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1. 发明申请

US20070047175A1 Method of manufacturing capacitor for incorporation in wiring board, capacitor for incorporation in wiring board, and wiring board 有权
标题翻译：制造用于配线基板的电容器的制造方法，配线基板的电容器以及配线基板
公开(公告)号：US20070047175A1
公开(公告)日：2007-03-01
申请号：US11512247
申请日：2006-08-30
申请人： Motohiko Sato , Kazuhiro Hayashi , Akifumi Tosa , Kenji Murakami , Tomohide Yamada , Motonobu Kurahashi
发明人： Motohiko Sato , Kazuhiro Hayashi , Akifumi Tosa , Kenji Murakami , Tomohide Yamada , Motonobu Kurahashi
IPC分类号： H01G4/005
CPC分类号： H01G4/232 , H01G4/012 , H01G4/30 , H01L2924/3511 , H05K1/0231 , H05K1/112 , H05K1/185 , H05K3/4602 , H05K2201/10674 , H05K2201/10712 , Y10T29/435
摘要： A capacitor comprising: a plurality of laminated dielectric layers; a plurality of inner electrode layers each disposed between mutually adjacent ones of the dielectric layers; and dummy electrode layers respectively disposed between the dielectric layers, disposed on sides closer to outer peripheral sides of the dielectric layers than to the inner electrode layers and disposed apart from the inner electrode layers.
摘要翻译：一种电容器，包括：多个叠层电介质层; 多个内部电极层，各自设置在相互相邻的电介质层之间; 以及分别设置在电介质层之间的虚设电极层，其设置在比内部电极层更靠近电介质层的外周侧的一侧并且与内部电极层分离。

2. 发明授权

US07778010B2 Method of manufacturing capacitor for incorporation in wiring board, capacitor for incorporation in wiring board, and wiring board 有权
标题翻译：制造用于配线基板的电容器的制造方法，配线基板的电容器以及配线基板
公开(公告)号：US07778010B2
公开(公告)日：2010-08-17
申请号：US12497198
申请日：2009-07-02
申请人： Motohiko Sato , Kazuhiro Hayashi , Akifumi Tosa , Kenji Murakami , Tomohide Yamada , Motonobu Kurahashi
发明人： Motohiko Sato , Kazuhiro Hayashi , Akifumi Tosa , Kenji Murakami , Tomohide Yamada , Motonobu Kurahashi
IPC分类号： H01G4/228
CPC分类号： H01G4/232 , H01G4/012 , H01G4/30 , H01L2924/3511 , H05K1/0231 , H05K1/112 , H05K1/185 , H05K3/4602 , H05K2201/10674 , H05K2201/10712 , Y10T29/435
摘要： A capacitor comprising: a plurality of laminated dielectric layers; a plurality of inner electrode layers each disposed between mutually adjacent ones of the dielectric layers; and dummy electrode layers respectively disposed between the dielectric layers, disposed on sides closer to outer peripheral sides of the dielectric layers than to the inner electrode layers and disposed apart from the inner electrode layers.
摘要翻译：一种电容器，包括：多个叠层电介质层; 多个内部电极层，各自设置在相互相邻的电介质层之间; 以及分别设置在电介质层之间的虚设电极层，其设置在比内部电极层更靠近电介质层的外周侧的一侧并且与内部电极层分离。

3. 发明授权

US07573697B2 Method of manufacturing capacitor for incorporation in wiring board, capacitor for incorporation in wiring board, and wiring board 有权
标题翻译：制造用于配线基板的电容器的制造方法，配线基板的电容器以及配线基板
公开(公告)号：US07573697B2
公开(公告)日：2009-08-11
申请号：US11512247
申请日：2006-08-30
申请人： Motohiko Sato , Kazuhiro Hayashi , Akifumi Tosa , Kenji Murakami , Tomohide Yamada , Motonobu Kurahashi
发明人： Motohiko Sato , Kazuhiro Hayashi , Akifumi Tosa , Kenji Murakami , Tomohide Yamada , Motonobu Kurahashi
IPC分类号： H01G4/228
CPC分类号： H01G4/232 , H01G4/012 , H01G4/30 , H01L2924/3511 , H05K1/0231 , H05K1/112 , H05K1/185 , H05K3/4602 , H05K2201/10674 , H05K2201/10712 , Y10T29/435
摘要： A capacitor comprising: a plurality of laminated dielectric layers; a plurality of inner electrode layers each disposed between mutually adjacent ones of the dielectric layers; and dummy electrode layers respectively disposed between the dielectric layers, disposed on sides closer to outer peripheral sides of the dielectric layers than to the inner electrode layers and disposed apart from the inner electrode layers.
摘要翻译：一种电容器，包括：多个叠层电介质层; 多个内部电极层，各自设置在相互相邻的电介质层之间; 以及分别设置在电介质层之间的虚设电极层，其设置在比内部电极层更靠近电介质层的外周侧的一侧并且与内部电极层分离。

