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    • 2. 发明申请
    • DISPLAY DEVICE AND DRIVING METHOD THEREOF
    • 显示装置及其驱动方法
    • US20140071027A1
    • 2014-03-13
    • US13751263
    • 2013-01-28
    • Guang hai JINDong-Gyu KIMKwan-Wook JUNGHo-Young KIMJune-Woo LEEIn-Ho CHOI
    • Guang hai JINDong-Gyu KIMKwan-Wook JUNGHo-Young KIMJune-Woo LEEIn-Ho CHOI
    • G09G3/32
    • G09G3/3233G09G3/3291G09G2300/0852G09G2300/0861
    • A display device includes a plurality of pixels, each pixel including an organic light emitting diode (OLED) and a driving transistor, a sustain power supply unit applying a first sustain voltage to a plurality of data lines connected to the plurality of pixels, and a data driver applying one of a data signal and a second sustain voltage to the plurality of data lines. For each pixel, the sustain power supply unit applies the first sustain voltage as a first level voltage to reset a gate voltage of the driving transistor and applies the first sustain voltage as a second level voltage to increase the gate voltage of the driving transistor. When an anode voltage of the OLED in each pixel is discharged to be reset, the anode voltage of the OLED is controlled according to a voltage difference between the first level voltage and the second level voltage.
    • 显示装置包括多个像素,每个像素包括有机发光二极管(OLED)和驱动晶体管,维持电源单元对连接到多个像素的多个数据线施加第一维持电压,以及 数据驱动器将数据信号和第二维持电压中的一个施加到多条数据线。 对于每个像素,维持电源单元施加第一维持电压作为第一电平电压以复位驱动晶体管的栅极电压,并施加第一维持电压作为第二电平电压以增加驱动晶体管的栅极电压。 当每个像素中的OLED的阳极电压被放电以被复位时,OLED的阳极电压根据第一电平电压和第二电平电压之间的电压差来控制。
    • 8. 发明申请
    • METHOD OF FABRICATING SELF-ALIGNED CONTACT PAD USING CHEMICAL MECHANICAL POLISHING PROCESS
    • 使用化学机械抛光工艺制作自对准接触垫的方法
    • US20100124817A1
    • 2010-05-20
    • US12694715
    • 2010-01-27
    • Ho-Young KIMChang-Ki HONGBo-Un YOONJoon-Sang PARK
    • Ho-Young KIMChang-Ki HONGBo-Un YOONJoon-Sang PARK
    • H01L21/3213H01L21/28
    • H01L21/76897H01L21/7684H01L27/10873H01L27/10885
    • A method of fabricating a self-aligned contact pad (SAC) includes forming stacks of a conductive line and a capping layer on a semiconductor substrate, spacers covering sidewalls of the stacks, and an insulation layer filling gaps between the stacks and exposing the top of the capping layer, etching the capping layer to form damascene grooves, forming a plurality of first etching masks with a material different from that of the capping layer to fill the damascene grooves without covering the top of the insulation layer, and forming a second etching mask having an opening region that exposes some of the first etching masks and a portion of the insulation layer located between the first etching masks. The method further includes etching the portion of the insulation layer exposed by the opening region using the first and second etching masks to form a plurality of opening holes, removing the second etching mask, forming a conductive layer filling the opening holes to cover the remaining first etching masks and performing a chemical mechanical polishing (CMP) process on the conductive layer using the capping layer as a polishing end point to remove the first etching masks such that a plurality of SAC pads separated from each other are formed that fill the opening holes.
    • 一种制造自对准接触焊盘(SAC)的方法包括在半导体衬底上形成导电线和覆盖层的叠层,覆盖堆叠的侧壁的间隔物和填充堆叠之间的间隙的绝缘层, 覆盖层,蚀刻覆盖层以形成镶嵌槽,用不同于覆盖层的材料形成多个第一蚀刻掩模以填充镶嵌槽而不覆盖绝缘层的顶部,以及形成第二蚀刻掩模 具有暴露一些第一蚀刻掩模的开口区域和位于第一蚀刻掩模之间的绝缘层的一部分。 该方法还包括使用第一和第二蚀刻掩模蚀刻由开口区域暴露的绝缘层的部分,以形成多个开孔,去除第二蚀刻掩模,形成填充开孔的导电层以覆盖剩余的第一 蚀刻掩模并使用覆盖层作为抛光终点在导电层上进行化学机械抛光(CMP)工艺,以去除第一蚀刻掩模,从而形成填充开孔的彼此分离的多个SAC焊盘。