nippon Kayaku Kabushiki Kaisha
发明人： Naoko Imaizumi , Yoshiyuki Ono , Takanori Koizumi , Maki Kumagai , Shinya Inagaki
IPC分类号： G03F7/075 , G03F7/038 , G03F7/004
CPC分类号： G03F7/0758 , C08G59/62 , G03F7/004 , G03F7/0045 , G03F7/038 , G03F7/0382 , G03F7/075 , G03F7/0751
摘要： The purpose of the present invention is to provide: a resin composition, a cured product of which has extremely low residual stress and exhibits excellent adhesion to a metal substrate such as a Pt, LT or Ta substrate after a wet heat test in the fields of semiconductors and MEMS/micromachine applications; a laminate of this resin composition; and a cured product of this resin composition or the laminate. The present invention is a photosensitive resin composition which contains an epoxy resin (A), a compound having a phenolic hydroxyl group (B) and a cationic photopolymerization initiator (C), and wherein: the epoxy resin (A) has a weighted average epoxy equivalent weight of 300 g/eq. or more; 20% by mass or more of the epoxy resin (A) is an epoxy resin represented by formula (1) and having an epoxy equivalent weight of 500-4,500 g/eq.; and the compound having a phenolic hydroxyl group (B) contains a phenolic compound having a specific structure.

6. 发明申请

US20150293444A1 Photosensitive Resin Composition, Resist Laminate, And Articles Obtained By Curing Same (5) 有权
标题翻译：光敏树脂组合物，抗蚀层压板及其固化物（5）
公开(公告)号：US20150293444A1
公开(公告)日：2015-10-15
申请号：US14443669
申请日：2013-11-21
申请人： NIPPON KAYAKU KABUSHIKI KAISHA
发明人： Naoko Imaizumi , Shinya Inagaki , Nao Honda
IPC分类号： G03F7/004 , B32B27/32 , B32B27/08
CPC分类号： G03F7/004 , B32B27/08 , B32B27/32 , B32B2255/10 , B32B2255/26 , B32B2307/71 , B32B2559/00 , C08G59/063 , C08G59/226 , C08G59/245 , C08G59/38 , C08K5/5435 , C08L63/00 , C08L71/02 , G03F7/038 , G03F7/0751 , G03F7/0755
摘要： The purpose of the present invention is to provide the following: a photosensitive epoxy resin composition that, via photolithography, can form a high-resolution, low-stress image that has vertical side walls and resists moisture and heat, and/or a resist laminate using said photosensitive epoxy resin composition; and an article or articles obtained by curing said photosensitive epoxy resin composition and/or resist laminate. The present invention is a photosensitive resin composition containing the following: an epoxy resin (A), a polyol compound (B) having a specific structure, a cationic-polymerization photoinitiator (C), a silane compound (D) containing an epoxy group, and a reactive epoxy monomer (E) having a specific structure. The epoxy resin (A) contains the phenol derivative represented by formula (1), an epoxy resin (a) obtained via a reaction with epihalohydrin, and an epoxy resin (b) that can be represented by formula (2).
摘要翻译：本发明的目的是提供以下：通过光刻法可以形成具有垂直侧壁并抵抗水分和热量的高分辨率，低应力图像的光敏环氧树脂组合物和/或抗蚀剂层压体使用所述感光性环氧树脂组合物; 以及通过固化所述感光性环氧树脂组合物和/或抗蚀剂层压体而获得的制品或制品。本发明是含有以下的感光性树脂组合物：环氧树脂（A），具有特定结构的多元醇化合物（B），阳离子聚合光引发剂（C），含有环氧基的硅烷化合物（D）和具有特定结构的反应性环氧单体（E）。环氧树脂（A）含有由式（1）表示的苯酚衍生物，通过与表卤代醇反应获得的环氧树脂（a）和可由式（2）表示的环氧树脂（b）。

