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1. 发明申请

US20090256365A1 Circuit insulation methods and systems for vehicle door latches 审中-公开
标题翻译：车门闩锁的电路绝缘方法和系统
公开(公告)号：US20090256365A1
公开(公告)日：2009-10-15
申请号：US12082538
申请日：2008-04-11
申请人： Nigel V. Spurr , Michael J. Shelley , Richard T. Hayes , William F. Eaton , Hugh D. Gibson , Alex Crawford , Ajaykumar Vaidhyanathan , Scott A. Vorwald , Kenneth V. Bechtold , Curtis B. Johnson , Duncan S. Murchie , Daniel D. Kilker , Abanni B. Maxwell , Patrick H. Shannon , Gillian J. Madden , Adrian T. Kettle
发明人： Nigel V. Spurr , Michael J. Shelley , Richard T. Hayes , William F. Eaton , Hugh D. Gibson , Alex Crawford , Ajaykumar Vaidhyanathan , Scott A. Vorwald , Kenneth V. Bechtold , Curtis B. Johnson , Duncan S. Murchie , Daniel D. Kilker , Abanni B. Maxwell , Patrick H. Shannon , Gillian J. Madden , Adrian T. Kettle
IPC分类号： B65D53/06 , E05B47/02
CPC分类号： E05B17/0004 , B29C45/14639 , E05B81/54 , Y10T70/7062 , Y10T292/509
摘要： An injection molding method and system for an electrical circuit utilized in vehicle door latch mechanisms is disclosed herein. A mold is generally provided in which a mold cavity is formed therein from walls of the mold. An electrical circuit associated with vehicle door latch and/or integrated with the vehicle door latch can be located within the mold cavity. A plastics material can then be injection molded into the mold cavity of the mold, wherein the plastics material covers and seals the electrical circuit to provide insulation and environmental protection to the electrical circuit.
摘要翻译：本文公开了一种用于车门闩锁机构中的电路的注射成型方法和系统。通常设置有模具，其中从模具的壁形成模腔。与车门闩锁相关联和/或与车门闩锁一体化的电路可以位于模腔内。然后可以将塑料材料注射模塑到模具的模腔中，其中塑料材料覆盖并密封电路以向电路提供绝缘和环境保护。

2. 发明授权

US07170253B2 Automotive door latch control by motor current monitoring 失效
标题翻译：汽车门锁控制通过电机电流监控
公开(公告)号：US07170253B2
公开(公告)日：2007-01-30
申请号：US10940345
申请日：2004-09-14
申请人： Nigel V. Spurr , Michael J. Shelley , Richard T. Hayes , William F. Eaton , Hugh D. Gibson , Alex Crawford , Ajaykumar Vaidhyanathan , Scott A. Vorwald , Kenneth V. Bechtold , Curtis B. Johnson , Duncan S. Murchie , Daniel D. Kilker , Abanni B. Maxwell , Patrick H. Shannon , Gillian J. Madden
发明人： Nigel V. Spurr , Michael J. Shelley , Richard T. Hayes , William F. Eaton , Hugh D. Gibson , Alex Crawford , Ajaykumar Vaidhyanathan , Scott A. Vorwald , Kenneth V. Bechtold , Curtis B. Johnson , Duncan S. Murchie , Daniel D. Kilker , Abanni B. Maxwell , Patrick H. Shannon , Gillian J. Madden
IPC分类号： G05F1/10
CPC分类号： E05B81/06 , E05B81/54 , E05B81/64
摘要： Latch control methods and systems are disclosed, including a latch that receives power from a motor associated with a latch. A sensor can be provided for monitoring the current consumption of the motor. A microcontroller can control the latch and/or the motor, based on the current consumption data received from the sensor concerning the current consumption of the motor. Monitoring of the current waveform of the motor therefore provides speed and direction feedback data for control of the latch. Additionally, a microprocessor can process instructions for controlling the interaction of the motor, the latch, the sensor and/or the microcontroller. Such a current monitoring control system is made possible by variation in current consumption of the motor during rotation as a result of commutation, which can be interrogated by measuring the voltage drop across the motor or a shunt resistor, or through the use of other current sensors, such as, for example, a Hall-effect type current sensor.
摘要翻译：公开了锁存控制方法和系统，包括从与锁存器相关联的电动机接收电力的锁存器。可以提供一个传感器来监测电机的电流消耗。微控制器可以基于从传感器接收的关于电动机的电流消耗的电流消耗数据来控制锁存器和/或电动机。因此，监测电动机的电流波形可提供用于控制锁存器的速度和方向反馈数据。此外，微处理器可以处理用于控制电动机，锁存器，传感器和/或微控制器的相互作用的指令。这种电流监视控制系统可以通过换向结果在旋转期间马达的电流消耗的变化成为可能，其可以通过测量电动机或分流电阻器上的电压降或通过使用其它电流传感器来询问，例如霍尔效应型电流传感器。

