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1. 发明授权

US6124695A Cartesian coordinates robot 失效
标题翻译：笛卡尔坐标机器人
公开(公告)号：US6124695A
公开(公告)日：2000-09-26
申请号：US269059
申请日：1999-03-18
申请人： Naoyuki Kitamura , Mamoru Inoue , Akira Kabeshita , Takeshi Takeda
发明人： Naoyuki Kitamura , Mamoru Inoue , Akira Kabeshita , Takeshi Takeda
IPC分类号： B25J9/02 , H05K13/04 , B64C17/06
CPC分类号： H05K13/04 , B25J9/026 , F16C29/001 , F16C29/008
摘要： Provided is a rectangular coordinate type robot, in which spaced-apart first tables are provided with respective first moving units that are guided along the first tables, and a second table has its one end connected to the first moving unit provided for one of the first tables and the other end connected to the first moving unit provided for the other first table. The end portions of the second table and the first moving units are connected with each other via connecting members that have a rigidity in the movement direction of the first moving unit and a resiliency in the direction extending along the second table.
摘要翻译： PCT No.PCT / JP97 / 03256 Sec。 371 1999年3月18日 102（e）1999年3月18日PCT 1997年9月16日PCT公布。出版物WO98 / 1202400 日期1998年3月26日提供了一种直角坐标型机器人，其中间隔开的第一台设置有沿着第一台引导的相应的第一移动单元，第二台具有连接到第一移动单元的第一台，对于第一台中的一个，另一端连接到为另一个第一台提供的第一移动单元。第二台和第一移动单元的端部通过在第一移动单元的移动方向上具有刚性的连接构件和沿着第二台延伸的方向的弹性彼此连接。

2. 发明授权

US06266873B1 Method and apparatus for mounting electronic components 有权
标题翻译：用于安装电子部件的方法和装置
公开(公告)号：US06266873B1
公开(公告)日：2001-07-31
申请号：US09367514
申请日：1999-11-18
申请人： Naoyuki Kitamura , Osamu Okuda , Akira Kabeshita , Takeshi Takeda
发明人： Naoyuki Kitamura , Osamu Okuda , Akira Kabeshita , Takeshi Takeda
IPC分类号： H05K330
CPC分类号： H05K13/0452 , H05K13/0409 , H05K13/041 , H05K13/0413 , H05K13/085 , Y10S29/044 , Y10T29/4913 , Y10T29/49139 , Y10T29/53174 , Y10T29/53178 , Y10T29/53183 , Y10T29/53191
摘要： Method and apparatus for mounting electronic components in which components are efficiently fed and transferred for enhancing productivity is provided. Tray draw-out device (6) is disposed at a component feeding unit (4) for pulling out a tray (3) accommodating electronic components (2) from the component feeding unit (4) to a given pick-up position, where the electronic components (2) are transferred by the transfer mechanism (11) on to a temporary holder (8) disposed on a draw-out arm (7) of the tray draw-out device (6). Mounting head (5) has a plurality of mounting nozzles (5a), with which the mounting head (5) picks up several electronic components (2) aligned on the temporary holder (8) at a time and mount them on to a circuit board (1) which has been loaded and located at a prescribed position.
摘要翻译：提供了用于安装电子部件的方法和装置，其中部件被有效地进给和传送以提高生产率。托盘拉出装置（6）设置在用于将容纳电子部件（2）的托盘（3）从部件供给单元（4）拉出到给定的拾取位置的部件供给单元（4）处，其中电子部件（2）通过传送机构（11）传送到设置在托盘拉出装置（6）的拉出臂（7）上的临时保持器（8）。安装头（5）具有多个安装喷嘴（5a），安装头（5）通过该安装喷嘴（5）一次拾取与临时保持器（8）对准的几个电子部件（2），并将其安装到电路板（1）已被装载并位于规定位置。

