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    • 5. 发明申请
    • WAFER UNIT FOR TESTING AND TEST SYSTEM
    • 用于测试和测试系统的WAFER单元
    • US20110234252A1
    • 2011-09-29
    • US12953362
    • 2010-11-23
    • Daisuke WATANABEToshiyuki OKAYASU
    • Daisuke WATANABEToshiyuki OKAYASU
    • G01R31/26
    • G01R31/2884G01R31/2831
    • Provided is a test wafer unit for testing a plurality of semiconductor chips formed on a semiconductor wafer, the test wafer unit including: a test wafer having a shape corresponding to a shape of the semiconductor wafer; and a plurality of test circuits formed on the test wafer, each test circuit provided to correspond to two or more of the plurality of semiconductor chips and testing the two or more semiconductor chips. The test wafer unit may include a plurality of connection terminals formed on the test wafer in one to one relation with test terminals of the plurality of semiconductor chips, where each of the plurality of connection terminals is connected to a corresponding one of the test terminals.
    • 提供了一种用于测试形成在半导体晶片上的多个半导体芯片的测试晶片单元,该测试晶片单元包括:具有对应于半导体晶片形状的形状的测试晶片; 以及形成在所述测试晶片上的多个测试电路,每个测试电路被提供以对应于所述多个半导体芯片中的两个或更多个并且测试所述两个或更多个半导体芯片。 测试晶片单元可以包括与多个半导体芯片的测试端子成一一关系的在测试晶片上形成的多个连接端子,其中多个连接端子中的每一个连接到相应的一个测试端子。
    • 6. 发明申请
    • TEST APPARATUS AND MANUFACTURING METHOD
    • 测试装置和制造方法
    • US20110218752A1
    • 2011-09-08
    • US13044320
    • 2011-03-09
    • Daisuke WATANABEToshiyuki OKAYASU
    • Daisuke WATANABEToshiyuki OKAYASU
    • G06F19/00
    • G01R31/318511G01R31/31926
    • Provided is a test apparatus that tests a plurality of devices under test formed on a wafer under test. The test apparatus comprises a test substrate that faces the wafer under test and is electrically connected to the devices under test; a programmable device that is provided on the test substrate and changes a logic relationship of output logic data with respect to input logic data, according to program data supplied thereto; a plurality of input/output circuits that are provided on the test substrate to correspond to the devices under test and that each supply the corresponding device under test with a test signal corresponding to the output logic data of the programmable device; and a judging section that judges pass/fail of each device under test, based on operation results of each device under test according to the test signal.
    • 提供了一种测试在测试晶片上形成的多个待测器件的测试装置。 测试装置包括面向正在测试的晶片并与被测器件电连接的测试基板; 根据提供给其的程序数据,设置在测试基板上并根据输入逻辑数据改变输出逻辑数据的逻辑关系的可编程设备; 多个输入/输出电路,其设置在测试基板上以对应于被测器件,并且每个输入/输出电路以对应于可编程器件的输出逻辑数据的测试信号提供相应的被测器件; 以及判断部,根据测试信号,根据被测设备的运算结果判断各被测设备的通过/失败。
    • 7. 发明申请
    • TEST APPARATUS, TRANSMISSION APPARATUS, RECEIVING APPARATUS, TEST METHOD, TRANSMISSION METHOD AND RECEIVING METHOD
    • 测试装置,传输装置,接收装置,测试方法,传输方法和接收方法
    • US20110199134A1
    • 2011-08-18
    • US13026155
    • 2011-02-11
    • Daisuke WATANABE
    • Daisuke WATANABE
    • H03L7/00
    • G01R31/31932G01R31/31726
    • Provided is a test apparatus that tests a device under test, comprising a phase comparing section that compares a phase of an internal clock generated in the test apparatus and a phase of a clock superimposed on a device signal output by the device under test; an adjusting section that adjusts a phase shift amount of the internal clock with respect to the device signal, based on the phase comparison result; an acquiring section that acquires the device signal according to the internal clock whose phase shift amount with respect to the device signal is adjusted; and an inhibiting section that inhibits change of the phase shift amount based on the phase comparison result, for at least a portion of a period during which the clock is not superimposed on the device signal. Also provided is a test method relating to the test apparatus.
    • 提供了一种测试被测设备的测试装置,包括相位比较部分,其比较测试装置中产生的内部时钟的相位和叠加在由被测器件输出的器件信号上的时钟的相位; 调整部,其根据所述相位比较结果调整所述内部时钟相对于所述装置信号的相移量; 获取部,其根据调整了相对于所述装置信号的相移量的内部时钟获取所述装置信号; 以及禁止部,其在所述时钟未叠加在所述装置信号上的周期的至少一部分期间,基于所述相位比较结果,禁止所述相位偏移量的变化。 还提供了与测试装置相关的测试方法。
    • 8. 发明申请
    • TEST SYSTEM AND SUBSTRATE UNIT FOR TESTING
    • 测试系统和底板测试单元
    • US20110128031A1
    • 2011-06-02
    • US12953352
    • 2010-11-23
    • Daisuke WATANABEToshiyuki OKAYASU
    • Daisuke WATANABEToshiyuki OKAYASU
    • G01R31/26
    • G01R31/2889
    • A test system that tests a plurality of chips under test formed on a wafer under test, the test system comprising a plurality of test substrates that are arranged in overlapping layers and that each have a plurality of test circuits, whose function is determined for each wafer, formed thereon; a plurality of connecting sections that electrically connect, to the chips under test, the test circuits formed on one of the test substrates; and a control apparatus that controls each of the test circuits. Each test substrate has test circuits, with a function predetermined for each substrate, formed thereon.
    • 一种在被测晶片上测试被测试的多个待测芯片的测试系统,所述测试系统包括多个测试基板,所述多个测试基板布置在重叠层中,并且每个具有多个测试电路,每个测试电路的功能是针对每个晶片 ,形成在其上 多个连接部,其将与测试用芯片电连接的测试电路形成在一个测试基板上; 以及控制每个测试电路的控制装置。 每个测试基板具有在其上形成的具有对于每个基板预定的功能的测试电路。