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1. 发明申请

US20160095217A1 WIRING SUBSTRATE AND MULTI-PIECE WIRING SUBSTRATE 有权
标题翻译：接线基板和多层接线基板
公开(公告)号：US20160095217A1
公开(公告)日：2016-03-31
申请号：US14868547
申请日：2015-09-29
申请人： NGK SPARK PLUG CO., LTD.
发明人： Takashi KURAUCHI , Yoshitaka YOSHIDA , Kazushige AKITA
IPC分类号： H05K1/11 , H05K1/02
CPC分类号： H05K3/242 , H03H9/1014 , H05K1/113 , H05K3/0052 , H05K2203/175
摘要： A wiring substrate includes: a substrate body made of ceramic and having a front surface and a rear surface, each having a rectangular shape in a plan view, a plurality of rear surface electrodes formed on the rear surface of the substrate body, a frame-shaped conductive portion provided on the front surface side of the substrate body, and a via conductor penetrating the substrate body and establishing electric connection between the plurality of rear surface electrodes and the frame-shaped conductive portion. A part of the rear surface is exposed between the plurality of rear surface electrodes and each side of the rear surface of the substrate body. On the rear surface of the substrate body, at least one projecting wiring is formed between each of the plurality of rear surface electrodes and each of a corresponding pair of the sides that intersect with each other.
摘要翻译：布线基板包括：由陶瓷制成并具有前表面和后表面的基板主体，其平面图中具有矩形形状，形成在基板主体的后表面上的多个后表面电极，设置在基板主体的前表面侧的导电部分，以及穿过基板主体并且在多个后表面电极和框状导电部分之间建立电连接的通孔导体。后表面的一部分露出在多个后表面电极和基板主体的后表面的每一侧之间。在基板主体的后表面上，在多个后表面电极中的每一个与彼此相交的相应的一对侧面中的每一个之间形成至少一个突出的布线。

2. 发明申请

US20150208512A1 MANUFACTURING METHOD OF PART-MOUNTING PACKAGE 审中-公开
标题翻译：部件安装包装的制造方法
公开(公告)号：US20150208512A1
公开(公告)日：2015-07-23
申请号：US14597935
申请日：2015-01-15
申请人： NGK SPARK PLUG CO., LTD.
发明人： Kazushige AKITA
IPC分类号： H05K3/00 , H05K3/46 , H05K3/10
CPC分类号： H05K3/0097 , H05K1/113 , H05K1/116 , H05K1/183 , H05K3/0044 , H05K3/0052 , H05K3/10 , H05K3/403 , H05K3/4611 , H05K3/4614 , H05K3/4697 , H05K2201/0909 , H05K2201/0919 , H05K2201/0949 , H05K2201/09845 , Y10T29/49147 , Y10T29/49165 , Y10T29/49792 , Y10T29/49798
摘要： A method of manufacturing a part-mounting package includes: forming a first through-hole in a first insulating sheet and forming a second through-hole whose opening area is larger than the first through-hole in a second insulating sheet; forming a penetration conductor covering an inner surface of the second through-hole and forming a conductor layer on a surface of at least the second insulating sheet; laminating the first insulating sheet and the second insulating sheet where center positions of the first through-hole and the second through-hole are matched to each other; causing linear laser division grooves to pass through a center of the first through-hole and the second through-hole; and dividing the sheet laminated body along the laser division grooves, and causing the side surface recess part and the end face through-hole conductor to appear.
摘要翻译：制造部件安装封装的方法包括：在第一绝缘片中形成第一通孔，并在第二绝缘片中形成开口面积大于第一通孔的第二通孔; 形成覆盖所述第二通孔的内表面的穿透导体，并且在至少所述第二绝缘片的表面上形成导体层; 层叠第一绝缘片和第二绝缘片，其中第一通孔和第二通孔的中心位置相互匹配; 使线性激光分割槽穿过第一通孔和第二通孔的中心; 并且沿着激光分割槽分割片材层叠体，并且使侧表面凹部和端面通孔导体出现。

3. 发明申请

US20150047893A1 PACKAGE 有权
标题翻译：包
公开(公告)号：US20150047893A1
公开(公告)日：2015-02-19
申请号：US14459596
申请日：2014-08-14
申请人： NGK Spark Plug Co., Ltd.
发明人： Kazushige AKITA
IPC分类号： H05K1/11
CPC分类号： H05K1/111 , H01L23/053 , H01L2224/16225 , H01L2924/0002 , H03H9/1014 , H03H9/1071 , H01L2924/00
摘要： Embodiments of the present packages comprise a package body that is made of an insulating material, has a front surface and a back surface, and has a rectangular shape in plan view, a metal layer that is formed along a peripheral portion of the front surface of the package body and that has a frame shape in plan view, a metal frame that is joined to the metal layer with a brazing material and has a frame shape in plan view. a pair of electrode pads that are formed on the front surface of the package body surrounded by the metal layer and configured to mount a crystal oscillator, and an opening portion of a cavity opened in a position that excludes the pair of electrode pads, wherein the metal layer, the pair of electrode pads, and the opening portion of the cavity are positioned in the same plane.
摘要翻译：本发明的实施例包括由绝缘材料制成的封装主体，具有前表面和后表面，并且在平面图中具有矩形形状，金属层沿着前表面和后表面的周边部分形成该封装体在平面图中具有框架形状，金属框架通过钎焊材料接合到金属层并且具有平面图中的框架形状。一对电极焊盘，其形成在由所述金属层包围并被构造成安装晶体振荡器的所述封装体的前表面上，以及在不包括所述一对电极焊盘的位置处开放的空腔的开口部分，其中，金属层，一对电极焊盘和空腔的开口部分位于同一平面内。

