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    • 2. 发明授权
    • Method of making three dimensional NAND memory
    • 制作三维NAND存储器的方法
    • US07514321B2
    • 2009-04-07
    • US11691840
    • 2007-03-27
    • Nima MokhlesiRoy Scheuerlein
    • Nima MokhlesiRoy Scheuerlein
    • H01L21/336
    • H01L27/115H01L27/0605H01L27/0688H01L27/11568H01L27/11582
    • A method of making a monolithic, three dimensional NAND string, includes forming a semiconductor active region of a first memory cell over a semiconductor active region of a second memory cell. The semiconductor active region of the first memory cell is a first pillar having a square or rectangular cross section when viewed from above, the first pillar being a first conductivity type semiconductor region located between second conductivity type semiconductor regions. The semiconductor active region of the second memory cell is a second pillar having a square or rectangular cross section when viewed from above, the second pillar located under the first pillar, the second pillar being a first conductivity type semiconductor region located between second conductivity type semiconductor regions. One second conductivity type semiconductor region in the first pillar contacts one second conductivity type semiconductor region in the second pillar.
    • 制造单片三维NAND串的方法包括在第二存储单元的半导体有源区上形成第一存储单元的半导体有源区。 第一存储单元的半导体有源区是从上方观察时具有正方形或矩形截面的第一柱,第一柱是位于第二导电型半导体区之间的第一导电型半导体区。 第二存储单元的半导体有源区是当从上方观察时具有正方形或矩形横截面的第二柱,位于第一柱下方的第二柱,第二柱是位于第二导电型半导体 地区。 第一柱中的一个第二导电类型半导体区域接触第二柱中的一个第二导电类型半导体区域。
    • 9. 发明授权
    • Method of making three dimensional NAND memory
    • 制作三维NAND存储器的方法
    • US07808038B2
    • 2010-10-05
    • US11691858
    • 2007-03-27
    • Nima MokhlesiRoy Scheuerlein
    • Nima MokhlesiRoy Scheuerlein
    • H01L29/792
    • H01L27/115H01L27/11556H01L27/11568
    • A monolithic, three dimensional NAND string includes a first memory cell located over a second memory cell. A semiconductor active region of the first memory cell is a first pillar having a square or rectangular cross section when viewed from above, the first pillar being a first conductivity type semiconductor region located between second conductivity type semiconductor regions. A semiconductor active region of the second memory cell is a second pillar having a square or rectangular cross section when viewed from above, the second pillar located under the first pillar, the second pillar being a first conductivity type semiconductor region located between second conductivity type semiconductor regions. One second conductivity type semiconductor region in the first pillar contacts one second conductivity type semiconductor region in the second pillar.
    • 单片三维NAND串包括位于第二存储单元上的第一存储单元。 第一存储单元的半导体有源区是从上方观察时具有正方形或矩形截面的第一柱,第一柱是位于第二导电型半导体区之间的第一导电型半导体区。 第二存储单元的半导体有源区是当从上方观察时具有正方形或矩形横截面的第二柱,位于第一柱下方的第二柱,第二柱是位于第二导电型半导体 地区。 第一柱中的一个第二导电类型半导体区域接触第二柱中的一个第二导电类型半导体区域。
    • 10. 发明申请
    • METHOD OF MAKING THREE DIMENSIONAL NAND MEMORY
    • 制造三维NAND存储器的方法
    • US20080237698A1
    • 2008-10-02
    • US11691858
    • 2007-03-27
    • Nima MokhlesiRoy Scheuerlein
    • Nima MokhlesiRoy Scheuerlein
    • H01L29/792
    • H01L27/115H01L27/11556H01L27/11568
    • A monolithic, three dimensional NAND string includes a first memory cell located over a second memory cell. A semiconductor active region of the first memory cell is a first pillar having a square or rectangular cross section when viewed from above, the first pillar being a first conductivity type semiconductor region located between second conductivity type semiconductor regions. A semiconductor active region of the second memory cell is a second pillar having a square or rectangular cross section when viewed from above, the second pillar located under the first pillar, the second pillar being a first conductivity type semiconductor region located between second conductivity type semiconductor regions. One second conductivity type semiconductor region in the first pillar contacts one second conductivity type semiconductor region in the second pillar.
    • 单片三维NAND串包括位于第二存储单元上的第一存储单元。 第一存储单元的半导体有源区是从上方观察时具有正方形或矩形截面的第一柱,第一柱是位于第二导电型半导体区之间的第一导电型半导体区。 第二存储单元的半导体有源区是当从上方观察时具有正方形或矩形横截面的第二柱,位于第一柱下方的第二柱,第二柱是位于第二导电型半导体 地区。 第一柱中的一个第二导电类型半导体区域接触第二柱中的一个第二导电类型半导体区域。