专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20150245946A1 METHOD OF POSITIONING AN INTRAOCULAR DEVICE 审中-公开
标题翻译：定位内镜装置的方法
公开(公告)号：US20150245946A1
公开(公告)日：2015-09-03
申请号：US14713998
申请日：2015-05-15
申请人： The University of Melbourne , National ICT Australia Limited
发明人： Kate Fox , David Garrett , Kumaravelu Ganesan , Hamish Meffin , Steven Prawer
IPC分类号： A61F9/00
CPC分类号： A61F9/0017 , A61F2/14 , A61F9/007 , A61F2210/009 , A61F2220/0008
摘要： A method of positioning an intraocular device at an intraocular position is provided. The method comprises providing a first and a second element selected such that a magnetic force attracts the first element and the second element to each other. The method also comprises positioning the first element in a suprachoroidal space of an eye and positioning the intraocular device in an intraocular space at a portion of tissue of the eye. The method further comprises positioning the second element in the intraocular space of the eye. The first element, the second element and the intraocular device are positioned such that the portion of the tissue of the eye and at least a portion of the intraocular device are positioned between the first and second elements such that the magnetic force at least contributes to securing the intraocular device at the portion of the tissue of the eye.
摘要翻译：提供了一种将眼内装置定位在眼内位置的方法。该方法包括提供选择的第一和第二元件，使得磁力将第一元件和第二元件彼此吸引。该方法还包括将第一元件定位在眼睛的脉络膜上空间中，并将眼内装置定位在眼睛组织部分的眼内空间中。该方法还包括将第二元件定位在眼睛的眼内空间中。第一元件，第二元件和眼内装置被定位成使得眼睛的组织的部分和眼内装置的至少一部分位于第一和第二元件之间，使得磁力至少有助于固定在眼睛组织部分处的眼内装置。

2. 发明申请

US20140094885A1 ELECTRODE AND A FEEDTHROUGH FOR MEDICAL DEVICE APPLICATIONS 有权
标题翻译：电极和用于医疗设备应用的馈线
公开(公告)号：US20140094885A1
公开(公告)日：2014-04-03
申请号：US14095459
申请日：2013-12-03
申请人： National ICT Australia Limited , The University of Melbourne
发明人： Hamish Meffin , Kate Fox , David Garrett , Kumaravelu Ganesan , Steven Prawer , Samantha Lichter , Igor Aharonovich
IPC分类号： A61N1/05
CPC分类号： A61N1/05 , A61N1/0529 , A61N1/0543 , A61N1/0551 , A61N1/3754 , Y10T29/49165 , Y10T29/49204
摘要： The present disclosure provides an electrode and an feedthrough for an implantable medical device. In one embodiment, the implantable electrode and the implantable feedthrough both comprise electrically insulating diamond material and electrically conductive diamond material that form an interface. Further, the present disclosure provides method for fabricating the implantable electrode and the feedthrough.
摘要翻译：本公开提供了一种用于可植入医疗装置的电极和馈通件。在一个实施例中，可植入电极和可植入馈通两者均包括形成界面的电绝缘金刚石材料和导电金刚石材料。此外，本公开提供了制造可植入电极和馈通的方法。

3. 发明授权

US09867286B2 Circuit board comprising an insulating diamond material 有权
公开(公告)号：US09867286B2
公开(公告)日：2018-01-09
申请号：US14901008
申请日：2014-06-25
申请人： National ICT Australia Limited , THE UNIVERSITY OF MELBOURNE
发明人： Samantha Lichter , Nicholas Apollo , David Garrett , Kumaravelu Ganesan , Hamish Meffin , Steven Prawer
IPC分类号： A61N1/375 , H05K1/03 , H01L23/14 , H01L23/053 , H05K1/09 , H05K3/10 , A61N1/36 , H05K1/11 , H05K3/00 , H05K3/14 , A61N1/05
CPC分类号： H05K1/0306 , A61N1/0543 , A61N1/36046 , H01L23/053 , H01L23/14 , H01L2224/14 , H01L2224/17 , H01L2924/0002 , H05K1/09 , H05K1/111 , H05K3/0044 , H05K3/107 , H05K3/146 , H05K2201/0323 , H05K2201/0376 , H01L2924/00
摘要： A circuit board is described. The circuit board comprises an electrically insulating diamond material having a surface. The electrically insulating diamond material has at least one recess extending into only a portion of a thickness of the electrically insulating diamond material from the surface of the electrically insulating diamond material. The circuit board also comprises an electrically conductive material located at least partially within the recess.

4. 发明授权

US09381341B2 Electrically conductive implantable medical device 有权
标题翻译：导电植入医疗器械
公开(公告)号：US09381341B2
公开(公告)日：2016-07-05
申请号：US14095459
申请日：2013-12-03
申请人： The University of Melbourne , National ICT Australia Limited
发明人： Hamish Meffin , Kate Fox , David Garrett , Kumaravelu Ganesan , Steven Prawer , Samantha Lichter , Igor Aharonovich
IPC分类号： A61N1/05 , A61N1/375
CPC分类号： A61N1/05 , A61N1/0529 , A61N1/0543 , A61N1/0551 , A61N1/3754 , Y10T29/49165 , Y10T29/49204
摘要： The present disclosure provides an electrode and an feedthrough for an implantable medical device. In one embodiment, the implantable electrode and the implantable feedthrough both comprise electrically insulating diamond material and electrically conductive diamond material that form an interface. Further, the present disclosure provides method for fabricating the implantable electrode and the feedthrough.
摘要翻译：本公开提供了一种用于可植入医疗装置的电极和馈通件。在一个实施例中，可植入电极和可植入馈通两者均包括形成界面的电绝缘金刚石材料和导电金刚石材料。此外，本公开提供了制造可植入电极和馈通的方法。

