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    • 2. 发明申请
    • Symmetrical high frequency SCR structure and method
    • 对称高频SCR结构及方法
    • US20050006706A1
    • 2005-01-13
    • US10615171
    • 2003-07-09
    • Evgueniy StefanovRene Escoffier
    • Evgueniy StefanovRene Escoffier
    • H01L21/762H01L27/02H01L29/74H01L29/76H01L21/332
    • H01L27/0262H01L21/76224H01L29/7436
    • In one embodiment, an SCR device (41) includes a p+ wafer (417), a p− layer (416), an n+ buried layer (413) and an n− layer (414). P− wells (411,421) are formed in the n− layer (414). N+ regions (412,422) and p+ regions (415,425) are formed in the p− wells (411,421). A first ohmic contact (431) couples one n+ regions (422) to one p+ region (425). A second ohmic contact (433) couples another n+ region (412) to another p+ region (415) to provide physically and electrically symmetrical low-voltage p-n-p-n silicon controlled rectifiers. A deep isolation trench (419) surrounding the SCR device (41) and dopant concentration profiles provide a low capacitance SCR design for protecting high frequency integrated circuits from electrostatic discharges.
    • 在一个实施例中,SCR器件(41)包括p +晶片(417),p-层(416),n +掩埋层(413)和n-层(414)。 P-阱(411,421)形成在n-层(414)中。 在p-阱(411,421)中形成N +区(412,422)和p +区(415,425)。 第一欧姆接触(431)将一个n +区(422)耦合到一个p +区(425)。 第二欧姆接触件(433)将另一个n +区域(412)耦合到另一个p +区域(415),以提供物理和电对称的低压p-n-p-n可控硅整流器。 围绕SCR器件(41)的深隔离沟槽(419)和掺杂剂浓度分布提供了用于保护高频集成电路免受静电放电的低电容SCR设计。
    • 3. 发明申请
    • SEMICONDUCTOR DEVICE AND METHOD OF FORMING A SEMICONDUCTOR DEVICE
    • 半导体器件及形成半导体器件的方法
    • US20100001344A1
    • 2010-01-07
    • US12522036
    • 2007-01-10
    • Evgueniy StefanovIvana DeramJean-Michel Reynes
    • Evgueniy StefanovIvana DeramJean-Michel Reynes
    • H01L29/78H01L21/22
    • H01L29/66719H01L29/0623H01L29/0634H01L29/42372H01L29/66712H01L29/7395H01L29/7811H01L29/8083
    • A method of forming a semiconductor device having an active area and a termination area surrounding the active area comprises providing a semiconductor substrate, providing a semiconductor layer of a first conductivity type over the semiconductor substrate and forming a mask layer over the semiconductor layer. The mask layer outlines at least two portions of a surface of the semiconductor layer: a first outlined portion outlining a floating region in the active area and a second outlined portion outlining a termination region in the termination area. Semiconductor material of a second conductivity type is provided to the first and second outlined portions so as to provide a floating region of the second conductivity type buried in the semiconductor layer in the active area and a first termination region of the second conductivity type buried in the semiconductor layer in the termination area of the semiconductor device.
