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1. 发明授权

US07935982B2 Side view type LED package 有权
标题翻译：侧视型LED封装
公开(公告)号：US07935982B2
公开(公告)日：2011-05-03
申请号：US12851191
申请日：2010-08-05
申请人： Nam Young Kim , Tae Kwang Kim , Kyoung Bo Han , Myung Hee Lee
发明人： Nam Young Kim , Tae Kwang Kim , Kyoung Bo Han , Myung Hee Lee
IPC分类号： H01L33/00
CPC分类号： H01L33/486 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2924/3025 , H01L2924/00012 , H01L2924/00014 , H01L2924/00
摘要： In a side view type light emitting diode (LED) package, a lead frame portion and lead frame electrical contact portions are exposed outside a package body to serve as an additional heat dissipation path. The side view type LED package includes an LED chip, a package body having a side surface with an opening for receiving the LED chip, and lead frames for applying a current to the LED chip. The lead frames include inner leads electrically connected to the LED chip within the package body; electrical contact lower legs extending from the inner leads to a lower portion of the package body and exposed outside the package body in the vicinity of a lower surface of the package body perpendicular to the side surface; and a heat dissipation means extending, separately from the electrical contact lower legs, from at least one of the inner leads outside the package body.
摘要翻译：在侧视型发光二极管（LED）封装中，引线框架部分和引线框架电接触部分暴露在封装体的外部以用作额外的散热路径。侧视型LED封装包括LED芯片，具有用于接收LED芯片的开口的侧表面的封装体和用于向LED芯片施加电流的引线框架。引线框架包括电连接到封装主体内的LED芯片的内部引线; 从所述内引线延伸到所述封装主体的下部并且在所述封装体的垂直于所述侧表面的下表面附近暴露于所述封装体外部的电接触小腿; 以及散热装置，其与电接触小腿分开地从包装体外部的至少一个内引线延伸。

2. 发明申请

US20090179219A1 SIDE VIEW TYPE LED PACKAGE 有权
标题翻译：侧视图类型LED封装
公开(公告)号：US20090179219A1
公开(公告)日：2009-07-16
申请号：US12299882
申请日：2007-06-27
申请人： Nam Young Kim , Tae Kwang Kim , Kyoung Bo Han , Myung Hee Lee
发明人： Nam Young Kim , Tae Kwang Kim , Kyoung Bo Han , Myung Hee Lee
IPC分类号： H01L33/00
CPC分类号： H01L33/486 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2924/3025 , H01L2924/00012 , H01L2924/00014 , H01L2924/00
摘要： In a side view type light emitting diode (LED) package, a lead frame portion and lead frame electrical contact portions are exposed outside a package body to serve as an additional heat dissipation path. The side view type LED package includes an LED chip, a package body having a side surface with an opening for receiving the LED chip, and lead frames for applying a current to the LED chip. The lead frames include inner leads electrically connected to the LED chip within the package body; electrical contact lower legs extending from the inner leads to a lower portion of the package body and exposed outside the package body in the vicinity of a lower surface of the package body perpendicular to the side surface; and a heat dissipation means extending, separately from the electrical contact lower legs, from at least one of the inner leads outside the package body.
摘要翻译：在侧视型发光二极管（LED）封装中，引线框架部分和引线框架电接触部分暴露在封装体的外部以用作额外的散热路径。侧视型LED封装包括LED芯片，具有用于接收LED芯片的开口的侧表面的封装体和用于向LED芯片施加电流的引线框架。引线框架包括电连接到封装主体内的LED芯片的内部引线; 从所述内引线延伸到所述封装主体的下部并且在所述封装体的垂直于所述侧表面的下表面附近暴露于所述封装体外部的电接触小腿; 以及散热装置，其与电接触小腿分开地从包装体外部的至少一个内引线延伸。

