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    • 4. 发明授权
    • Pressure-controlled steam oven for asymptotic temperature control of continuous feed media
    • 压力控制蒸汽烘箱,用于连续进料介质的渐近温度控制
    • US07890043B2
    • 2011-02-15
    • US11959406
    • 2007-12-18
    • David K. BiegelsenAshish PattekarArmin R. VolkelLars-Erik Swartz
    • David K. BiegelsenAshish PattekarArmin R. VolkelLars-Erik Swartz
    • G03G15/20
    • G03G15/2003H05K1/189H05K3/32H05K2203/074H05K2203/1105
    • A non-atmospheric pressure vapor oven system that utilizes a controllable pressure zone to facilitate fast phase change heat transfer at any desired temperature to heat or cool flat substrates, and to level temperatures across different locations of the substrates. The system enables the use of a heat transfer fluid, such as water, without being limited to a particular temperature, such as the fluid's natural boiling point at atmospheric pressure. The system includes a vapor oven (hermetic enclosure) defining a pressure chamber having sealed entry and exit ports for transferring an object (e.g., a sheet of paper) with added material (e.g., toner) through the pressure chamber, and a pressure regulation apparatus for setting the saturation temperature (boiling point) of heat transfer fluid inside the vapor oven to an optimal heating/cooling temperature by selectively controlling the pressure inside the hermetic enclosure.
    • 非大气压蒸气烘箱系统,其利用可控压力区域来促进在任何期望温度下的快速相变热传递以加热或冷却平坦的基板,以及跨越基板的不同位置的水平温度。 该系统能够使用诸如水的传热流体,而不限于特定温度,例如在大气压下的流体的天然沸点。 该系统包括蒸气烘箱(气密封壳),其限定具有密封入口和出口的压力室,用于通过压力室传送具有添加材料(例如调色剂)的物体(例如,一张纸)和压力调节装置 通过选择性地控制密封外壳内的压力,将蒸气烘箱内的传热流体的饱和温度(沸点)设定为最佳加热/冷却温度。
    • 5. 发明申请
    • Preheating of Marking Material-Substrate Interface for Printing and the Like
    • 标记材料的预热 - 印刷等基板接口
    • US20120045258A1
    • 2012-02-23
    • US12861750
    • 2010-08-23
    • David K. BiegelsenAshish Pattekar
    • David K. BiegelsenAshish Pattekar
    • G03G15/16
    • G03G15/1695G03G2215/168G03G2215/1685G03G2215/1695
    • Substrate (or marking material) pre-heating is employed to facilitate fusing of the marking material with the substrate and with adjacent marking material. By heating primarily the material which becomes the interface between substrate and marking material, and by minimizing the distance between the point of heat application to the substrate (or marking material) and the marking nip in a print system, the amount of time for heat energy to dissipate prior to the application of the marking material to the substrate surface is minimized, meaning that the total amount of energy required to drive the heat source can be reduced. Addressable heating may be employed to further reduce energy consumption. Furthermore, optical heating may be used to provide rapid, on-demand heating, thereby reducing warm-up time as well as reducing unutilized heat energy.
    • 采用衬底(或标记材料)预热来促进标记材料与衬底和相邻标记材料的融合。 通过主要加热成为基材和标记材料之间的界面的材料,并且通过最小化在印刷系统中施加到基材(或标记材料)和标记辊隙的热点之间的距离,热能的时间量 在将标记材料施加到基板表面之前消散,这意味着可以减少驱动热源所需的总能量。 可以采用可寻址加热来进一步降低能量消耗。 此外,可以使用光学加热来提供快速的按需加热,从而减少预热时间以及减少未使用的热能。
    • 7. 发明申请
    • Pressure-Controlled Steam Oven For Asymptotic Temperature Control Of Continuous Feed Media
    • 压力控制蒸汽烤箱用于连续进料介质的渐近温度控制
    • US20090154969A1
    • 2009-06-18
    • US11959406
    • 2007-12-18
    • David K. BiegelsenAshish PattekarArmin R. VolkelLars-Erik Swartz
    • David K. BiegelsenAshish PattekarArmin R. VolkelLars-Erik Swartz
    • G03G15/20
    • G03G15/2003H05K1/189H05K3/32H05K2203/074H05K2203/1105
    • A non-atmospheric pressure vapor oven system that utilizes a controllable pressure zone to facilitate fast phase change heat transfer at any desired temperature to heat or cool flat substrates, and to level temperatures across different locations of the substrates. The system enables the use of a heat transfer fluid, such as water, without being limited to a particular temperature, such as the fluid's natural boiling point at atmospheric pressure. The system includes a vapor oven (hermetic enclosure) defining a pressure chamber having sealed entry and exit ports for transferring an object (e.g., a sheet of paper) with added material (e.g., toner) through the pressure chamber, and a pressure regulation apparatus for setting the saturation temperature (boiling point) of heat transfer fluid inside the vapor oven to an optimal heating/cooling temperature by selectively controlling the pressure inside the hermetic enclosure.
    • 非大气压蒸气烘箱系统,其利用可控压力区域来促进在任何期望温度下的快速相变热传递以加热或冷却平坦的基板,以及跨越基板的不同位置的水平温度。 该系统能够使用诸如水的传热流体,而不限于特定温度,例如在大气压下的流体的天然沸点。 该系统包括蒸气烘箱(气密封壳),其限定具有密封入口和出口的压力室,用于通过压力室传送具有添加材料(例如调色剂)的物体(例如,一张纸)和压力调节装置 通过选择性地控制密封外壳内的压力,将蒸气烘箱内的传热流体的饱和温度(沸点)设定为最佳加热/冷却温度。
    • 9. 发明授权
    • Electrostatically addressable microvalves
    • 静电寻址微型阀
    • US08561963B2
    • 2013-10-22
    • US11959778
    • 2007-12-19
    • Ashish PattekarEugene M ChowEric Peeters
    • Ashish PattekarEugene M ChowEric Peeters
    • F16K31/128
    • F16K99/0001B01L3/502738B01L2200/12B01L2300/0819B01L2300/0887B01L2400/0655F16K99/0026Y10T137/0318Y10T137/0391Y10T137/87249
    • An improved microvalve is described. The microvalve includes a corresponding actuation aperture in an actuation aperture layer. A control fluid flows through the actuation aperture. The flow of the control fluid is controlled by an electric field typically applied via a charge distribution near an actuation aperture layer. In one embodiment, the electric field may adjust the opening and closing of the actuation aperture thereby controlling the flow of the control fluid. In a second embodiment, the control fluid is an electrorheological fluid where the electric field controls the viscosity of the ER fluid thereby controlling fluid flow through the actuation aperture. In both embodiments the flow of the control fluid controls stretching of a flexible membrane formed along the wall of a conduit through which a fluid to be controlled flows. The stretching of the flexible membrane controlling the flow of the main fluid to be controlled.
    • 描述了改进的微型阀。 微型阀包括致动孔层中相应的致动孔。 控制流体流过致动孔。 控制流体的流动由通常通过致动孔层附近的电荷分布施加的电场来控制。 在一个实施例中,电场可以调节致动孔的打开和关闭,从而控制控制流体的流动。 在第二实施例中,控制流体是电流变流体,其中电场控制ER流体的粘度,从而控制通过致动孔的流体流动。 在两个实施例中,控制流体的流动控制沿导管的壁形成的柔性膜的拉伸,待控制的流体通过该壁流动。 柔性膜的拉伸控制要控制的主流体的流动。