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1. 发明申请

US20140320225A1 BONDING TYPE CRYSTAL CONTROLLED OSCILLATOR 有权
标题翻译：结合型晶体控制振荡器
公开(公告)号：US20140320225A1
公开(公告)日：2014-10-30
申请号：US14258026
申请日：2014-04-22
申请人： NIHON DEMPA KOGYO CO., LTD.
发明人： HIDENORI HARIMA
IPC分类号： H03B5/30
CPC分类号： H03H9/10 , G04F5/063 , H03B5/32 , H03H9/0509 , H03H9/0519 , H03H9/0547 , H03H9/0561 , H03H9/1014 , H03H9/17
摘要： A bonding type crystal controlled oscillator includes a crystal package and a circuit package bonded by two-tier bonding. An anisotropy conductive adhesive is interposed between back surface of the crystal package facing the circuit package and an upper surface of the circuit package facing the crystal package. The anisotropy conductive adhesive includes a thermosetting resin containing solder micro particles dispersed in the thermosetting resin. Assuming that a thickness of the output terminal formed at the crystal package is C μm, a thickness of the external terminal formed at the circuit package is D μm, and an average outside diameter of the solder micro particles dispersed in the anisotropy conductive adhesive is E μm the dimensional relation is set to (C+D)>E.
摘要翻译：键合型晶体振荡器包括晶体封装和通过双层结合键合的电路封装。各向异性导电粘合剂介于面向电路封装的晶体封装的背面与面向晶体封装的电路封装的上表面之间。各向异性导电粘合剂包括含有分散在热固性树脂中的焊料微粒的热固性树脂。假设晶体封装上形成的输出端的厚度为Cμm，则形成在电路封装处的外部端子的厚度为Dμm，分散在各向异性导电粘合剂中的焊料微粒的平均外径为E μm的尺寸关系设定为（C + D）> E。

2. 发明申请

US20130162362A1 SURFACE MOUNT PIEZOELECTRIC OSCILLATOR 有权
标题翻译：表面安装压电振荡器
公开(公告)号：US20130162362A1
公开(公告)日：2013-06-27
申请号：US13726206
申请日：2012-12-23
申请人： NIHON DEMPA KOGYO CO., LTD.
发明人： HIDENORI HARIMA
IPC分类号： H03B5/32
CPC分类号： H03B5/32 , H03H9/0552 , H03H9/1021
摘要： A surface mount piezoelectric oscillator includes a piezoelectric resonator with a container main body, a plurality of external terminals, a mounting board with an IC chip, a plurality of connecting terminals, and a solder ball. The solder ball bonds the plurality of external terminals and the plurality of connecting terminals by melting and hardening. The solder bonding portion has approximately a circular shape with approximately a same size as a size of the connecting terminal of the mounting board. The solder ball placed on the connecting terminal of the mounting board is melted, self-aligned, and hardened so as to form a solder fillet of nearly axial symmetry. The solder fillet bridges between the both electrodes and bonds the connecting terminal of the mounting board and the solder bonding portion of the external terminal of the piezoelectric resonator.
摘要翻译：表面安装压电振荡器包括具有容器主体的压电谐振器，多个外部端子，具有IC芯片的安装板，多个连接端子和焊球。焊球通过熔化和硬化来结合多个外部端子和多个连接端子。焊接部分具有与安装板的连接端子的尺寸大致相同的圆形形状。放置在安装板的连接端子上的焊球被熔化，自对准和硬化，以形成几乎轴对称的焊料圆角。焊接圆角在两个电极之间桥接，并将安装板的连接端子和压电谐振器的外部端子的焊接部分结合。

3. 发明申请

US20130187723A1 PIEZOELECTRIC MODULE 有权
标题翻译：压电模块
公开(公告)号：US20130187723A1
公开(公告)日：2013-07-25
申请号：US13746330
申请日：2013-01-22
申请人： NIHON DEMPA KOGYO CO., LTD.
发明人： HIDENORI HARIMA , FUMIO ASAMURA
IPC分类号： H03B5/36
CPC分类号： H03B5/36 , H01L24/97 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2224/73265 , H01L2924/181 , H03H9/0509 , H03H9/0538 , H03H9/0547 , H03H9/0585 , H03H9/1021 , H03H9/1071 , H03H9/17 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： A piezoelectric module includes a piezoelectric package and a circuit component package. The piezoelectric module includes a thermoset resin with solder particles interposed between a whole circumference of the opening end surface of the second depressed portion including the plurality of connecting terminals of the circuit component package and the outer bottom surface of the first depressed portion of the piezoelectric package. The plurality of external terminals of the piezoelectric package and the plurality of connecting terminals of the circuit component package are electrically connected by metal bonding. The whole circumference of the opening end surface of the second depressed portion of the circuit component package and the outer bottom surface of the first depressed portion of the piezoelectric package are bonded by melting and hardening of the thermoset resin that constitutes the thermoset resin with solder particles.
摘要翻译：压电模块包括压电封装和电路元件封装。压电模块包括热固性树脂，其中焊料颗粒介于包括电路部件封装的多个连接端子的第二凹陷部分的开口端表面的整个周边和压电封装的第一凹陷部分的外部底表面之间。压电封装的多个外部端子和电路部件封装的多个连接端子通过金属接合电连接。电路部件封装的第二凹部的开口端面的整周和压电体的第一凹部的外底面通过焊料粒子的构成热固性树脂的热固性树脂进行熔融硬化来结合。

4. 发明申请

US20130135055A1 SURFACE MOUNT PIEZOELECTRIC OSCILLATOR 审中-公开
标题翻译：表面安装压电振荡器
公开(公告)号：US20130135055A1
公开(公告)日：2013-05-30
申请号：US13633880
申请日：2012-10-03
申请人： Nihon Dempa Kogyo Co., Ltd.
发明人： HIDENORI HARIMA
IPC分类号： H03B5/36
CPC分类号： H03H9/0547 , H01L24/16 , H01L2224/13144 , H01L2224/16238 , H01L2224/2919 , H01L2224/32225 , H01L2224/33181 , H01L2224/73204 , H01L2224/73253 , H01L2224/81815 , H01L2224/83104 , H01L2924/15321 , H03H9/0519 , H03H9/1021 , H01L2924/00014 , H01L2924/0665
摘要： A surface mount piezoelectric oscillator includes a piezoelectric resonator, a mounting board, and an IC chip mounted on the mounting board. An oscillator circuit includes the IC chip and the piezoelectric resonator. The piezoelectric resonator is bonded to the mounting board with solder balls. The mounting board includes a ceramic plate. The mounting board includes connecting terminals and a wiring pattern on the one mounting board principal surface of the mounting board. The connecting terminals are connected to the terminals of the piezoelectric resonator via solder balls. The mounting board includes an intermediate layer on the one mounting board principal surface and integrally formed with the mounting board. The intermediate layer includes solder ball placement openings to position the solder balls in a center of each of the connecting terminals and an IC chip mounting opening to mount the IC chip.
摘要翻译：表面安装压电振荡器包括压电谐振器，安装板和安装在安装板上的IC芯片。振荡电路包括IC芯片和压电谐振器。压电谐振器用焊球接合到安装板上。安装板包括陶瓷板。安装板在安装板的一个安装板主表面上包括连接端子和布线图案。连接端子通过焊球连接到压电谐振器的端子。安装板在一个安装板主表面上包括中间层，并与安装板一体形成。中间层包括焊球放置开口，以将焊球定位在每个连接端子的中心和用于安装IC芯片的IC芯片安装开口。

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