4. 发明授权

US08304321B2 Capacitor to be incorporated in wiring substrate, method for manufacturing the capacitor, and wiring substrate 有权
标题翻译：配线基板中的电容器，电容器的制造方法以及布线基板
公开(公告)号：US08304321B2
公开(公告)日：2012-11-06
申请号：US12951895
申请日：2010-11-22
申请人： Motohiko Sato , Kazuhiro Hayashi , Kenji Murakami , Motonobu Kurahashi , Yusuke Kaieda , Jun Otsuka , Manabu Sato
发明人： Motohiko Sato , Kazuhiro Hayashi , Kenji Murakami , Motonobu Kurahashi , Yusuke Kaieda , Jun Otsuka , Manabu Sato
IPC分类号： H01L21/20
CPC分类号： H05K1/0231 , H01G4/228 , H01G4/30 , H01G4/38 , H01L23/49822 , H01L2924/0002 , H01L2924/3511 , H05K1/185 , H05K3/4602 , H05K2201/10712 , H01L2924/00
摘要： A wiring substrate in which a capacitor is provided, the capacitor comprising a capacitor body including a plurality of dielectric layers and internal electrode layers provided between the different dielectric layers, wherein said capacitor body has, in at least one side face of said capacitor body, recesses extending in a thickness direction of said capacitor body from at least one of a first principal face of said capacitor body and a second principal face positioned on the side opposite to the first principal face.
摘要翻译：一种电容器，其具有电容器，所述电容器包括：电容器主体，包括多个电介质层和设置在所述不同电介质层之间的内部电极层，其中所述电容器本体在所述电容器主体的至少一个侧面中，从所述电容器主体的第一主面和位于与所述第一主面相反的一侧的第二主面中的至少一个在所述电容器本体的厚度方向上延伸的凹部。

5. 发明授权

US08697534B2 Capacitor to be incorporated in wiring substrate, method for manufacturing the capacitor, and wiring substrate 有权
标题翻译：配线基板中的电容器，电容器的制造方法以及布线基板
公开(公告)号：US08697534B2
公开(公告)日：2014-04-15
申请号：US13610936
申请日：2012-09-12
申请人： Motohiko Sato , Kazuhiro Hayashi , Kenji Murakami , Motonobu Kurahashi , Yusuke Kaieda , Jun Otsuka , Manabu Sato
发明人： Motohiko Sato , Kazuhiro Hayashi , Kenji Murakami , Motonobu Kurahashi , Yusuke Kaieda , Jun Otsuka , Manabu Sato
IPC分类号： H01L21/20
CPC分类号： H05K1/0231 , H01G4/228 , H01G4/30 , H01G4/38 , H01L23/49822 , H01L2924/0002 , H01L2924/3511 , H05K1/185 , H05K3/4602 , H05K2201/10712 , H01L2924/00
摘要： A wiring substrate in which a capacitor is provided, the capacitor comprising a capacitor body including a plurality of dielectric layers and internal electrode layers provided between the different dielectric layers, wherein said capacitor body has, in at least one side face of said capacitor body, recesses extending in a thickness direction of said capacitor body from at least one of a first principal face of said capacitor body and a second principal face positioned on the side opposite to the first principal face.
摘要翻译：一种电容器，其具有电容器，所述电容器包括：电容器主体，包括多个电介质层和设置在所述不同电介质层之间的内部电极层，其中所述电容器本体在所述电容器主体的至少一个侧面中，从所述电容器主体的第一主面和位于与所述第一主面相反的一侧的第二主面中的至少一个在所述电容器本体的厚度方向上延伸的凹部。