3. 发明授权

US07231709B2 Component mounting apparatus 失效
标题翻译：组件安装设备
公开(公告)号：US07231709B2
公开(公告)日：2007-06-19
申请号：US11431751
申请日：2006-05-11
申请人： Noriaki Yoshida , Takeshi Takeda , Akira Kabeshita
发明人： Noriaki Yoshida , Takeshi Takeda , Akira Kabeshita
IPC分类号： B23P19/00
CPC分类号： H05K13/0413 , H05K13/0815 , Y10T29/49004 , Y10T29/4913 , Y10T29/49133 , Y10T29/53052 , Y10T29/53174 , Y10T29/53178 , Y10T29/53191
摘要： In accordance with a component mounting apparatus, a component stored in a component feeder is held by a component holding member and is then mounted in a mounting position on an object. The apparatus functions to, when a mounting posture of the component in which the component is mounted onto the object is inclined with respect to a basic posture of the component by a mounting angle, hold the component from the component feeder by the component holding member that has preliminarily been rotated to the mounting angle in such a direction as to depart from a reference posture of the component holding member prior to the mounting of the component on the object. And afterwards, the component holding member is rotated in a specified direction to finally return the component holding member to the reference posture, and then the component is mounted on the object.
摘要翻译：根据部件安装装置，存储在部件供给器中的部件由部件保持部件保持，然后安装在物体上的安装位置。该装置用于当将部件安装到物体上的部件的安装姿势相对于部件的基本姿势倾斜安装角度时，通过部件保持部件将部件从部件供给器保持，在将部件安装在物体上之前，已经预先沿着防止部件保持部件的基准姿势的方向旋转到安装角度。然后，使部件保持部件沿指定方向旋转，最终将部件保持部件返回到基准姿势，然后将部件安装在被检体上。

4. 发明授权

US06314640B1 Component mounting method 失效
标题翻译：组件安装方法
公开(公告)号：US06314640B1
公开(公告)日：2001-11-13
申请号：US08996907
申请日：1997-12-23
申请人： Noriaki Yoshida , Takeshi Takeda , Akira Kabeshita
发明人： Noriaki Yoshida , Takeshi Takeda , Akira Kabeshita
IPC分类号： H05K330
CPC分类号： H05K13/0413 , H05K13/0815 , Y10T29/49004 , Y10T29/4913 , Y10T29/49133 , Y10T29/53052 , Y10T29/53174 , Y10T29/53178 , Y10T29/53191
摘要： In accordance with a component mounting method, a component stored in a component feeder is held by a component holding member and then is mounted in a mounting position on n object. The method includes, when a mounting posture of the component in which the component is mounted onto the object is inclined with respect to a basic posture of the component by a mounting angle, the operation of holding the component from the component feeder by the component holding member that has preliminarily been rotated to the mounting angle in such a direction as to depart from a reference posture of the component holding member prior to the mounting of the component on the object. And afterwards, the component holding member is rotated in a specified direction to finally return the component holding member to the reference posture, and then the component is mounted on the object.
摘要翻译：根据部件安装方法，存储在部件供给器中的部件由部件保持部件保持，然后安装在n个物体上的安装位置。该方法包括：当将部件安装到物体上的部件的安装姿势相对于部件的基本姿势倾斜安装角度时，通过部件保持部件保持部件的部件的操作在将部件安装在物体上之前，已经预先将旋转到安装角度的方向朝向与零件保持部件的基准姿势相脱离的方向。然后，使部件保持部件沿指定方向旋转，最终将部件保持部件返回到基准姿势，然后将部件安装在被检体上。

5. 发明申请

US20060200974A1 Component mounting method 失效
公开(公告)号：US20060200974A1
公开(公告)日：2006-09-14
申请号：US11431751
申请日：2006-05-11
申请人： Noriaki Yoshida , Takeshi Takeda , Akira Kabeshita
发明人： Noriaki Yoshida , Takeshi Takeda , Akira Kabeshita
IPC分类号： B23P19/00 , H05K3/30
CPC分类号： H05K13/0413 , H05K13/0815 , Y10T29/49004 , Y10T29/4913 , Y10T29/49133 , Y10T29/53052 , Y10T29/53174 , Y10T29/53178 , Y10T29/53191
摘要： In accordance with a component mounting method, a component stored in a component feeder is held by a component holding member and is then mounted in a mounting position on an object. The method includes, when a mounting posture of the component in which the component is mounted onto the object is inclined with respect to a basic posture of the component by a mounting angle, the operation of holding the component from the component feeder by the component holding member that has preliminarily been rotated to the mounting angle in such a direction as to depart from a reference posture of the component holding member prior to the mounting of the component on the object. And afterwards, the component holding member is rotated in a specified direction to finally return the component holding member to the reference posture, and then the component is mounted on the object.

