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1. 发明授权

US08678062B2 Adhesive tape joining apparatus 有权
标题翻译：胶带接合装置
公开(公告)号：US08678062B2
公开(公告)日：2014-03-25
申请号：US12893241
申请日：2010-09-29
申请人： Naoki Ishii , Masayuki Yamamoto
发明人： Naoki Ishii , Masayuki Yamamoto
IPC分类号： B32B37/00 , B32B38/00 , B32B38/04
CPC分类号： H01L21/67132
摘要： A collection bobbin is provided on a vertical line that travels a center of a supply bobbin. A pair of connection mechanisms is provided at front both sides of a tape housing chamber. An adhesive tape transport carriage with connection portions at a forward end of a carriage frame is connected to the connection mechanisms in the apparatus body. Loading of a master roll of an adhesive tape to the supply bobbin and unloading of a roll of a residual cut tape may be performed at the same position.
摘要翻译：在供给线轴的中心行进的垂直线上设置收集筒管。一对连接机构设置在胶带容纳室的前两侧。在支架框架的前端具有连接部分的胶带输送架与设备主体中的连接机构连接。将胶带的主卷筒装载到供给线轴上，并且可以在相同的位置上执行一卷残留切割的带子的卸载。

2. 发明申请

US20100294416A1 PROTECTIVE TAPE JOINING METHOD AND PROTECTIVE TAPE JOINING APPARATUS 审中-公开
标题翻译：保护胶带接合方法和保护胶带接合装置
公开(公告)号：US20100294416A1
公开(公告)日：2010-11-25
申请号：US12762660
申请日：2010-04-19
申请人： Masayuki Yamamoto , Naoki Ishii
发明人： Masayuki Yamamoto , Naoki Ishii
IPC分类号： B32B38/00 , B32B43/00
CPC分类号： H01L21/67132
摘要： A tape level detecting device detects a level of a protective tape supplied above a holding table in a given position on a side where joining of the protective tape starts to control the level of the protective tape in the given position on the side where the joining starts in accordance with detected results on the level of the protective tape such that the detected level of the protective tape may fall within a reference range set in advance.
摘要翻译：磁带水平检测装置检测在保持带的接合开始的一侧的给定位置处提供在保持台上方的保护带的水平，以控制接合开始一侧的给定位置中的保护带的水平根据在保护带的水平上的检测结果，使得检测到的保护带的水平可能落在预先设定的参考范围内。

3. 发明授权

US07661454B2 Adhesive tape joining apparatus 失效
标题翻译：胶带接合装置
公开(公告)号：US07661454B2
公开(公告)日：2010-02-16
申请号：US12030062
申请日：2008-02-12
申请人： Masayuki Yamamoto , Naoki Ishii
发明人： Masayuki Yamamoto , Naoki Ishii
IPC分类号： B32B37/00
CPC分类号： H01L21/67132 , Y10T156/1343 , Y10T156/171 , Y10T156/1744
摘要： An apparatus of this invention includes: a workpiece holding mechanism that holds a ring frame and a wafer; a tape supplying device that supplies a continuous dicing tape or a continuous carrier tape to which a precut dicing tape is joined, to a joining position; a joining unit that joins the continuous dicing tape or the precut dicing tape separated from the carrier tape, to the ring frame and the semiconductor wafer; a tape cutting mechanism that cuts the dicing tape joined to the ring frame along a contour of the ring frame; and a residual tape collecting section that takes up and collects a residual tape after the cutting.
摘要翻译：本发明的装置包括：保持环形框架和晶片的工件保持机构; 向连接位置供给连续的切割带或将预切割切割带接合的连续载带的带供给装置; 连接单元，其将连续切割带或与载带分离的预切割切割带连接到环形框架和半导体晶片; 磁带切割机构，其沿着所述环形框架的轮廓切割结合到所述环形框架的切割带; 以及在切割后采集并收集残留胶带的残留胶带收集部。

4. 发明申请

US20090133549A1 PROTECTIVE TAPE CUTTING METHOD FOR SEMICONDUCTOR WAFER AND DEVICE OF THE SAME 失效
标题翻译：用于半导体波形的保护带切割方法及其装置
公开(公告)号：US20090133549A1
公开(公告)日：2009-05-28
申请号：US12276343
申请日：2008-11-23
申请人： Naoki Ishii , Masayuki Yamamoto
发明人： Naoki Ishii , Masayuki Yamamoto
IPC分类号： B26D7/18 , B26D1/16
CPC分类号： H01L21/67092 , H01L21/67132 , Y10T83/0405 , Y10T83/0453 , Y10T83/0605 , Y10T83/207 , Y10T83/2072 , Y10T83/728 , Y10T83/9377 , Y10T83/9401 , Y10T156/108
摘要： A cutter blade is relatively moved along an outer periphery of a semiconductor wafer, and dust generated at a tape cutting site by the cutter blade and attached to an upper surface of the protective tape is collected with a dust collecting member which relatively moves with the cutter blade with respect to the semiconductor wafer, and the dust collected at a predetermined portion is suctioned and removed with a suction nozzle after the completion of tape cutting.
摘要翻译：切割刀片沿着半导体晶片的外周相对移动，并且通过切割刀片在切割部位产生的灰尘附着在保护带的上表面上的灰尘被收集在与切割器相对移动的集尘部件刀片相对于半导体晶片，并且在完成带切割之后，用吸嘴抽吸和去除在预定部分收集的灰尘。

