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1. 发明公开

US20240064890A1 MULTILAYER SUBSTRATE 审中-公开
公开(公告)号：US20240064890A1
公开(公告)日：2024-02-22
申请号：US18386353
申请日：2023-11-02
申请人： Murata Manufacturing Co., Ltd.
发明人： Keisuke TERANISHI , Hirotaka FUJII
IPC分类号： H05K1/02
CPC分类号： H05K1/0218
摘要： In a multilayer substrate, first interlayer connection conductors pass through resin layers in a lamination direction and electrically connect first and second signal conductors. Second interlayer connection conductors pass through the resin layers in the lamination direction and electrically connect the first and second signal conductors. The first interlayer connection conductors are aligned in a first row extending along the first signal conductor when viewed in the lamination direction. The second interlayer connection conductors are aligned in a second row extending along the first signal conductor when viewed in the lamination direction. A direction perpendicular to the direction in which the first signal conductor extends, when viewed in the lamination direction, is a line width direction. A position of the second row in the line width direction is different from a position of the first row in the line width direction.

2. 发明申请

US20140138804A1 HIGH-FREQUENCY MODULE AND COMMUNICATION APPARATUS 有权
标题翻译：高频模块和通信设备
公开(公告)号：US20140138804A1
公开(公告)日：2014-05-22
申请号：US13753370
申请日：2013-01-29
申请人： MURATA MANUFACTURING CO., LTD.
发明人： Koichi TAKIZAWA , Yoshihiko GOTO , Kaoru SUDO , Hirotaka FUJII
IPC分类号： H01L23/66
CPC分类号： H01L23/66 , H01L23/055 , H01L23/3121 , H01L23/49822 , H01L23/49827 , H01L23/49833 , H01L24/48 , H01L24/49 , H01L25/16 , H01L2223/6677 , H01L2223/6688 , H01L2224/05554 , H01L2224/48225 , H01L2224/48227 , H01L2224/49171 , H01L2924/00014 , H01L2924/10162 , H01Q1/2283 , H01Q9/0407 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor component is face-up mounted on a package substrate. An antenna substrate is flip-chip mounted on a front side of the semiconductor component. A device-side high-frequency signal terminal is disposed on the front side of the semiconductor component, and an antenna-side high-frequency signal terminal is disposed on a back side of the antenna substrate. The device-side high-frequency signal terminal and the antenna-side high-frequency signal terminal are electrically connected to each other. Thus, the antenna substrate for high-frequency signals can be separated from the package substrate for baseband signals.
摘要翻译：将半导体部件面朝上安装在封装基板上。天线基板被倒装安装在半导体部件的前侧。在半导体部件的正面设置有器件侧高频信号端子，天线侧高频信号端子设置在天线基板的背面侧。设备侧高频信号端子和天线侧高频信号端子彼此电连接。因此，用于高频信号的天线基板可以与用于基带信号的封装基板分离。

3. 发明申请

US20190108938A1 MULTILAYER SUBSTRATE AND METHOD OF MANUFACTURING THE SAME 审中-公开
公开(公告)号：US20190108938A1
公开(公告)日：2019-04-11
申请号：US16212720
申请日：2018-12-07
申请人： Murata Manufacturing Co., Ltd.
发明人： Shingo ITO , Naoki GOUCHI , Hirotaka FUJII , Kazutaka MURAOKA
IPC分类号： H01F27/28 , H01F27/32 , H01F41/04 , H01F41/12
摘要： A multilayer substrate includes a stacked body of insulating base material layers and conductor patterns on the insulating base material layers. A thickness adjustment base material layer includes a frame portion, an opening portion inside the frame portion, and an island shaped portion inside the frame portion, and connection portions to connect the island shaped portion to the frame portion. The conductor patterns, in a stacking direction of the insulating base material layers, are wound around the island shaped portion. A line width of the connection portions is smaller than the width of the island shaped portion connected to the frame portion through the connection portions. An area overlapped with the conductor patterns is larger in the opening portion than in the frame portion and the island shaped portion.

4. 发明申请

US20220285083A1 MULTILAYER SUBSTRATE AND METHOD OF MANUFACTURING THE SAME 有权
公开(公告)号：US20220285083A1
公开(公告)日：2022-09-08
申请号：US17751794
申请日：2022-05-24
申请人： Murata Manufacturing Co., Ltd.
发明人： Shingo ITO , Naoki GOUCHI , Hirotaka FUJII , Kazutaka MURAOKA
IPC分类号： H01F27/28 , H01F17/00 , H01F27/32 , H01F41/04 , H01F41/12
摘要： A multilayer substrate includes a stacked body of insulating base material layers and conductor patterns on the insulating base material layers. A thickness adjustment base material layer includes a frame portion, an opening portion inside the frame portion, and an island shaped portion inside the frame portion, and connection portions to connect the island shaped portion to the frame portion. The conductor patterns, in a stacking direction of the insulating base material layers, are wound around the island shaped portion. A line width of the connection portions is smaller than the width of the island shaped portion connected to the frame portion through the connection portions. An area overlapped with the conductor patterns is larger in the opening portion than in the frame portion and the island shaped portion.