4. 发明申请

US20190069401A1 WIRING BOARD, METHOD FOR MANUFACTURING WIRING BOARD, AND METHOD FOR MANUFACTURING MULTI-PATTERN WIRING BOARD 审中-公开
公开(公告)号：US20190069401A1
公开(公告)日：2019-02-28
申请号：US16108451
申请日：2018-08-22
申请人： NGK SPARK PLUG CO., LTD.
发明人： Kazushige AKITA
IPC分类号： H05K1/03 , H05K1/02 , H05K3/20 , H05K3/46
CPC分类号： H05K1/0306 , H01L23/15 , H05K1/0298 , H05K1/117 , H05K3/0052 , H05K3/207 , H05K3/403 , H05K3/4629 , H05K2203/063
摘要： A wiring board includes recesses recessed to an inside of the wiring board, in a plan view, in portions connecting a far end surface to side surfaces, and an outer peripheral electroconductive layer disposed over a surface extending from the far end surface to the recesses. To electrically connect an electroconductive member to the outer peripheral electroconductive layer of the wiring board by, for example, joining such as soldering, the electroconductive member can be disposed in the recesses to be connected to the outer peripheral electroconductive layer. This structure prevents the electroconductive member from excessively protruding outward from the surface of the wiring board. Thus, a device having the wiring board installed therein can be made compact.

5. 发明申请

US20160095214A1 CERAMIC SUBSTRATE 审中-公开
标题翻译：陶瓷基材
公开(公告)号：US20160095214A1
公开(公告)日：2016-03-31
申请号：US14858603
申请日：2015-09-18
申请人： NGK SPARK PLUG CO., LTD.
发明人： Ryouta FUKUI , Kazushige AKITA
IPC分类号： H05K1/03 , H05K1/09 , H05K1/11
CPC分类号： H03H9/725 , H01L23/10 , H01L23/15 , H01L2224/16225 , H01L2924/0002 , H01L2924/16195 , H03H9/02826 , H03H9/0514 , H03H9/059 , H03H9/1014 , H03H9/1071 , H01L2924/00
摘要： A ceramic substrate includes: a plate-shaped substrate main body made of an insulating ceramic material; and a metallization layer primarily made of a conductive material, and formed over an entire perimeter of a surface of the substrate main body, along an outer edge of the surface. The ceramic substrate further includes: a composite material layer interposed between the substrate main body and the metallization layer, formed along the outer edge, and containing a ceramic material that is the same as the ceramic material of the substrate main body, and a conductive material that is the same as the conductive material of the metallization layer; and electrode pads primarily made of a conductive material, and formed at a position on the surface, inward of the metallization layer and the composite material layer, and spaced apart from the metallization layer and the composite material layer.
摘要翻译：陶瓷基板包括：由绝缘陶瓷材料制成的板状基板主体; 以及主要由导电材料制成的金属化层，沿着表面的外边缘形成在基板主体的表面的整个周边上。所述陶瓷基板还包括：复合材料层，其插入在所述基板主体和所述金属化层之间，沿着所述外缘形成，并且包含与所述基板主体的陶瓷材料相同的陶瓷材料，以及导电材料与金属化层的导电材料相同; 以及主要由导电材料制成的电极焊盘，并且形成在金属化层和复合材料层的内表面上的位置，并且与金属化层和复合材料层间隔开。

6. 发明申请

US20160044787A1 WIRING SUBSTRATE 有权
标题翻译：接线基板
公开(公告)号：US20160044787A1
公开(公告)日：2016-02-11
申请号：US14818048
申请日：2015-08-04
申请人： NGK SPARK PLUG CO., LTD.
发明人： Kazushige AKITA
IPC分类号： H05K1/11
CPC分类号： H05K1/113 , H01L23/12 , H01L23/13 , H01L23/49827 , H05K2201/09563 , H05K2201/2018
摘要： A wiring substrate includes an insulating substrate having a quadrangular planar outline; a quadrangular frame positioned on the surface of the insulating substrate along the periphery, and including an upper surface, a corner portion, and an adjacent portion, the corner portion including a width-expanded portion defining a via hole extending through the frame, the width-expanded portion including an inner wall surface having a rectilinear edge in a plan view, the adjacent portion including an inner wall surface, the inner wall surface of the width-expanded portion forming an obtuse angle with the inner wall surface of the adjacent portion; a via conductor filling the via hole and not exposed from the inner wall surface of the width-expanded portion; and a sealing metallization layer formed on the upper surface of the frame and electrically connected to the via conductor.
摘要翻译：布线基板包括具有四边形平面轮廓的绝缘基板; 所述四边形框架沿着所述周边定位在所述绝缘基板的表面上，并且包括上表面，角部和相邻部分，所述角部包括限定穿过所述框架的通孔的宽度扩展部，所述宽度其包括在俯视图中具有直线边缘的内壁面，相邻部分包括内壁面，宽度扩大部分的内壁面与相邻部分的内壁面形成钝角; 通孔导体，其填充所述通孔并且不从所述宽度扩展部的内壁表面露出; 以及形成在框架的上表面上并且电连接到通孔导体的密封金属化层。

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