5. 发明申请

US20110117706A1 PROTECTIVE TAPE JOINING METHOD AND PROTECTIVE TAPE JOINING APPARATUS 审中-公开
标题翻译：保护胶带接合方法和保护胶带接合装置
公开(公告)号：US20110117706A1
公开(公告)日：2011-05-19
申请号：US13000395
申请日：2009-10-09
申请人： Akinori Nishio , Kazuyuki Kiuchi , Masayuki Yamamoto , Naoki Ishii
发明人： Akinori Nishio , Kazuyuki Kiuchi , Masayuki Yamamoto , Naoki Ishii
IPC分类号： H01L21/56 , B29C65/56
CPC分类号： H01L21/67132
摘要： A cooling plate having a cooling pipe mounted therein in a serpentine shape is placed in a stack manner on a rear face of a chuck table for suction-holding a rear face of the semiconductor wafer. A coolant is circulated through the cooling pipe, thereby cooling the chuck table. The semiconductor wafer is suction-held while the chuck table is cooled. In addition, the protective tape is joined to the semiconductor wafer while the chuck table is cooled. That is, the protective tape is joined to the surface of the semiconductor wafer while being cooled indirectly via the semiconductor wafer cooled in advance through direct contact to the chuck table during joining of the protective tape.
摘要翻译：将其中安装有蛇形形状的冷却管的冷却板以堆叠方式放置在卡盘台的后表面上，用于吸持保持半导体晶片的后表面。冷却剂通过冷却管循环，从而冷却卡盘台。当卡盘台被冷却时，半导体晶片被吸住。另外，在卡盘台被冷却的同时将保护带接合到半导体晶片。也就是说，在保护带的接合期间，保护带通过预先冷却的半导体晶片被间接冷却而与半导体晶片的表面接合，同时直接接触到卡盘台。

6. 发明申请

US20100078114A1 METHOD AND APPARATUS FOR JOINING ADHESIVE TAPE 失效
标题翻译：粘合胶带的方法和装置
公开(公告)号：US20100078114A1
公开(公告)日：2010-04-01
申请号：US12569625
申请日：2009-09-29
申请人： Masayuki Yamamoto , Naoki Ishii
发明人： Masayuki Yamamoto , Naoki Ishii
IPC分类号： B29C65/50
CPC分类号： H01L21/67132 , Y10T156/1062 , Y10T156/1348
摘要： An adhesive tape is supplied to a back face side of a ring frame, joined to the ring frame with a joining roller, and cut by pivoting a cutter blade along the ring frame. Subsequently, an inspection ring of an inspecting mechanism perform suction on the adhesive tape while contacting the adhesive tape adjacent an inner periphery of the ring frame. Separation of the adhesive tape from the ring frame is determined based on variations of the suction pressure. When the separation of the adhesive tape from the ring frame is detected, the adhesive tape is joined again with the joining roller provided in the cutter mechanism.
摘要翻译：将胶带提供到环形框架的背面侧，并通过连接辊连接到环形框架上，并且沿着环形框架枢转切割刀片进行切割。随后，检查机构的检查环在与邻近环形框架的内周的粘合带接触的同时对粘合带进行抽吸。基于吸入压力的变化来确定胶带与环形框架的分离。当检测到胶带与环形框架的分离时，胶带再次与设置在切割机构中的接合辊接合。

7. 发明授权

US07875145B2 Method and apparatus for joining adhesive tape 失效
标题翻译：连接胶带的方法和装置
公开(公告)号：US07875145B2
公开(公告)日：2011-01-25
申请号：US12569625
申请日：2009-09-29
申请人： Masayuki Yamamoto , Naoki Ishii
发明人： Masayuki Yamamoto , Naoki Ishii
IPC分类号： B32B37/10
CPC分类号： H01L21/67132 , Y10T156/1062 , Y10T156/1348
摘要： An adhesive tape is supplied to a back face side of a ring frame, joined to the ring frame with a joining roller, and cut by pivoting a cutter blade along the ring frame. Subsequently, an inspection ring of an inspecting mechanism perform suction on the adhesive tape while contacting the adhesive tape adjacent an inner periphery of the ring frame. Separation of the adhesive tape from the ring frame is determined based on variations of the suction pressure. When the separation of the adhesive tape from the ring frame is detected, the adhesive tape is joined again with the joining roller provided in the cutter mechanism.
摘要翻译：将胶带提供到环形框架的背面侧，并通过连接辊连接到环形框架上，并且沿着环形框架枢转切割刀片进行切割。随后，检查机构的检查环在与邻近环形框架的内周的粘合带接触的同时对粘合带进行抽吸。基于吸入压力的变化来确定胶带与环形框架的分离。当检测到胶带与环形框架的分离时，胶带再次与设置在切割机构中的接合辊接合。