6. 发明授权

US08350306B2 Capacitor to be incorporated in wiring substrate, method for manufacturing the capacitor, and wiring substrate 有权
标题翻译：配线基板中的电容器，电容器的制造方法以及布线基板
公开(公告)号：US08350306B2
公开(公告)日：2013-01-08
申请号：US12951739
申请日：2010-11-22
申请人： Motohiko Sato , Kazuhiro Hayashi , Kenji Murakami , Motonobu Kurahashi , Yusuke Kaieda , Jun Otsuka , Manabu Sato
发明人： Motohiko Sato , Kazuhiro Hayashi , Kenji Murakami , Motonobu Kurahashi , Yusuke Kaieda , Jun Otsuka , Manabu Sato
IPC分类号： H01L21/02
CPC分类号： H05K1/0231 , H01G4/228 , H01G4/30 , H01G4/38 , H01L23/49822 , H01L2924/0002 , H01L2924/3511 , H05K1/185 , H05K3/4602 , H05K2201/10712 , H01L2924/00
摘要： A wiring substrate in which a capacitor is provided, the capacitor comprising a capacitor body including a plurality of dielectric layers and internal electrode layers provided between the different dielectric layers, wherein said capacitor body has, in at least one side face of said capacitor body, recesses extending in a thickness direction of said capacitor body from at least one of a first principal face of said capacitor body and a second principal face positioned on the side opposite to the first principal face.
摘要翻译：一种电容器，其具有电容器，所述电容器包括：电容器主体，包括多个电介质层和设置在所述不同电介质层之间的内部电极层，其中所述电容器本体在所述电容器主体的至少一个侧面中，从所述电容器主体的第一主面和位于与所述第一主面相反的一侧的第二主面中的至少一个在所述电容器本体的厚度方向上延伸的凹部。

7. 发明申请

US20110083794A1 CAPACITOR TO BE INCORPORATED IN WIRING SUBSTRATE, METHOD FOR MANUFACTURING THE CAPACITOR, AND WIRING SUBSTRATE 有权
标题翻译：在配线基板中并入的电容器，制造电容器的方法和接线基板
公开(公告)号：US20110083794A1
公开(公告)日：2011-04-14
申请号：US12951895
申请日：2010-11-22
申请人： Motohiko Sato , Kazuhiro Hayashi , Kenji Murakami , Motonobu Kurahashi , Yusuke Kaieda , Jun Otsuka , Manabu Sato
发明人： Motohiko Sato , Kazuhiro Hayashi , Kenji Murakami , Motonobu Kurahashi , Yusuke Kaieda , Jun Otsuka , Manabu Sato
IPC分类号： B29C65/02
CPC分类号： H05K1/0231 , H01G4/228 , H01G4/30 , H01G4/38 , H01L23/49822 , H01L2924/0002 , H01L2924/3511 , H05K1/185 , H05K3/4602 , H05K2201/10712 , H01L2924/00
摘要： A wiring substrate in which a capacitor is provided, the capacitor comprising a capacitor body including a plurality of dielectric layers and internal electrode layers provided between the different dielectric layers, wherein said capacitor body has, in at least one side face of said capacitor body, recesses extending in a thickness direction of said capacitor body from at least one of a first principal face of said capacitor body and a second principal face positioned on the side opposite to the first principal face.
摘要翻译：一种电容器，其具有电容器，所述电容器包括：电容器主体，包括多个电介质层和设置在所述不同电介质层之间的内部电极层，其中所述电容器本体在所述电容器主体的至少一个侧面中，从所述电容器主体的第一主面和位于与所述第一主面相反的一侧的第二主面中的至少一个在所述电容器本体的厚度方向上延伸的凹部。

8. 发明授权

US07863662B2 Capacitor to be incorporated in wiring substrate, method for manufacturing the capacitor, and wiring substrate 有权
标题翻译：配线基板中的电容器，电容器的制造方法以及布线基板
公开(公告)号：US07863662B2
公开(公告)日：2011-01-04
申请号：US11643871
申请日：2006-12-22
申请人： Motohiko Sato , Kazuhiro Hayashi , Kenji Murakami , Motonobu Kurahashi , Yusuke Kaieda , Jun Otsuka , Manabu Sato
发明人： Motohiko Sato , Kazuhiro Hayashi , Kenji Murakami , Motonobu Kurahashi , Yusuke Kaieda , Jun Otsuka , Manabu Sato
IPC分类号： H01L21/02
CPC分类号： H05K1/0231 , H01G4/228 , H01G4/30 , H01G4/38 , H01L23/49822 , H01L2924/0002 , H01L2924/3511 , H05K1/185 , H05K3/4602 , H05K2201/10712 , H01L2924/00
摘要： A wiring substrate in which a capacitor is provided, the capacitor comprising a capacitor body including a plurality of dielectric layers and internal electrode layers provided between the different dielectric layers, wherein said capacitor body has, in at least one side face of said capacitor body, recesses extending in a thickness direction of said capacitor body from at least one of a first principal face of said capacitor body and a second principal face positioned on the side opposite to the first principal face.
摘要翻译：一种电容器，其具有电容器，所述电容器包括：电容器主体，包括多个电介质层和设置在所述不同电介质层之间的内部电极层，其中所述电容器本体在所述电容器主体的至少一个侧面中，从所述电容器主体的第一主面和位于与所述第一主面相反的一侧的第二主面中的至少一个在所述电容器本体的厚度方向上延伸的凹部。