3. 外观设计

USD989060S1 Mobile phone case 有权
公开(公告)号：USD989060S1
公开(公告)日：2023-06-13
申请号：US35514452
申请日：2021-12-17
申请人： OLOR CO., LTD. , Myung Hee Lee , Ju Hyun Lee
设计人： Myung Hee Lee , Ju Hyun Lee , Seung Seok Jo
摘要： 1. Mobile phone case
1.1 : Perspective
1.2 : Front
1.3 : Back
1.4 : Left
1.5 : Right
1.6 : Top
1.7 : Bottom
1.8 : Perspective
1.9 : Exploded perspective
1.10 : Anti-collision feature shown in isolation for clarity.
Figure 1.1 is a perspective view; figure 1.2 is a front view; figure 1.3 is a rear view; figure 1.4 is the left side view; figure 1.5 is the right side view; figure 1.6 is a top plan view; figure 1.7 is a bottom view; figure 1.8 is a perspective view from the rear; figure 1.9 illustrates the use of the subject design; figure 1.10 illustrates detachable anti-collision silicone. The broken lines depict portions of the mobile phone case that forms no part of the claimed design.

4. 发明授权

US07595747B2 Digital-to-analog converter, and method thereof 失效
标题翻译：数模转换器及其方法
公开(公告)号：US07595747B2
公开(公告)日：2009-09-29
申请号：US11971320
申请日：2008-01-09
申请人： Yun Seung Shin , Ji Woon Jung , Myung Hee Lee
发明人： Yun Seung Shin , Ji Woon Jung , Myung Hee Lee
IPC分类号： H03M1/66
CPC分类号： H03M1/0607 , G09G3/3688 , G09G3/3696 , G09G2310/027 , H03M1/662 , H03M1/682
摘要： A digital-to-analog converter (DAC) and a digital-to-analog converting method are provided. The DAC includes a first capacitor, an operation amplifier having a first input terminal connected to the first capacitor, a second input terminal, and an output terminal, where the first input terminal is a (−) input terminal and the second input terminal is a (+) input terminal; and a switching circuit having a plurality of switches each being switched in response to a corresponding switching signal from among a plurality of switching signals. The switching circuit performs switching so that the difference between a first voltage and a second voltage can be stored in the first capacitor connected to the operation amplifier during a first period, and performs switching so that an output signal can be output by reflecting a third voltage in the difference stored in the first capacitor during a second period.
摘要翻译：提供了数模转换器（DAC）和数模转换方法。 DAC包括第一电容器，具有连接到第一电容器的第一输入端子的运算放大器，第二输入端子和输出端子，其中第一输入端子是（ - ）输入端子，第二输入端子是（+）输入端子; 以及具有多个开关的开关电路，每个开关响应于来自多个开关信号的相应的开关信号而被切换。开关电路进行开关，使得第一电压和第二电压之间的差可以在第一时段期间存储在连接到运算放大器的第一电容器中，并且执行开关，使得可以通过反映第三电压来输出输出信号在第二时段期间存储在第一电容器中的差值。

5. 发明申请

US20080191916A1 DIGITAL-TO-ANALOG CONVERTER, AND METHOD THEREOF 失效
标题翻译：数字到模拟转换器及其方法
公开(公告)号：US20080191916A1
公开(公告)日：2008-08-14
申请号：US11971320
申请日：2008-01-09
申请人： Yun Seung Shin , Ji Woon Jung , Myung Hee Lee
发明人： Yun Seung Shin , Ji Woon Jung , Myung Hee Lee
IPC分类号： H03M1/66
CPC分类号： H03M1/0607 , G09G3/3688 , G09G3/3696 , G09G2310/027 , H03M1/662 , H03M1/682
摘要： A digital-to-analog converter (DAC) and a digital-to-analog converting method are provided. The DAC includes a first capacitor, an operation amplifier having a first input terminal connected to the first capacitor, a second input terminal, and an output terminal, where the first input terminal is a (−) input terminal and the second input terminal is a (+) input terminal; and a switching circuit having a plurality of switches each being switched in response to a corresponding switching signal from among a plurality of switching signals. The switching circuit performs switching so that the difference between a first voltage and a second voltage can be stored in the first capacitor connected to the operation amplifier during a first period, and performs switching so that an output signal can be output by reflecting a third voltage in the difference stored in the first capacitor during a second period.
摘要翻译：提供了数模转换器（DAC）和数模转换方法。 DAC包括第一电容器，具有连接到第一电容器的第一输入端子的运算放大器，第二输入端子和输出端子，其中第一输入端子是（ - ）输入端子，第二输入端子是（+）输入端子; 以及具有多个开关的开关电路，每个开关响应于来自多个开关信号的相应的开关信号而被切换。开关电路执行开关，使得第一电压和第二电压之间的差可以在第一时段期间存储在连接到运算放大器的第一电容器中，并且执行开关，使得可以通过反映第三电压来输出输出信号在第二时段期间存储在第一电容器中的差值。