8. 发明申请

US20080202692A1 ADHESIVE TAPE JOINING APPARATUS 失效
标题翻译：粘合胶带加工设备
公开(公告)号：US20080202692A1
公开(公告)日：2008-08-28
申请号：US12030062
申请日：2008-02-12
申请人： Masayuki Yamamoto , Naoki Ishii
发明人： Masayuki Yamamoto , Naoki Ishii
IPC分类号： B32B37/02
CPC分类号： H01L21/67132 , Y10T156/1343 , Y10T156/171 , Y10T156/1744
摘要： An apparatus of this invention includes: a workpiece holding mechanism that holds a ring frame and a wafer; a tape supplying device that supplies a continuous dicing tape or a continuous carrier tape to which a precut dicing tape is joined, to a joining position; a joining unit that joins the continuous dicing tape or the precut dicing tape separated from the carrier tape, to the ring frame and the semiconductor wafer; a tape cutting mechanism that cuts the dicing tape joined to the ring frame along a contour of the ring frame; and a residual tape collecting section that takes up and collects a residual tape after the cutting.
摘要翻译：本发明的装置包括：保持环形框架和晶片的工件保持机构; 向连接位置供给连续的切割带或将预切割切割带接合的连续载带的带供给装置; 连接单元，其将连续切割带或与载带分离的预切割切割带连接到环形框架和半导体晶片; 磁带切割机构，其沿着所述环形框架的轮廓切割结合到所述环形框架的切割带; 以及在切割后采集并收集残留胶带的残留胶带收集部。

9. 发明授权

US08127647B2 Protective tape cutting method for semiconductor wafer and device of the same 失效
标题翻译：半导体晶圆的保护带切割方法及其装置
公开(公告)号：US08127647B2
公开(公告)日：2012-03-06
申请号：US12276343
申请日：2008-11-23
申请人： Naoki Ishii , Masayuki Yamamoto
发明人： Naoki Ishii , Masayuki Yamamoto
IPC分类号： B32B38/04
CPC分类号： H01L21/67092 , H01L21/67132 , Y10T83/0405 , Y10T83/0453 , Y10T83/0605 , Y10T83/207 , Y10T83/2072 , Y10T83/728 , Y10T83/9377 , Y10T83/9401 , Y10T156/108
摘要： A cutter blade is relatively moved along an outer periphery of a semiconductor wafer, and dust generated at a tape cutting site by the cutter blade and attached to an upper surface of the protective tape is collected with a dust collecting member which relatively moves with the cutter blade with respect to the semiconductor wafer, and the dust collected at a predetermined portion is suctioned and removed with a suction nozzle after the completion of tape cutting.
摘要翻译：切割刀片沿着半导体晶片的外周相对移动，并且通过切割刀片在切割部位产生的灰尘附着在保护带的上表面上的灰尘被收集在与切割器相对移动的集尘部件刀片相对于半导体晶片，并且在完成带切割之后，用吸嘴抽吸和去除在预定部分收集的灰尘。

10. 发明申请

US20110079357A1 ADHESIVE TAPE JOINING APPARATUS 有权
标题翻译：粘合胶带加工设备
公开(公告)号：US20110079357A1
公开(公告)日：2011-04-07
申请号：US12893241
申请日：2010-09-29
申请人： Naoki Ishii , Masayuki Yamamoto
发明人： Naoki Ishii , Masayuki Yamamoto
IPC分类号： H01L21/00 , B32B37/12
CPC分类号： H01L21/67132
摘要： A collection bobbin is provided on a vertical line that travels a center of a supply bobbin. A pair of connection mechanisms is provided at front both sides of a tape housing chamber. An adhesive tape transport carriage with connection portions at a forward end of a carriage frame is connected to the connection mechanisms in the apparatus body. Loading of a master roll of an adhesive tape to the supply bobbin and unloading of a roll of a residual cut tape may be performed at the same position.
摘要翻译：在供给线轴的中心行进的垂直线上设置收集筒管。一对连接机构设置在胶带容纳室的前两侧。在支架框架的前端具有连接部分的胶带输送架与设备主体中的连接机构连接。将胶带的主卷筒装载到供给线轴上，并且可以在相同的位置上执行一卷残留切割的带子的卸载。

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