6. 发明授权

US07065866B2 Component mounting method 失效
公开(公告)号：US07065866B2
公开(公告)日：2006-06-27
申请号：US09956793
申请日：2001-09-21
申请人： Noriaki Yoshida , Takeshi Takeda , Akira Kabeshita
发明人： Noriaki Yoshida , Takeshi Takeda , Akira Kabeshita
IPC分类号： H05K3/30 , B23P19/00
CPC分类号： H05K13/0413 , H05K13/0815 , Y10T29/49004 , Y10T29/4913 , Y10T29/49133 , Y10T29/53052 , Y10T29/53174 , Y10T29/53178 , Y10T29/53191
摘要： In accordance with a component mounting method, a component stored in a component feeder is held by a component holding member and is then mounted in a mounting position on an object. The method includes, when a mounting posture of the component in which the component is mounted onto the object is inclined with respect to a basic posture of the component by a mounting angle, the operation of holding the component from the component feeder by the component holding member that has preliminarily been rotated to the mounting angle in such a direction as to depart from a reference posture of the component holding member prior to the mounting of the component on the object. And afterwards, the component holding member is rotated in a specified direction to finally return the component holding member to the reference posture, and then the component is mounted on the object.

7. 发明授权

US06289256B1 Method and apparatus for mounting parts 失效
标题翻译：安装零件的方法和装置
公开(公告)号：US06289256B1
公开(公告)日：2001-09-11
申请号：US09008611
申请日：1998-01-15
申请人： Takeshi Takeda , Yoshihiro Mimura , Noriaki Yoshida , Akira Kabeshita
发明人： Takeshi Takeda , Yoshihiro Mimura , Noriaki Yoshida , Akira Kabeshita
IPC分类号： G06F1900
CPC分类号： G05B19/416 , G05B2219/43155 , G05B2219/45029 , Y10T29/53178
摘要： A control device controls to move a chucking mechanism part to a first stop height 451 at a first speed, then at a second speed lower than the first speed before the chucking mechanism part comes in touch with a part from the first stop height, and stop when the chucking mechanism part touches the part, thereby to hold the part. So, a shock to the part when the part is held is reduced in the constitution, and the apparatus becomes light-weight because of the elimination of a shock-absorbing mechanism, hence realizing high-speed mounting.
摘要翻译：控制装置控制将夹紧机构部件以第一速度移动到第一停止高度451，然后以比第一速度低的第二速度移动到夹紧机构部分与第一停止高度部分接触之前，并且停止当夹紧机构部分接触该部分时，从而保持该部分。因此，当部件保持时对部件的冲击减小，并且由于消除了减震机构而使设备变得轻巧，从而实现了高速安装。