5. 发明授权

US10543372B2 Method of forming an enclosure 有权
公开(公告)号：US10543372B2
公开(公告)日：2020-01-28
申请号：US15522632
申请日：2015-10-28
申请人： THE UNIVERSITY OF MELBOURNE , NATIONAL ICT AUSTRALIA LIMITED
发明人： Steven Prawer , Kumaravelu Ganesan , David Garrett , Nicholas Apollo , Alastair Stacey , Mathilde Escudie , Hamish Meffin , Samantha Lichter
IPC分类号： A61N1/375 , B23K35/30 , B23K26/21 , B23K26/364 , B23K1/00 , B23K1/19 , B23K103/00 , A61N1/36
摘要： The present disclosure provides a method of forming a hermetically sealed enclosure that comprises a diamond material. The method comprises providing first and second enclosure components comprising the diamond material and having first and second recesses, respectively, at edge portions. At least one of the first and second enclosure components has a cavity. The enclosure components have respective contact surfaces at the first and second recesses and are shaped such that an outer channel is formed by the co-operation of the first and second recesses when the first and second enclosure components are contacted at the contact surfaces to form the enclosure. The method further comprises bonding a first type of material to at least surface portions of the first and second recesses of the first and second enclosure components, respectively. The method also comprises bonding a second type of material to the first type of material so that the second type of material covers at least portions of the first type of material. The second type of material is biocompatible and suitable for forming a hermetically sealed seal. In addition, the method comprises contacting the enclosure components to form the enclosure and bonding the second type of material of the first enclosure component to the second type of material of the second enclosure component so as to form a hermetically sealed seal in the outer channel.

6. 发明申请

US20160157342A1 A CIRCUIT BOARD COMPRISING AN INSULATING DIAMOND MATERIAL 有权
标题翻译：包含绝缘金刚石材料的电路板
公开(公告)号：US20160157342A1
公开(公告)日：2016-06-02
申请号：US14901008
申请日：2014-06-25
申请人： THE UNIVERSITY OF MELBOURNE , NATIONAL ICT AUSTRALIA LIMITED
发明人： Samantha Lichter , Nicholas Apollo , David Garrett , Kumaravelu Ganesan , Hamish Meffin , Steven Prawer
IPC分类号： H05K1/03 , H05K3/10 , A61N1/36 , H05K3/14 , H05K1/11 , H05K1/09 , H05K3/00
CPC分类号： H05K1/0306 , A61N1/0543 , A61N1/36046 , H01L23/053 , H01L23/14 , H01L2224/14 , H01L2224/17 , H01L2924/0002 , H05K1/09 , H05K1/111 , H05K3/0044 , H05K3/107 , H05K3/146 , H05K2201/0323 , H05K2201/0376 , H01L2924/00
摘要： A circuit board is described. The circuit board comprises an electrically insulating diamond material having a surface. The electrically insulating diamond material has at least one recess extending into only a portion of a thickness of the electrically insulating diamond material from the surface of the electrically insulating diamond material. The circuit board also comprises an electrically conductive material located at least partially within the recess.
摘要翻译：描述电路板。电路板包括具有表面的电绝缘金刚石材料。电绝缘金刚石材料具有至少一个从电绝缘金刚石材料的表面延伸到电绝缘金刚石材料的厚度的一部分的凹部。电路板还包括至少部分地位于凹部内的导电材料。

7. 发明申请

US20170312528A1 A METHOD OF FORMING AN ENCLOSURE 审中-公开
公开(公告)号：US20170312528A1
公开(公告)日：2017-11-02
申请号：US15522632
申请日：2015-10-28
申请人： THE UNIVERSITY OF MELBOURNE , NATIONAL ICT AUSTRALIA LIMITED
发明人： Steven Prawer , Kumaravelu Ganesan , David Garrett , Nicholas Apollo , Alastair Stacey , Mathilde Escudie , Hamish Meffin , Samantha Lichter
IPC分类号： A61N1/375 , B23K35/30 , B23K1/19 , B23K1/00 , B23K26/364 , B23K26/21 , A61N1/36 , B23K103/00
CPC分类号： A61N1/375 , A61N1/36046 , B23K1/0016 , B23K1/19 , B23K26/21 , B23K26/364 , B23K35/0222 , B23K35/0238 , B23K35/0255 , B23K35/3006 , B23K35/3013 , B23K2103/50
摘要： The present disclosure provides a method of forming a hermetically sealed enclosure that comprises a diamond material. The method comprises providing first and second enclosure components comprising the diamond material and having first and second recesses, respectively, at edge portions. At least one of the first and second enclosure components has a cavity. The enclosure components have respective contact surfaces at the first and second recesses and are shaped such that an outer channel is formed by the co-operation of the first and second recesses when the first and second enclosure components are contacted at the contact surfaces to form the enclosure. The method further comprises bonding a first type of material to at least surface portions of the first and second recesses of the first and second enclosure components, respectively. The method also comprises bonding a second type of material to the first type of material so that the second type of material covers at least portions of the first type of material. The second type of material is biocompatible and suitable for forming a hermetically sealed seal. In addition, the method comprises contacting the enclosure components to form the enclosure and bonding the second type of material of the first enclosure component to the second type of material of the second enclosure component so as to form a hermetically sealed seal in the outer channel.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式