9. 发明申请

US20070145449A1 Capacitor to be incorporated in wiring substrate, method for manufacturing the capacitor, and wiring substrate 有权
标题翻译：配线基板中的电容器，电容器的制造方法以及布线基板
公开(公告)号：US20070145449A1
公开(公告)日：2007-06-28
申请号：US11643871
申请日：2006-12-22
申请人： Motohiko Sato , Kazuhiro Hayashi , Kenji Murakami , Motonobu Kurahashi , Yusuke Kaieda , Jun Otsuka , Manabu Sato
发明人： Motohiko Sato , Kazuhiro Hayashi , Kenji Murakami , Motonobu Kurahashi , Yusuke Kaieda , Jun Otsuka , Manabu Sato
IPC分类号： H01L29/94
CPC分类号： H05K1/0231 , H01G4/228 , H01G4/30 , H01G4/38 , H01L23/49822 , H01L2924/0002 , H01L2924/3511 , H05K1/185 , H05K3/4602 , H05K2201/10712 , H01L2924/00
摘要： A wiring substrate in which a capacitor is provided, the capacitor comprising a capacitor body including a plurality of dielectric layers and internal electrode layers provided between the different dielectric layers, wherein said capacitor body has, in at least one side face of said capacitor body, recesses extending in a thickness direction of said capacitor body from at least one of a first principal face of said capacitor body and a second principal face positioned on the side opposite to the first principal face.
摘要翻译：一种电容器，其具有电容器，所述电容器包括：电容器主体，包括多个电介质层和设置在所述不同电介质层之间的内部电极层，其中所述电容器本体在所述电容器主体的至少一个侧面中，从所述电容器主体的第一主面和位于与所述第一主面相反的一侧的第二主面中的至少一个在所述电容器本体的厚度方向上延伸的凹部。

10. 发明授权

US07072169B2 Capacitor and method for manufacturing the same 失效
标题翻译：电容器及其制造方法
公开(公告)号：US07072169B2
公开(公告)日：2006-07-04
申请号：US11003767
申请日：2004-12-06
申请人： Kazuhiro Hayashi , Akifumi Tosa , Motohiko Sato , Jun Otsuka , Manabu Sato
发明人： Kazuhiro Hayashi , Akifumi Tosa , Motohiko Sato , Jun Otsuka , Manabu Sato
IPC分类号： H01G4/228
CPC分类号： H01G4/30 , H01G4/12
摘要： A laminated ceramic capacitor 10 divided into a first laminate 11, a second laminate 12, a third laminate 13, and a fourth laminate 14. The first laminate 11 includes a ceramic layer 15 serving as a dielectric layer. The ceramic layer 15 is thicker than a ceramic layer 17 sandwiched between internal electrodes 16a in the second laminate 12 or the fourth laminate 14, and thinner than 20 times the thickness of the ceramic layer 17. The third laminate 13 includes dielectric layers, which serve as the ceramic layers 17, and has a thickness of 5% of the total thickness of the second laminate 12 and the fourth laminate 14. Accordingly, the third laminate 13 achieves the function of absorbing an electrode-induced thickness differential. Also, by means of regulating the thickness of the first laminate 11, portions of via electrodes 18 that extend without being electrically connected to the internal electrodes 16b can be shortened.
摘要翻译：层叠陶瓷电容器10分为第一层压体11，第二层压体12，第三层压体13和第四层压体14.第一层压体11包括用作电介质层的陶瓷层15。陶瓷层15比夹在第二层叠体12或第四层叠体14的内部电极16a之间的陶瓷层17厚，比陶瓷层17的厚度薄20倍以上。第三层叠体13包括电介质层，用作陶瓷层17，并且具有第二层压体12和第四层压体14的总厚度的5％的厚度。因此，第三层压体13具有吸收电极引起的厚度差的功能。此外，通过调节第一层压体11的厚度，可以缩短延伸而不与内部电极16b电连接的通孔电极18的部分。

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