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    • 5. 发明授权
    • Pattern forming method
    • 图案形成方法
    • US08288073B2
    • 2012-10-16
    • US12442702
    • 2007-09-18
    • Yousuke KonnoNakaatsu YoshimuraFumihiro ToyokawaHikaru Sugita
    • Yousuke KonnoNakaatsu YoshimuraFumihiro ToyokawaHikaru Sugita
    • G03F7/00G03F7/26G03F7/40
    • G03F7/091G03F7/168
    • This invention provides a method for resist under layer film formation, which can form a resist under layer film which can function as an anti-reflection film, is excellent in pattern transfer properties and etching resistance, and does not cause bending of a pattern even in the transfer of a fined pattern, and a composition for the resist under layer film for use in the method, and a method for pattern formation. The method for resist under layer film formation comprises the steps of coating a composition for resist under layer film formation (for example, a composition comprising a compound having a phenolic hydroxyl group, a solvent, and an accelerator) onto a substrate to be processed, and treating the formed coating film under an oxidizing atmosphere having an oxygen concentration of not less than 1% by volume and a temperature of 300° C. or higher to form a resist under layer film.
    • 本发明提供一种抗蚀层下层成膜方法,其可形成可用作抗反射膜的抗蚀剂下层膜,图案转印性能和耐蚀刻性优异,并且不会引起图案的弯曲 精细图案的转印和用于该方法的抗蚀剂层下膜的组合物和图案形成方法。 抗蚀层下层成膜的方法包括以下步骤:将待层压成膜用组合物(例如,含有酚羟基的化合物,溶剂和促进剂的组合物)涂布在待加工基材上, 并在氧浓度不低于1体积%,温度为300℃以上的氧化气氛下处理所形成的涂膜,以形成抗蚀层下层膜。