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1. 发明授权

US11691004B2 Device for extravasal or extraneuronal fastening of a medical implant in the manner of a compression sleeve 有权
公开(公告)号：US11691004B2
公开(公告)日：2023-07-04
申请号：US17056345
申请日：2019-05-07
申请人： Neuroloop GmbH
发明人： Dennis Plachta , Tim Boretius , Fabian Kimmig , Christina Hassler
IPC分类号： A61N1/05
CPC分类号： A61N1/0556
摘要： A device for the extravasal or extraneuronal fastening of a medical implant has a biocompatible surface substrate including a first substrate portion which is a compression sleeve and a free end portion. By winding the first substrate portion about a spatial axis, the axis is loosely radially covered in at least one layer by the wound first substrate portion. A second substrate portion, which is attached integrally to the first substrate portion which is not wound about the spatial axis, has a connection extending away from the medical implant.

2. 发明授权

US11247042B2 Implantable electrical contact arrangement 有权
公开(公告)号：US11247042B2
公开(公告)日：2022-02-15
申请号：US16461656
申请日：2017-11-17
申请人： Neuroloop GmbH
发明人： Tim Boretius , Fabian Kimmig , Christina Sebastian Hassler , Dennis Plachta
IPC分类号： A61N1/05 , A61N1/375 , A61N1/36
摘要： An implantable electrical contact arrangement is described which has at least one electrode body arrangement composed otherwise entirely of biocompatible, electrically insulating material, with at least one freely accessible electrode surface enclosed directly or indirectly by the biocompatible electrically insulating material. The invention is characterized in that the electrode body arrangement has a stack-shaped layer composite which provides at least one gold layer connected to an iridium layer via a diffusion barrier layer. The stack-shaped layer composite by being completely encapsulated by an SiC layer, with the exception of at least one surface region of the iridium layer facing to be directed away from the layer composite. The SiC layer has an SiC layer surface which is facing to be directed away from the stack-shaped layer composite and which is adjoined directly or indirectly by the biocompatible, electrically insulating material.

3. 发明授权

US11813061B2 Implantable electric multi-pole connection structure 有权
公开(公告)号：US11813061B2
公开(公告)日：2023-11-14
申请号：US16461962
申请日：2017-11-17
申请人： Neuroloop GmbH
发明人： Fabian Kimmig , Tim Boretius , Dennis Plachta
IPC分类号： A61N1/00 , A61B5/24 , A61N1/05 , A61N1/36 , A61N1/375
CPC分类号： A61B5/24 , A61N1/0556 , A61N1/36125 , A61N1/3752 , A61B2562/222
摘要： The invention relates to an implantable electric multi-pole connection between an electric implant and an electric feed and discharge structure. The invention is characterised in that a flexible, film-like, electrically non-conductive, strip-shaped surface element is arranged between the implant and the feed and discharge structure. The surface element comprises at least one first surface, on which a number of electrodes n greater than of equal to two is arranged, which are respectively connected to the electric implant by means of electric connection conductors extending at least in parts inside the surface element. The electric feed and discharge structure comprises at least n lines which are electrically insulated from each other and which are electrically connected to one of the n electrodes. The strip-shaped surface element is wound around a winding axis, which adopts the shape of a helix, along a cover surface of a virtual cylinder provided with a cylinder axis which is straight or curved at least in sections.

4. 发明授权

US11541230B2 Implantable electric connecting structure between an electric implant and an electric feed and drain line structure 有权
公开(公告)号：US11541230B2
公开(公告)日：2023-01-03
申请号：US16620695
申请日：2018-05-28
申请人： Neuroloop GmbH
发明人： Dennis Plachta , Fabian Kimmig , Tim Boretius
IPC分类号： A61N1/05 , H01R13/24 , H01R13/58
摘要： The invention is an implantable electrical connection between an electrical implant which has at least one electrical conductor and at least one electrical feed line. The invention further relates to a method for producing an implantable electrical connection between an electrical implant. The invention comprises at least one electrical cable having a cable end, to which an electrically conductive flat piece is unsupportedly fined, and that the at least one implant-side electrical conductor is joined to the flat piece.

5. 发明申请

US20210016081A1 IMPLANT IN THE FORM OF A WOUND CUFF ELECTRODE ASSEMBLY 有权
公开(公告)号：US20210016081A1
公开(公告)日：2021-01-21
申请号：US16981604
申请日：2019-02-26
申请人： Neuroloop GmbH
发明人： Tim BORETIUS , Dennis Plachta , Fabian KIMMIG
IPC分类号： A61N1/05 , A61N1/375
摘要： The invention has a contact assembly including a spatial longitudinal extension which is orientated parallel to the winding axis. The contact assembly is fixedly joined to the carrier substrate along a joining region which has a joining region length orientated in parallel to the winding axis. The orthogonal projection relative to the winding axis overlaps with a first region of the carrier substrate which is wound into a tube.

