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    • 3. 发明申请
    • METHOD FOR FORMING WIRING
    • 形成接线方法
    • US20170020006A1
    • 2017-01-19
    • US15125037
    • 2015-03-05
    • National University Corporation Yamagata University
    • Daisuke KUMAKIShizuo TOKITOYu KOBAYASHIShohei NORITA
    • H05K3/40
    • H05K3/4038H01L21/76802H01L23/5226H05K1/092H05K3/105H05K3/4069Y10T29/49124
    • A method for forming a wiring according to the present invention includes: applying an ink (6) that exhibits electrical conductivity upon light absorption to a contact hole formation portion of an upper face of an insulating resin layer (3) formed on a lower wiring element (2); and irradiating the ink (6) with light to render the ink (6) conductive and also to remove a part of the insulating resin layer (3) by heat emitted from the ink (6) so as to form a contact hole (5), the part of the insulating resin layer (3) lying under the portion of the face to which the ink (6) is applied. A step of forming an upper wiring element (4) on the upper face of the insulating resin layer (3) may further be carried out, the upper wiring element (4) being electrically continuous with the lower wiring element (2) through the contact hole (5).
    • 根据本发明的形成布线的方法包括:将形成在下布线元件上的绝缘树脂层(3)的上表面的接触孔形成部分的光吸收时呈现导电性的墨(6) (2); 并用光照射油墨以使油墨(6)导电,并且还通过从油墨(6)发出的热量去除绝缘树脂层(3)的一部分,从而形成接触孔(5) 绝缘树脂层(3)的位于涂布有油墨(6)的面部的下方的部分。 还可以在绝缘树脂层(3)的上表面上形成上配线元件(4)的步骤,上布线元件(4)通过触点与下布线元件(2)电连接 孔(5)。