专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20130055038A1 COMPUTING UNIT ABNORMALITY DETERMINING APPARATUS AND METHOD 审中-公开
标题翻译：计算机异常检测装置和方法
公开(公告)号：US20130055038A1
公开(公告)日：2013-02-28
申请号：US13697240
申请日：2010-05-12
申请人： Munenori Nakamura , Yuko Kariya
发明人： Munenori Nakamura , Yuko Kariya
IPC分类号： G06F11/08
CPC分类号： G06F11/2226
摘要： According to the present invention, a computing unit abnormality determining apparatus is disclosed which determines whether there is an abnormality in a computing unit, comprising a comparison operation abnormality determining part configured to perform a comparison operation using the computing unit to determine whether there is an abnormality in the comparison operation; and an arithmetic/logical operation abnormality determining part configured to perform an arithmetic/logical operation of a predetermined operational expression using the computing unit, the predetermined operational expression including at least one of an arithmetic operation and a logical operation, and compare an operational result obtained by the arithmetic/logical operation with a corresponding stored value of a correct value to determine whether there is an abnormality in the arithmetic/logical operation.
摘要翻译：根据本发明，公开了一种运算单元异常判定装置，其判断计算单元是否存在异常，所述计算单元异常判定装置包括：比较运算异常判定部，被配置为使用所述运算部进行比较运算，判定是否存在异常在比较操作中; 以及算术/逻辑运算异常确定部件，被配置为使用所述计算单元执行预定操作表达式的算术/逻辑运算，所述预定操作表达式包括算术运算和逻辑运算中的至少一个，并且比较获得的运算结果通过算术/逻辑运算与正确值的相应存储值来确定算术/逻辑运算是否存在异常。

2. 发明申请

US20070105245A1 Wafer inspection data handling and defect review tool 审中-公开
标题翻译：晶圆检查数据处理和缺陷检查工具
公开(公告)号：US20070105245A1
公开(公告)日：2007-05-10
申请号：US11594757
申请日：2006-11-09
申请人： Tomohiro Funakoshi , Junko Konishi , Yuko Kariya , Noritsugu Takahashi , Fumiaki Endo
发明人： Tomohiro Funakoshi , Junko Konishi , Yuko Kariya , Noritsugu Takahashi , Fumiaki Endo
IPC分类号： H01L21/66
CPC分类号： G03F7/7065 , G01N21/8851 , G01N21/9501 , G01N2021/8861 , G03F1/84
摘要： A defect detected by a wafer inspection tool is reliably captured by a defect review tool. A defect review condition in the defect review tool is varied depending on defect attributes provided by the wafer inspection tool so as to optimize the review process. For example, review magnification is varied depending on the size of the defect, or the frame addition number is varied depending on the maximum gray level difference.
摘要翻译：由晶片检查工具检测到的缺陷由缺陷检查工具可靠地捕获。缺陷检查工具中的缺陷检查条件根据晶片检查工具提供的缺陷属性而变化，以优化审查过程。例如，根据缺陷的尺寸来改变复查倍率，或者根据最大灰度差来改变帧相加数。

3. 发明授权

US08209135B2 Wafer inspection data handling and defect review tool 有权
标题翻译：晶圆检查数据处理和缺陷检查工具
公开(公告)号：US08209135B2
公开(公告)日：2012-06-26
申请号：US13040794
申请日：2011-03-04
申请人： Tomohiro Funakoshi , Junko Konishi , Yuko Kariya , Noritsugu Takahashi , Fumiaki Endo
发明人： Tomohiro Funakoshi , Junko Konishi , Yuko Kariya , Noritsugu Takahashi , Fumiaki Endo
IPC分类号： H04N7/18
CPC分类号： G03F7/7065 , G01N21/8851 , G01N21/9501 , G01N2021/8861 , G03F1/84
摘要： A defect detected by a wafer inspection tool is reliably captured by a defect review tool. A defect review condition in the defect review tool is varied depending on defect attributes provided by the wafer inspection tool so as to optimize the review process. For example, review magnification is varied depending on the size of the defect, or the frame addition number is varied depending on the maximum gray level difference.
摘要翻译：由晶片检查工具检测到的缺陷由缺陷检查工具可靠地捕获。缺陷检查工具中的缺陷检查条件根据晶片检查工具提供的缺陷属性而变化，以优化审查过程。例如，根据缺陷的尺寸来改变复查倍率，或者根据最大灰度差来改变帧相加数。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式