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    • 1. 发明授权
    • Overmold component seal in an electronic device housing
    • 电子设备外壳中的二次密封组件密封
    • US07359144B2
    • 2008-04-15
    • US11168283
    • 2005-06-28
    • Mo XuJohaan S. J. KoongChinHup ChuaKhaiYi AuYeongKokWah Tan
    • Mo XuJohaan S. J. KoongChinHup ChuaKhaiYi AuYeongKokWah Tan
    • G11B33/14B29C45/14
    • G11B25/043G11B5/11G11B5/4833G11B33/1466
    • In general, the invention is directed to techniques for forming a seal between parts of an overmold component. The overmold component includes a first part forming one or more thorough-holes and a second part overmolded to the first part. A through-hole may be, for example, a screw hole or an overmold material entrance hole. The through-holes formed by the first part are surrounded by an adhesive prior to overmolding the second part. After overmolding, the adhesive locally bonds the surface of the first part to the overmold part to make a seal around the through holes. For example, the overmold component may combine with a cover to form a housing of a disc drive or other electronic device defining an internal environment. In this example, the adhesive prevents external contaminants from entering the internal environment via the through-holes.
    • 通常,本发明涉及用于在包覆成型部件的部件之间形成密封件的技术。 包覆成型部件包括形成一个或多个通孔的第一部分和包覆模制到第一部分的第二部分。 通孔可以是例如螺孔或者包覆成型材料入口孔。 在第二部分包覆成型之前,由第一部分形成的通孔被粘合剂包围。 在包覆模制之后,粘合剂将第一部分的表面局部地粘合到包覆模制部分上以围绕通孔进行密封。 例如,包覆成型部件可以与盖组合以形成限定内部环境的盘驱动器或其他电子装置的壳体。 在该示例中,粘合剂防止外部污染物通过通孔进入内部环境。
    • 2. 发明申请
    • Overmold component seal in an electronic device housing
    • 电子设备外壳中的二次密封组件密封
    • US20060291093A1
    • 2006-12-28
    • US11168283
    • 2005-06-28
    • Mo XuJohaan KoongChinHup ChuaKhaiYi AuYeongKokWah Tan
    • Mo XuJohaan KoongChinHup ChuaKhaiYi AuYeongKokWah Tan
    • G11B17/00G11B17/08G11B5/012
    • G11B25/043G11B5/11G11B5/4833G11B33/1466
    • In general, the invention is directed to techniques for forming a seal between parts of an overmold component. The overmold component includes a first part forming one or more thorough-holes and a second part overmolded to the first part. A through-hole may be, for example, a screw hole or an overmold material entrance hole. The through-holes formed by the first part are surrounded by an adhesive prior to overmolding the second part. After overmolding, the adhesive locally bonds the surface of the first part to the overmold part to make a seal around the through holes. For example, the overmold component may combine with a cover to form a housing of a disc drive or other electronic device defining an internal environment. In this example, the adhesive prevents external contaminants from entering the internal environment via the through-holes.
    • 通常,本发明涉及用于在包覆成型部件的部件之间形成密封件的技术。 包覆成型部件包括形成一个或多个通孔的第一部分和包覆模制到第一部分的第二部分。 通孔可以是例如螺孔或者包覆成型材料入口孔。 在第二部分包覆成型之前,由第一部分形成的通孔被粘合剂包围。 在包覆模制之后,粘合剂将第一部分的表面局部地粘合到包覆模制部分上以围绕通孔进行密封。 例如,包覆成型部件可以与盖组合以形成限定内部环境的盘驱动器或其他电子装置的壳体。 在该示例中,粘合剂防止外部污染物通过通孔进入内部环境。
    • 7. 发明申请
    • Housing for an electronic device
    • 电子设备外壳
    • US20070278909A1
    • 2007-12-06
    • US11446996
    • 2006-06-05
    • Mo XuJohaan S.J. Koong
    • Mo XuJohaan S.J. Koong
    • H02K11/00
    • G11B25/043G11B33/025G11B33/1446G11B33/1493
    • Embodiments of the invention are directed to electronic device housings and may be particularly applicable to portable electronic devices. In an embodiment, an assembly comprises a first housing element that forms a first recess, a second housing element that contacts the first housing element, wherein the first recess faces away from the second housing element and the second recess faces towards the first housing element, wherein the first housing element and the second housing element combine to form an enclosure, and an electronic component within the enclosure. Embodiments of the invention increase shielding of electronic components within the housing and also reduce leakage paths through an interface between elements of the housing.
    • 本发明的实施例涉及电子设备外壳,并且可以特别适用于便携式电子设备。 在一个实施例中,组件包括形成第一凹部的第一壳体元件,与第一壳体元件接触的第二壳体元件,其中第一凹槽背离第二壳体元件并且第二凹槽面向第一壳体元件, 其中所述第一壳体元件和所述第二壳体元件组合以形成外壳,以及所述外壳内的电子元件。 本发明的实施例增加了壳体内的电子部件的屏蔽,还减少了通过壳体的元件之间的界面的泄漏路径。