6. 发明申请

US20110278485A1 GAS REGULATING VALVE FOR TORCH 审中-公开
标题翻译：气体调节阀
公开(公告)号：US20110278485A1
公开(公告)日：2011-11-17
申请号：US13146325
申请日：2010-02-01
申请人： Myung Hee Lee
发明人： Myung Hee Lee
IPC分类号： F16K31/44
CPC分类号： B23K7/10 , B23K9/323 , F16K1/38 , F23D14/465 , F23K2900/05001 , F23N1/007 , F23N2035/24
摘要： The present invention relates to a gas regulating valve for a torch. A gas regulating valve for a torch of the present invention has a valve frame including a gas inlet with a substantially tapered cross-section and a gas outlet, a valve pin inserted into an insertion hole formed inside the valve frame to block and open the gas inlet, a handle fastened to a tail portion of the valve pin, and a valve frame fastening block that is immovably fastened on the outside of the valve frame, is formed in a ring shape along an outer periphery of the valve pin on the top of the handle and guides, by rotations of the handle, the valve pin to translate back and forth opposite to the gas inlet.
摘要翻译：本发明涉及一种用于割炬的气体调节阀。本发明的用于炬的气体调节阀具有阀架，该阀架包括具有大致锥形截面的气体入口和气体出口，插入到形成在阀框内的插入孔中的阀销，以阻塞和打开气体入口，固定在阀销的尾部的手柄，以及不可移动地固定在阀框外侧的阀框紧固块，沿着阀销顶部的阀销的外周形成环状手柄和引导件通过手柄的旋转，阀销与气体入口相反地前后平移。

7. 发明申请

US20100301376A1 SIDE VIEW TYPE LED PACKAGE 有权
标题翻译：侧视图类型LED封装
公开(公告)号：US20100301376A1
公开(公告)日：2010-12-02
申请号：US12851191
申请日：2010-08-05
申请人： Nam Young KIM , Tae Kwang Kim , Kyoung Bo Han , Myung Hee Lee
发明人： Nam Young KIM , Tae Kwang Kim , Kyoung Bo Han , Myung Hee Lee
IPC分类号： H01L33/62 , H01L33/64
CPC分类号： H01L33/486 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2924/3025 , H01L2924/00012 , H01L2924/00014 , H01L2924/00
摘要： In a side view type light emitting diode (LED) package, a lead frame portion and lead frame electrical contact portions are exposed outside a package body to serve as an additional heat dissipation path. The side view type LED package includes an LED chip, a package body having a side surface with an opening for receiving the LED chip, and lead frames for applying a current to the LED chip. The lead frames include inner leads electrically connected to the LED chip within the package body; electrical contact lower legs extending from the inner leads to a lower portion of the package body and exposed outside the package body in the vicinity of a lower surface of the package body perpendicular to the side surface; and a heat dissipation means extending, separately from the electrical contact lower legs, from at least one of the inner leads outside the package body.
摘要翻译：在侧视型发光二极管（LED）封装中，引线框架部分和引线框架电接触部分暴露在封装体的外部以用作额外的散热路径。侧视型LED封装包括LED芯片，具有用于接收LED芯片的开口的侧表面的封装体和用于向LED芯片施加电流的引线框架。引线框架包括电连接到封装主体内的LED芯片的内部引线; 从所述内引线延伸到所述封装主体的下部并且在所述封装体的垂直于所述侧表面的下表面附近暴露于所述封装体外部的电接触小腿; 以及散热装置，其与电接触小腿分开地从包装体外部的至少一个内引线延伸。