    • 形成具有有源区域和围绕有源区域的端接区域的半导体器件的方法包括提供半导体衬底,在半导体衬底上提供第一导电类型的半导体层,并在半导体层上形成掩模层。 掩模层概述半导体层的表面的至少两部分:概述有源区域中的浮动区域的第一轮廓部分和概述终止区域中的终止区域的第二轮廓部分。 将第二导电类型的半导体材料提供给第一和第二轮廓部分,以便提供掩埋在有源区域中的半导体层中的第二导电类型的浮动区域和埋在第二导电类型中的第二导电类型的第一端接区域 半导体器件的端接区域中的半导体层。
    • 9. 发明授权
    • Semiconductor device and method of forming a semiconductor device
    • 半导体装置及其制造方法
    • US08217448B2
    • 2012-07-10
    • US12522033
    • 2007-01-04
    • Evgueniy StefanovAlain DeramJean-Michel Reynes
    • Evgueniy StefanovAlain DeramJean-Michel Reynes
    • H01L21/336H01L29/78
    • H01L29/7802H01L29/0878H01L29/42368H01L29/66712
    • A method of forming a semiconductor device comprises providing a semiconductor substrate, providing a semiconductor layer of a first conductivity type over the semiconductor substrate, forming a first region of the first conductivity type in the semiconductor layer, and forming a control region over the semiconductor layer and over part of the first region. A mask layer is formed over the semiconductor layer and outlines a first portion of a surface of the semiconductor layer over part of the first region. Semiconductor material of a second conductivity type is provided to the outlined first portion to provide a second region in the semiconductor layer. The first region and second region are driven into the semiconductor layer so as to form a pre-control region of the first conductivity type extending into the semiconductor layer from the surface and under a portion of the control region and a graded body region of the second conductivity type extending into the semiconductor layer under the pre-control region. A body region is formed by providing semiconductor material of the second conductivity type to the outlined first portion. The body region extends into the pre-control region. A current electrode region is formed in the body region.
    • 一种形成半导体器件的方法包括提供半导体衬底,在半导体衬底上提供第一导电类型的半导体层,在半导体层中形成第一导电类型的第一区域,并在半导体层上形成控制区域 和第一个地区的一部分。 在半导体层上形成掩模层,并且在第一区域的一部分上划出半导体层的表面的第一部分。 第二导电类型的半导体材料被提供到轮廓的第一部分以在半导体层中提供第二区域。 第一区域和第二区域被驱动到半导体层中,以便形成从控制区域的表面和部分控制区域延伸到半导体层的第一导电类型的预置区域和第二区域的分级体区域 导电类型延伸到预控制区域下方的半导体层。 通过将第二导电类型的半导体材料提供给轮廓的第一部分来形成体区。 身体区域延伸到预控区域内。 在身体区域中形成电流电极区域。
    • 10. 发明授权
    • Method of forming a semiconductor device having an active area and a termination area
    • 形成具有有源区和终端区的半导体器件的方法
    • US07955929B2
    • 2011-06-07
    • US12522036
    • 2007-01-10
    • Evgueniy StefanovIvana DeramJean-Michel Reynes
    • Evgueniy StefanovIvana DeramJean-Michel Reynes
    • H01L21/336H01L21/425
    • H01L29/66719H01L29/0623H01L29/0634H01L29/42372H01L29/66712H01L29/7395H01L29/7811H01L29/8083
    • A method of forming a semiconductor device having an active area and a termination area surrounding the active area comprises providing a semiconductor substrate, providing a semiconductor layer of a first conductivity type over the semiconductor substrate and forming a mask layer over the semiconductor layer. The mask layer outlines at least two portions of a surface of the semiconductor layer: a first outlined portion outlining a floating region in the active area and a second outlined portion outlining a termination region in the termination area. Semiconductor material of a second conductivity type is provided to the first and second outlined portions so as to provide a floating region of the second conductivity type buried in the semiconductor layer in the active area and a first termination region of the second conductivity type buried in the semiconductor layer in the termination area of the semiconductor device.
    • 形成具有有源区域和围绕有源区域的端接区域的半导体器件的方法包括提供半导体衬底,在半导体衬底上提供第一导电类型的半导体层,并在半导体层上形成掩模层。 掩模层概述半导体层的表面的至少两部分:概述有源区域中的浮动区域的第一轮廓部分和概述终止区域中的终止区域的第二轮廓部分。 将第二导电类型的半导体材料提供给第一和第二轮廓部分,以便提供掩埋在有源区域中的半导体层中的第二导电类型的浮动区域和埋在第二导电类型中的第二导电类型的第一端接区域 半导体器件的端接区域中的半导体层。