7. 发明授权

US10012901B2 Photosensitive resin composition, resist laminate, and articles obtained by curing same (5) 有权
公开(公告)号：US10012901B2
公开(公告)日：2018-07-03
申请号：US14443669
申请日：2013-11-21
申请人： Nippon Kayaku Kabushiki Kaisha
发明人： Naoko Imaizumi , Shinya Inagaki , Nao Honda
IPC分类号： G03F7/004 , G03F7/038 , C08G59/38 , C08L63/00 , G03F7/075 , B32B27/08 , B32B27/32 , C08G59/06 , C08G59/22 , C08G59/24
CPC分类号： G03F7/004 , B32B27/08 , B32B27/32 , B32B2255/10 , B32B2255/26 , B32B2307/71 , B32B2559/00 , C08G59/063 , C08G59/226 , C08G59/245 , C08G59/38 , C08K5/5435 , C08L63/00 , C08L71/02 , G03F7/038 , G03F7/0751 , G03F7/0755
摘要： The purpose of the present invention is to provide the following: a photosensitive epoxy resin composition that, via photolithography, can form a high-resolution, low-stress image that has vertical side walls and resists moisture and heat, and/or a resist laminate using said photosensitive epoxy resin composition; and an article or articles obtained by curing said photosensitive epoxy resin composition and/or resist laminate. The present invention is a photosensitive resin composition containing the following: an epoxy resin (A), a polyol compound (B) having a specific structure, a cationic-polymerization photoinitiator (C), a silane compound (D) containing an epoxy group, and a reactive epoxy monomer (E) having a specific structure. The epoxy resin (A) contains the phenol derivative represented by formula (1), an epoxy resin (a) obtained via a reaction with epihalohydrin, and an epoxy resin (b) that can be represented by formula (2).

8. 发明授权

US09448479B2 Photosensitive resin composition, resist laminate, and articles obtained by curing same (7) 有权
标题翻译：感光树脂组合物，抗蚀剂层压体和通过固化获得的制品（7）
公开(公告)号：US09448479B2
公开(公告)日：2016-09-20
申请号：US14443679
申请日：2013-11-21
申请人： Nippon Kayaku Kabushiki Kaisha
发明人： Naoko Imaizumi , Shinya Inagaki , Nao Honda
IPC分类号： G03F7/075 , C08G59/24 , C08G59/32 , C08G59/62 , G03F7/038
CPC分类号： G03F7/0755 , C08G59/063 , C08G59/24 , C08G59/245 , C08G59/32 , C08G59/3218 , C08G59/38 , C08G59/62 , C08G59/621 , C08K5/109 , C08K5/13 , C08K5/5419 , C08L33/068 , C08L63/00 , G03F7/038 , G03F7/0751
摘要： The purpose of the present invention is to provide the following: a photosensitive epoxy resin composition that, via photolithography, can form a high-resolution, low-stress image that has vertical side walls and resists moisture and heat, and/or a resist laminate using said photosensitive epoxy resin composition; and an article or articles obtained by curing said photosensitive epoxy resin composition and/or resist laminate. The present invention is a photosensitive resin composition containing the following: an epoxy resin (A), a polyhydric phenol compound (B) having a specific structure, a cationic-polymerization photoinitiator (C), a silane compound (D) containing an epoxy group, and a reactive epoxy monomer (E) having a specific structure. The epoxy resin (A) contains the phenol derivative represented by formula (1), an epoxy resin (a) obtained via a reaction with epihalohydrin, and an epoxy resin (b) that can be represented by formula (2). The reactive epoxy monomer (E) is a bisphenol epoxy resin.
摘要翻译：本发明的目的是提供以下：通过光刻法可以形成具有垂直侧壁并抵抗水分和热量的高分辨率，低应力图像的光敏环氧树脂组合物和/或抗蚀剂层压体使用所述感光性环氧树脂组合物; 以及通过固化所述感光性环氧树脂组合物和/或抗蚀剂层压体而获得的制品或制品。本发明是含有以下的感光性树脂组合物：环氧树脂（A），具有特定结构的多元酚化合物（B），阳离子聚合光引发剂（C），含有环氧基的硅烷化合物（D），和具有特定结构的反应性环氧单体（E）。环氧树脂（A）含有由式（1）表示的苯酚衍生物，通过与表卤代醇反应获得的环氧树脂（a）和可由式（2）表示的环氧树脂（b）。反应性环氧单体（E）是双酚环氧树脂。