8. 发明授权

US07977140B2 Methods for producing solid-state imaging device and electronic device 失效
标题翻译：固态成像装置和电子装置的制造方法
公开(公告)号：US07977140B2
公开(公告)日：2011-07-12
申请号：US12382713
申请日：2009-03-23
申请人： Takeshi Takeda , Yukihiro Ando , Masaki Okamoto , Masayuki Okada , Kaori Takimoto , Katsuhisa Kugimiya , Tadayuki Kimura
发明人： Takeshi Takeda , Yukihiro Ando , Masaki Okamoto , Masayuki Okada , Kaori Takimoto , Katsuhisa Kugimiya , Tadayuki Kimura
IPC分类号： H01L21/00
CPC分类号： H01L27/14812 , H01L27/14831
摘要： A method for producing a solid-state imaging device includes steps of: forming transfer electrodes on a substrate having a plurality of light-sensing portions through a gate insulating layer so that the light-sensing portions are exposed; forming a planarized insulating layer on the substrate to cover the transfer electrodes formed on the substrate; forming openings in the planarized insulating layer so that each of the transfer electrodes is partly exposed out of the planarized insulating layer at a predetermined position; forming a wiring material layer so that the openings are filled with the wiring material layer; forming a resist layer on the wiring material layer; exposing and developing the resist layer so that only the resist layer in a predetermined area covering the openings is left; and patterning the wiring material layer using the exposed and developed resist layer to form connection wirings connected to the transfer electrodes by the openings.
摘要翻译：一种制造固态成像装置的方法，包括以下步骤：通过栅极绝缘层，在具有多个光检测部分的基板上形成转印电极，使得光敏部分露出; 在所述基板上形成平坦化的绝缘层，以覆盖形成在所述基板上的转移电极; 在平坦化绝缘层中形成开口，使得每个传输电极在预定位置部分地从平坦化绝缘层露出; 形成布线材料层，使得开口被布线材料层填充; 在所述布线材料层上形成抗蚀剂层; 曝光和显影抗蚀剂层，使得仅保留覆盖开口的预定区域中的抗蚀剂层; 并使用曝光和显影的抗蚀剂层图案化布线材料层，以形成通过开口连接到转印电极的连接布线。

9. 发明授权

US07919751B2 Infrared sensor 有权
标题翻译：红外传感器
公开(公告)号：US07919751B2
公开(公告)日：2011-04-05
申请号：US12424565
申请日：2009-04-16
申请人： Koji Hayashi , Takeshi Takeda
发明人： Koji Hayashi , Takeshi Takeda
IPC分类号： H01L31/0232 , H01L31/0203 , G01J5/02
CPC分类号： G01J1/04 , G01J1/0271 , G01J1/0407 , G01J2001/0276
摘要： A small infrared sensor has a wide infrared light-receiving area (viewing angle), high electromagnetic shielding characteristics, and excellent electromagnetic-wave resistance characteristics. In the infrared sensor, supporting portions are disposed at four corners of a substantially rectangular opening in a package. The supporting portions support an optical filter, disposed so as to cover the opening, at positions that are lower than an upper end of an inner peripheral wall defining the opening. While the optical filter is supported by the supporting portions as a result of inserting a portion of a surface side of the optical filter facing the supporting portions into the opening, the optical filter is secured to the package. The optical filter and the package are joined and secured, and electrically connected to each other through a conductive adhesive.
摘要翻译：小型红外线传感器具有宽的红外光接收面积（视角），高电磁屏蔽特性和优异的电磁波电阻特性。在红外传感器中，支撑部分设置在包装件中的大致矩形开口的四个角处。所述支撑部支撑设置成覆盖所述开口的光学过滤器，所述光学过滤器位于比限定所述开口的内周壁的上端低的位置处。当由于将滤光器的面对支撑部分的表面侧的一部分插入到开口中而由支撑部分支撑滤光器时，滤光器固定在封装上。光学滤波器和封装被接合并固定，并通过导电粘合剂彼此电连接。

10. 发明申请

US20110074969A1 SOLID-STATE IMAGE PICKUP DEVICE, METHOD FOR MANUFACTURING THE SAME, AND ELECTRONIC APPARATUS 失效
标题翻译：固态图像拾取装置，其制造方法和电子装置
公开(公告)号：US20110074969A1
公开(公告)日：2011-03-31
申请号：US12881687
申请日：2010-09-14
申请人： Takeshi Takeda
发明人： Takeshi Takeda
IPC分类号： H04N5/228 , H04N5/335 , H01L31/18
CPC分类号： H01L27/14818 , H01L27/14627 , H01L27/14685 , H01L27/14843 , H04N5/3595 , H04N5/37213
摘要： Disclosed herein is a solid-state image pickup device, including a pixel, the pixel including: a light receiving section; a charge transfer path; a transfer electrode; a readout gate section; and a readout electrode.
摘要翻译：本文公开了一种包括像素的固态图像拾取装置，该像素包括：光接收部分; 电荷转移路径; 转移电极; 读出门部; 和读出电极。

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