8. 外观设计

USD557223S1 Light emitting diode (LED) 有权
标题翻译：发光二极管（LED）
公开(公告)号：USD557223S1
公开(公告)日：2007-12-11
申请号：US29263756
申请日：2006-07-28
申请人： Nam Young Kim , Kyoung Bo Han , Myung Hee Lee
设计人： Nam Young Kim , Kyoung Bo Han , Myung Hee Lee

9. 发明授权

US07999280B2 Light emitting diode package employing lead terminal with reflecting surface 有权
标题翻译：发光二极管封装采用带反射面的引线端子
公开(公告)号：US07999280B2
公开(公告)日：2011-08-16
申请号：US11780051
申请日：2007-07-19
申请人： Hwa Ja Kim , Nam Young Kim , Myung Hee Lee , Kyoung Bo Han , Tae Kwang Kim , Ji Seop So
发明人： Hwa Ja Kim , Nam Young Kim , Myung Hee Lee , Kyoung Bo Han , Tae Kwang Kim , Ji Seop So
IPC分类号： H01L33/00
CPC分类号： H01L33/60 , H01L33/483 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2924/01012 , H01L2924/01079 , H01L2924/00014
摘要： Disclosed is a light emitting diode (LED) package employing a lead terminal with a reflecting surface. The package includes first and second lead terminals that are spaced apart from each other. The first lead terminal has a lower portion with an LED chip mounting area, and at least one reflecting surface formed by being bent from the lower portion. Meanwhile, a package body supports the first and second lead terminals and forms a cavity through which the LED chip mounting area and the reflecting surface of the first lead terminal and a part of the second lead terminal are exposed. The first and second lead terminals extend outside of the package body. Accordingly, light emitted from an LED chip can be reflected on the reflecting surface with high reflectivity, so that the optical efficiency of the package can be improved.
摘要翻译：公开了一种采用具有反射表面的引线端子的发光二极管（LED）封装。该封装包括彼此间隔开的第一和第二引线端子。第一引线端子具有LED芯片安装区域的下部，以及从下部弯曲形成的至少一个反射面。同时，封装体支撑第一和第二引线端子并形成空腔，LED芯片安装区域和第一引线端子的反射表面和第二引线端子的一部分暴露在该空腔中。第一和第二引线端子延伸到封装体的外部。因此，从LED芯片发出的光可以以高反射率反射在反射面上，从而能够提高封装的光学效率。

10. 发明授权

US07804105B2 Side view type LED package 有权
标题翻译：侧视型LED封装
公开(公告)号：US07804105B2
公开(公告)日：2010-09-28
申请号：US12299882
申请日：2007-06-27
申请人： Nam Young Kim , Tae Kwang Kim , Kyoung Bo Han , Myung Hee Lee
发明人： Nam Young Kim , Tae Kwang Kim , Kyoung Bo Han , Myung Hee Lee
IPC分类号： H01L33/00
CPC分类号： H01L33/486 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2924/3025 , H01L2924/00012 , H01L2924/00014 , H01L2924/00
摘要： In a side view type light emitting diode (LED) package, a lead frame portion and lead frame electrical contact portions are exposed outside a package body to serve as an additional heat dissipation path. The side view type LED package includes an LED chip, a package body having a side surface with an opening for receiving the LED chip, and lead frames for applying a current to the LED chip. The lead frames include inner leads electrically connected to the LED chip within the package body; electrical contact lower legs extending from the inner leads to a lower portion of the package body and exposed outside the package body in the vicinity of a lower surface of the package body perpendicular to the side surface; and a heat dissipation means extending, separately from the electrical contact lower legs, from at least one of the inner leads outside the package body.
摘要翻译：在侧视型发光二极管（LED）封装中，引线框架部分和引线框架电接触部分暴露在封装体的外部以用作额外的散热路径。侧视型LED封装包括LED芯片，具有用于接收LED芯片的开口的侧表面的封装体和用于向LED芯片施加电流的引线框架。引线框架包括电连接到封装主体内的LED芯片的内部引线; 从所述内引线延伸到所述封装主体的下部并且在所述封装体的垂直于所述侧表面的下表面附近暴露于所述封装体外部的电接触小腿; 以及散热装置，其与电接触小腿分开地从包装体外部的至少一个内引线延伸。

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