6. 发明授权

US11712558B2 Medical implant of the type of a wrap-around cuff electrode assembly 有权
公开(公告)号：US11712558B2
公开(公告)日：2023-08-01
申请号：US17266363
申请日：2019-08-05
申请人： Neuroloop GmbH
发明人： Dennis Plachta , Fabian Kimmig , Tim Boretius
IPC分类号： A61N1/05 , A61N1/36
CPC分类号： A61N1/0556 , A61N1/3605
摘要： The invention is a medical implant which is a wrap-around cuff comprising a flexible, biocompatible, film carrier substrate, that has a carrier substrate region which is wrapped around a wrap axis to form a tube. The invention has a protective structure directly or indirectly attached to the carrier substrate, which can be transformed from a first, open state into a second closed state that encloses the carrier substrate region that is wrapped to form a tube at least axially around a wrapping axis extending in the peripheral direction of the tube.

7. 发明授权

US11224749B2 Implantable assembly 有权
公开(公告)号：US11224749B2
公开(公告)日：2022-01-18
申请号：US16743065
申请日：2020-01-15
申请人： Neuroloop GmbH
发明人： Dennis Plachta , Mortimer Giehrtmuehlen , Thomas Stieglitz , Josef Zentner
IPC分类号： A61N1/36 , A61N1/372 , A61N1/378 , A61N1/05
摘要： An implantable assembly is described for acquisition of neuronal electrical signals at a selected location which propagate along at least one nerve fiber contained in a nerve fiber bundle, as well as for selective electrical stimulation of the at least one nerve fiber, having: an implantable electrode assembly (E) which is disposed on a biocompatible support substrate which can be positioned around the nerve fiber bundle in a cuff. The cuff has a cylindrical support substrate surface (i) which in the implanted condition is orientated facing the nerve fiber bundle, on which a first electrode assembly for locationally selective acquisition of the neuronal electrical signals and selective electrical stimulation of the at least one nerve fiber, and on which a second electrode assembly is disposed to record an ECG signal, and an analysis and control unit (A/S) which can be electrically conductively connected or is connected to the implantable electrode assembly (E), in which the locationally selective acquired neuronal electrical signals as well as the ECG signal can be analyzed in a time-resolved manner such that a neuronal time signal correlated with a physiological parameter, such as blood pressure, can be derived.

8. 发明授权

US11850419B2 Implantable electrode arrangement 有权
公开(公告)号：US11850419B2
公开(公告)日：2023-12-26
申请号：US15517903
申请日：2015-10-07
申请人： Neuroloop GmbH
发明人： Dennis Plachta , Mortimer Giehrtmuehlen , Thomas Stieglitz , Josef Zentner
IPC分类号： A61N1/05 , A61B5/24
CPC分类号： A61N1/0556 , A61B5/24 , A61B2562/066 , A61B2562/164
摘要： An implantable electrode arrangement provides spatially-selective detection of neuronal electrical signals, which propagate along at least one nerve fiber contained in a nerve fascicle, and for selective electrical stimulation of the at least one nerve fiber, comprising a biocompatible carrier substrate, which has at least one carrier substrate region that can be placed around the nerve fascicle in a cuff and has a straight cylinder-shaped carrier substrate surface which faces the nerve fascicle in the implanted state. The carrier substrate surface has an axial extension and an extension oriented circumferentially in a direction and a first electrode arrangement attached thereto. The electrode arrangement comprises in an axial sequence, at least three first electrode structures with at least two first electrode surfaces arranged in the circumferentially, and at least two spaced first electrode strips, displayed in the axial direction which extend circumferentially which are in a ring shape, which encloses the at least three electrode structures on both sides in the axial direction. The electrodes are connectable or are connected to a signal detector and generator.

9. 发明授权

US11478635B2 Implant in the form of a wound cuff electrode assembly 有权
公开(公告)号：US11478635B2
公开(公告)日：2022-10-25
申请号：US16981604
申请日：2019-02-26
申请人： Neuroloop GmbH
发明人： Tim Boretius , Dennis Plachta , Fabian Kimmig
IPC分类号： A61N1/05 , A61N1/375 , A61N1/36
摘要： The invention has a contact assembly including a spatial longitudinal extension which is orientated parallel to the winding axis. The contact assembly is fixedly joined to the carrier substrate along a joining region which has a joining region length orientated in parallel to the winding axis. The orthogonal projection relative to the winding axis overlaps with a first region of the carrier substrate which is wound into a tube.

10. 发明授权

US11123000B2 Digital biopotential acquisition system having 8 channels 有权
公开(公告)号：US11123000B2
公开(公告)日：2021-09-21
申请号：US16078541
申请日：2017-02-22
申请人： Neuroloop GmbH
发明人： Matthias Kuhl , Yiannos Manoli , Dennis Plachta , Thomas Stieglitz , Oscar Cota
IPC分类号： A61B5/24 , A61B5/00 , A61B5/333 , A61B5/389 , H03F3/45
摘要： A biocompatible recording system includes a number of input channels for acquiring electronic information from the neural system of a living being. The recording system includes a preamplifier and further amplifier stages. An input of a second amplifier stage is coupled to an output of the preamplifier. A low-pass filter having a capacitance multiplier is connected to the second amplifier stage. The preamplifier of the recording system is designed using P-MOS technology.

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