5. 发明公开

US20230378651A1 ANTENNA ELEMENT 审中-公开
公开(公告)号：US20230378651A1
公开(公告)日：2023-11-23
申请号：US18364477
申请日：2023-08-03
申请人： Murata Manufacturing Co., Ltd.
发明人： Hirotaka FUJII , Koji KAMADA , Daisuke DOI
IPC分类号： H01Q9/04 , H01Q1/38 , H01Q1/22
CPC分类号： H01Q9/0414 , H01Q1/38 , H01Q1/2283
摘要： An antenna element includes a body including laminated insulator layers, a first ground conductor, and a radiation conductor overlapping the first ground conductor along a first direction from the first ground conductor. Guard ground conductors are provided in the body along the first direction to surround the radiation conductor. The guard ground conductors include second ground conductors electrically interconnected, and one or more first interlayer connection conductors piercing the insulator layers. The second ground conductors are shaped to not make a circuit of the radiation conductor, and are positioned at multiple positions relative to up-down directions. The second ground conductors each have an overlapping portion that overlaps the second ground conductor positioned adjacent to the overlapping portion in an upward or downward direction, and a non-overlapping portion that does not overlap the second ground conductor positioned adjacent to the non-overlapping portion in the upward or downward direction.

6. 发明申请

US20210337656A1 MULTILAYER RESIN SUBSTRATE, AND METHOD OF MANUFACTURING MULTILAYER RESIN SUBSTRATE 有权
公开(公告)号：US20210337656A1
公开(公告)日：2021-10-28
申请号：US17368900
申请日：2021-07-07
申请人： Murata Manufacturing Co., Ltd.
发明人： Tomohiro FURUMURA , Shigeru TAGO , Hirotaka FUJII
IPC分类号： H05K1/02 , H05K3/00 , H05K3/46 , H05K1/03
摘要： A multilayer resin substrate includes a base material including stacked resin layers including an opening resin layer, a conductor pattern, and an interlayer connection conductor. A concave portion is provided in the base material. The opening resin layer is closer to a first main surface than other resin layers. The concave portion includes a first opening portion provided by a cutting process from one surface of the opening resin layer, and another resin layer. The interlayer connection conductor is provided by filling a conductor in a second opening portion provided by a cutting process from an opposite surface of the opening resin layer. The end portion of the one surface of the first opening portion is not in contact with the conductor pattern.

7. 发明申请

US20190115136A1 MULTILAYER SUBSTRATE AND ELECTRONIC DEVICE 审中-公开
公开(公告)号：US20190115136A1
公开(公告)日：2019-04-18
申请号：US16218524
申请日：2018-12-13
申请人： Murata Manufacturing Co., Ltd.
发明人： Shingo ITO , Hirotaka FUJII
IPC分类号： H01F17/00 , H01F27/28 , H01G4/06 , H05K1/16 , H03H7/01
摘要： A multilayer substrate includes a stacked body, coil conductor patterns, and a connection conductor pattern. The stacked body includes insulating layers. A first coil conductor pattern is provided on the front surface of an insulating layer and has a wound shape including outer and inner end portions. A second coil conductor pattern is provided on the front surface of the insulating layer and includes an end portion. The connection conductor pattern is provided in the stacked body, and connects the coil conductor patterns. The outer end portion is connected to a terminal conductor on a back surface of the stacked body. The end portion of the second coil conductor pattern is connected to the terminal conductor on the back surface of the stacked body. The first coil conductor pattern extends parallel or substantially parallel to the second coil conductor pattern along an outer periphery of the second coil conductor pattern.

8. 发明申请

US20140003007A1 FLAT CABLE AND ELECTRONIC APPARATUS 有权
标题翻译：平板电缆和电子设备
公开(公告)号：US20140003007A1
公开(公告)日：2014-01-02
申请号：US13928720
申请日：2013-06-27
申请人： Murata Manufacturing Co., Ltd.
发明人： Koji SHIROKI , Yoichi SAITO , Hiromasa KOYAMA , Hirotaka FUJII , Noboru KATO
IPC分类号： H01B7/08
CPC分类号： H01B7/08 , H01P3/06 , H01P3/085
摘要： A transmission line portion of a flat cable that is bent at a position along the longitudinal direction includes a dielectric element body, a first ground conductor, and a second ground conductor. The dielectric element body includes a signal conductor at the middle position of the thickness direction. The first ground conductor includes elongated conductors and bridge conductors. The elongated conductors are spaced in the width direction of the dielectric element body, and extend in the longitudinal direction. The bridge conductors connect the elongated conductors at spacings along the longitudinal direction. The spacing of bridge conductors across the bending point in a bent portion is smaller than the spacing of adjacent bridge conductors located in a straight portion.
摘要翻译：扁平电缆的沿着纵向位置弯曲的传输线部分包括电介质元件本体，第一接地导体和第二接地导体。电介质元件主体包括在厚度方向的中间位置处的信号导体。第一接地导体包括细长导体和桥导体。细长导体沿电介质元件主体的宽度方向间隔开，并沿纵向方向延伸。桥导体沿着纵向方向以间隔连接细长导体。在弯曲部分中跨越弯曲点的桥导体的间隔小于位于直线部分中的相邻桥导体的间隔。

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