3. 发明授权

US07592204B2 Package design of small diameter sensor 失效
公开(公告)号：US07592204B2
公开(公告)日：2009-09-22
申请号：US11998730
申请日：2007-11-29
申请人： Aaron J. Meyers , William F. Eaton , Abannl B. Maxwell , Scott E. Michelhaugh
发明人： Aaron J. Meyers , William F. Eaton , Abannl B. Maxwell , Scott E. Michelhaugh
IPC分类号： H01L21/44
CPC分类号： G01R33/09
摘要： A small sensor assembly is produced by encapsulating an inner package within an outer package. The inner assembly can have electrical components and sensors attached to a lead frame. The electrical components can be protected within inner packages that have alignment indentations. The alignment indentations are positioned over the outside edges of the lead frame and, preferably, no electrical components directly underlie the alignment indentations. The inner assembly is held in alignment by movable pins within a mold into which plastic is flowed. The mold is configured to cause some of the plastic to set earlier than the rest of the plastic and to hold the inner assembly in alignment within the mold. The movable pins can be retracted once enough plastic has set to hold the inner assembly. Unset plastic can then flow into the alignment indentations. A sealed sensor assembly is formed once all the plastic has set.

4. 发明申请

US20090142857A1 Package design of small diameter sensor 失效
标题翻译：小直径传感器的封装设计
公开(公告)号：US20090142857A1
公开(公告)日：2009-06-04
申请号：US11998730
申请日：2007-11-29
申请人： Aaron J. Meyers , William F. Eaton , Abannl B. Maxwell , Scott E. Michelhaugh
发明人： Aaron J. Meyers , William F. Eaton , Abannl B. Maxwell , Scott E. Michelhaugh
IPC分类号： H01L21/56
CPC分类号： G01R33/09
摘要： A small sensor assembly is produced by encapsulating an inner package within an outer package. The inner assembly can have electrical components and sensors attached to a lead frame. The electrical components can be protected within inner packages that have alignment indentations. The alignment indentations are positioned over the outside edges of the lead frame and, preferably, no electrical components directly underlie the alignment indentations. The inner assembly is held in alignment by movable pins within a mold into which plastic is flowed. The mold is configured to cause some of the plastic to set earlier than the rest of the plastic and to hold the inner assembly in alignment within the mold. The movable pins can be retracted once enough plastic has set to hold the inner assembly. Unset plastic can then flow into the alignment indentations. A sealed sensor assembly is formed once all the plastic has set.
摘要翻译：通过将内包装封装在外包装中来生产小传感器组件。内部组件可以具有附接到引线框架的电气部件和传感器。电气部件可以在具有对准压痕的内部封装内被保护。对准凹口定位在引线框架的外边缘上方，并且优选地，没有电气部件直接位于对准凹槽的下面。内部组件通过可移动的销在塑料流入的模具内保持对准。模具被配置成使一些塑料比塑料的其余部分更早地设置并且将内部组件保持在模具内对准。一旦足够的塑料固定住内部组件，可移动销就可以缩回。然后将塑料脱模可以流入对齐凹口。一旦所有的塑料都固定，就形成一个密封的传感器组件。

5. 发明授权

US07387040B2 Methods and systems for mounting sensors for use in a harsh vibration environment 失效
标题翻译：用于安装传感器用于恶劣环境的方法和系统
公开(公告)号：US07387040B2
公开(公告)日：2008-06-17
申请号：US11207453
申请日：2005-08-19
申请人： William F. Eaton , Aaron J. Meyers
发明人： William F. Eaton , Aaron J. Meyers
IPC分类号： G01D3/036
CPC分类号： G12B9/08 , Y10T29/4987
摘要： A sensor is associated with a mounting surface. An O-ring is then positioned between the sensor and the mounting surface, such that the O-ring is compressible when the sensor is fixed to the mounting surface. A fixing mechanism is generally provided for permanently fixing the sensor to the mounting surface, such that the O-ring located between the sensor and the mounting surface provides a proper tension thereof which prevents the sensor from being adversely affected by vibration resulting from a harsh vibration environment in which the sensor operates. The fixing mechanism can be implemented as a fixing joint between the sensor and the mounting surface. Additionally, the O-ring and the sensor are configured with respect to one another and the mounting surface to maintain tension in the fixing joint.
摘要翻译：传感器与安装表面相关联。然后将O形环定位在传感器和安装表面之间，使得当传感器固定到安装表面时，O形环是可压缩的。通常设置固定机构用于将传感器永久地固定到安装表面，使得位于传感器和安装表面之间的O形环提供适当的张力，防止传感器受到由于刺激性振动引起的振动的不利影响传感器工作的环境。固定机构可以实现为传感器和安装表面之间的固定接头。此外，O形环和传感器相对于彼此和安装表面构造以保持固定接头中的张力。

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