9. 发明申请

US20150309409A1 Photosensitive Resin Composition, Resist Laminate, And Articles Obtained By Curing Same (7) 有权
标题翻译：感光树脂组合物，抗层压材料和固化所得固化物（7）
公开(公告)号：US20150309409A1
公开(公告)日：2015-10-29
申请号：US14443679
申请日：2013-11-21
申请人： NIPPON KAYAKU KABUSHIKI KAISHA
发明人： Naoko Imaizumi , Shinya Inagaki , Nao Honda
IPC分类号： G03F7/075
CPC分类号： G03F7/0755 , C08G59/063 , C08G59/24 , C08G59/245 , C08G59/32 , C08G59/3218 , C08G59/38 , C08G59/62 , C08G59/621 , C08K5/109 , C08K5/13 , C08K5/5419 , C08L33/068 , C08L63/00 , G03F7/038 , G03F7/0751
摘要： The purpose of the present invention is to provide the following: a photosensitive epoxy resin composition that, via photolithography, can form a high-resolution, low-stress image that has vertical side walls and resists moisture and heat, and/or a resist laminate using said photosensitive epoxy resin composition; and an article or articles obtained by curing said photosensitive epoxy resin composition and/or resist laminate. The present invention is a photosensitive resin composition containing the following: an epoxy resin (A), a polyhydric phenol compound (B) having a specific structure, a cationic-polymerization photoinitiator (C), a silane compound (D) containing an epoxy group, and a reactive epoxy monomer (E) having a specific structure. The epoxy resin (A) contains the phenol derivative represented by formula (1), an epoxy resin (a) obtained via a reaction with epihalohydrin, and an epoxy resin (b) that can be represented by formula (2). The reactive epoxy monomer (E) is a bisphenol epoxy resin.
摘要翻译：本发明的目的是提供以下：通过光刻法可以形成具有垂直侧壁并抵抗水分和热量的高分辨率，低应力图像的光敏环氧树脂组合物和/或抗蚀剂层压体使用所述感光性环氧树脂组合物; 以及通过固化所述感光性环氧树脂组合物和/或抗蚀剂层压体而获得的制品或制品。本发明是含有以下的感光性树脂组合物：环氧树脂（A），具有特定结构的多元酚化合物（B），阳离子聚合光引发剂（C），含有环氧基的硅烷化合物（D），和具有特定结构的反应性环氧单体（E）。环氧树脂（A）含有由式（1）表示的苯酚衍生物，通过与表卤代醇反应获得的环氧树脂（a）和可由式（2）表示的环氧树脂（b）。反应性环氧单体（E）是双酚环氧树脂。

10. 发明申请

US20150293448A1 Photosensitive Resin Composition, Resist Laminate, And Cured Product (1) Thereof 审中-公开
标题翻译：感光树脂组合物，抗蚀层压板和固化产品（1）
公开(公告)号：US20150293448A1
公开(公告)日：2015-10-15
申请号：US14437933
申请日：2013-10-25
申请人： NIPPON KAYAKU KABUSHIKI KAISHA
发明人： Naoko Imaizumi , Shinya Inagaki , Nao Honda
IPC分类号： G03F7/075 , B32B27/38 , B32B27/06
CPC分类号： G03F7/0755 , B32B27/06 , B32B27/38 , B32B2559/00 , G03F7/038
摘要： The purpose of the present invention is to provide: a photosensitive epoxy resin composition and/or a resist laminate of said resin composition that makes it possible to use photolithography to form an image having a vertical sidewall shape and fine resolution, low stress, and heat/humidity resistance; and a cured product of said resin composition and said resist laminate. The present invention is a photosensitive resin composition comprising: (A) an epoxy resin; (B) a polyol compound having a specific structure; (C) a photocationic polymerization initiator; and (D) an epoxy group-containing silane compound. The epoxy resin (A) comprises: an epoxy resin (a) obtained by reacting a phenol derivative that is represented by formula (1) with an epihalohydrin; and an epoxy resin (b) that is represented by formula (2).
摘要翻译：本发明的目的是提供：所述树脂组合物的感光性环氧树脂组合物和/或抗蚀层叠体，其可以使用光刻法形成具有垂直侧壁形状和精细分辨率，低应力和热量的图像 /耐湿性; 和所述树脂组合物和所述抗蚀剂层压体的固化产物。本发明是一种感光性树脂组合物，其含有：（A）环氧树脂; （B）具有特定结构的多元醇化合物; （C）光阳离子聚合引发剂; 和（D）含环氧基的硅烷化合物。环氧树脂（A）包括：将由式（1）表示的苯酚衍生物与表卤代醇反应得到的环氧树脂（a）和由式（2）表示的环氧树脂（b）。

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