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    • 6. 发明授权
    • Recording head compensation for tape shrinkage and expansion
    • 记录头补偿胶带收缩和扩张
    • US07193812B2
    • 2007-03-20
    • US10627079
    • 2003-07-25
    • James Howard Eaton
    • James Howard Eaton
    • G11B5/55G11B5/585
    • G11B5/584G11B5/127G11B15/62
    • A recording head to simultaneously read or write data to and from a plurality of tracks on magnetic tape, while compensating for shrinkage or expansion caused by moisture, temperature, creep caused by tension in the tape, creep caused by dimensional instability of the tape, as well as other causes. A recording head in accordance with the invention includes a leading module and a trailing module. In order to accommodate fluctuation in tape dimensions due to expansion or shrinkage, the leading and trailing modules may be offset with respect to one another. By offsetting one module with respect to the other, selected read and write elements from one module may more closely align with certain tracks of an expanded or shrunk tape, while other read and write elements from the other module may more closely align with other tracks on the tape.
    • 一种记录头,用于同时读取或写入磁带上的多个轨道的数据,同时补偿由水分,温度,由带中的张力引起的蠕变引起的收缩或膨胀,由带的尺寸不稳定引起的蠕变,如 以及其他原因。 根据本发明的记录头包括前导模块和拖尾模块。 为了适应由于膨胀或收缩引起的带尺寸的波动,前后模块可能相对于彼此偏移。 通过相对于另一个模块偏移一个模块,来自一个模块的所选择的读取和写入元件可以与扩展或收缩的带的某些轨道更紧密地对准,而来自另一个模块的其他读取和写入元件可以更紧密地与其他轨道对齐 磁带。
    • 8. 发明授权
    • Bidirectional flat contour linear tape recording head and drive
    • 双向扁平轮廓线性磁带记录头和驱动器
    • US5905613A
    • 1999-05-18
    • US896782
    • 1997-07-18
    • Robert Glenn BiskebornJames Howard Eaton
    • Robert Glenn BiskebornJames Howard Eaton
    • G11B15/60G11B15/64
    • G11B15/64G11B15/607
    • A bidirectional linear thin film tape head and drive are disclosed with a flat contour on a wear resistant ceramic substrate. At least one thin film transducer is provided on a side of the substrate, forming one edge to the flat transducing surface, and another edge is formed at the opposite side of the flat transducing surface. In one embodiment, both the transducer edge, with an alumina overcoat protecting the transducer, and the opposite edge of the flat transducing surface form outer tape path edges, and in another embodiment, the thin film transducer is protected by a ceramic closure that covers the thin film transducer and forms an extension to the flat transducing surface which provides an outer tape path edge. The edges remove the air entrained by the tape moving relative to the head in either direction to allow contact or near contact recording with the flat transducing surface.
    • 在耐磨陶瓷基板上公开了具有平坦轮廓的双向线性薄膜磁带头和驱动器。 至少一个薄膜换能器设置在基板的一侧上,在平面换能表面上形成一个边缘,另一个边缘形成在平面换能表面的相对侧。 在一个实施例中,换能器边缘与保护换能器的氧化铝外涂层以及平坦转换表面的相对边缘形成外带路径边缘,并且在另一个实施例中,薄膜换能器由覆盖 薄膜换能器并且形成到提供外带路径边缘的扁平换能表面的延伸。 边缘去除由磁带夹带的空气相对于磁头沿任一方向移动,以允许与平面传感表面接触或近接触记录。
    • 9. 发明授权
    • Embedded chip tape head
    • 嵌入式芯片磁带头
    • US08675310B2
    • 2014-03-18
    • US13557087
    • 2012-07-24
    • Robert Glenn BiskebornJames Howard Eaton
    • Robert Glenn BiskebornJames Howard Eaton
    • G11B5/105G11B5/187G11B5/265G11B15/60
    • G11B5/584
    • A tape drive system according to one embodiment includes a magnetic head. The magnetic head includes first and second beams each having a tape bearing surface, a face, a recess in the tape bearing surface thereof, the faces of the beams facing either towards each other or away from each other; a first chip being positioned in the recess of the first beam; and a second chip being positioned in the recess of the second beam, wherein each chip has circuitry selected from a group consisting of read elements, write elements, and combinations thereof, wherein a tape bearing surface of each chip is generally aligned with the tape bearing surface of the associated beam, and wherein an end of each chip is generally aligned with the face of the associated beam. The system also includes a drive mechanism and a controller.
    • 根据一个实施例的磁带驱动系统包括磁头。 磁头包括第一和第二梁,每个梁具有带支承表面,一个表面,在该带支承表面中的一个凹槽,该梁的表面朝向彼此或彼此远离; 第一芯片定位在第一光束的凹部中; 并且第二芯片定位在第二光束的凹槽中,其中每个芯片具有选自由读取元件,写入元件及其组合组成的组的电路,其中每个芯片的带承载表面大致与带状轴承 相关联的光束的表面,并且其中每个芯片的端部通常与相关联的光束的面对齐。 该系统还包括一个驱动机构和一个控制器。