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1. 发明授权

US07553400B2 Plating apparatus and plating method 失效
标题翻译：电镀装置及电镀方法
公开(公告)号：US07553400B2
公开(公告)日：2009-06-30
申请号：US11016924
申请日：2004-12-21
申请人： Mizuki Nagai , Hiroyuki Kanda , Keiichi Kurashina , Satoru Yamamoto , Ryoichi Kimizuka , Hariklia Deligianni , Brett Baker , Keith Kwietniak , Panayotis Andricacos , Phillipe Vereecken
发明人： Mizuki Nagai , Hiroyuki Kanda , Keiichi Kurashina , Satoru Yamamoto , Ryoichi Kimizuka , Hariklia Deligianni , Brett Baker , Keith Kwietniak , Panayotis Andricacos , Phillipe Vereecken
IPC分类号： C25D5/22
CPC分类号： C25D3/38 , C25D5/02 , C25D5/18 , C25D7/123 , C25D17/001 , C25D17/007 , C25D17/008 , H01L21/2885 , H01L21/76877
摘要： A plating method is capable of mechanically and electrochemically preferentially depositing a plated film in fine interconnect recesses such as trenches and via holes, and depositing the plated film to a flatter surface. The plating method including: disposing a substrate having fine interconnect recesses such that a conductive layer faces an anode; disposing a porous member between the substrate and the anode; filling a plating solution between the substrate and the anode; and repeating a process of holding the conductive layer and the porous member in contact with each other and moving the conductive layer and the porous member relatively to each other, a process of passing an electric current between the conductive layer and the anode while keeping the conductive layer still with respect to the porous member, and a process of stopping the supply of the electric current between the conductive layer and the anode.
摘要翻译：电镀方法能够机械地和电化学地优先在诸如沟槽和通孔的精细互连凹槽中沉积镀膜，并将镀膜沉积到更平坦的表面上。电镀方法包括：设置具有导电层面向阳极的细微互连凹槽的衬底; 在基板和阳极之间设置多孔构件; 在基板和阳极之间填充电镀液; 并且重复保持导电层和多孔构件彼此接触并相对于彼此移动导电层和多孔构件的过程，使导电层和阳极之间的电流通过，同时保持导电相对于多孔构件的静止层，以及停止在导电层和阳极之间的电流的供给的处理。

2. 发明申请

US20050241946A1 Plating apparatus and plating method 失效
标题翻译：电镀装置及电镀方法
公开(公告)号：US20050241946A1
公开(公告)日：2005-11-03
申请号：US11016924
申请日：2004-12-21
申请人： Mizuki Nagai , Hiroyuki Kanda , Keiichi Kurashina , Satoru Yamamoto , Ryoichi Kimizuka , Hariklia Deligianni , Brett Baker , Keith Kwietniak , Panayotis Andricacos , Philippe Vereecken
发明人： Mizuki Nagai , Hiroyuki Kanda , Keiichi Kurashina , Satoru Yamamoto , Ryoichi Kimizuka , Hariklia Deligianni , Brett Baker , Keith Kwietniak , Panayotis Andricacos , Philippe Vereecken
IPC分类号： C25D3/38 , C25D5/00 , C25D5/02 , C25D5/08 , C25D5/18 , C25D7/12 , C25D17/00 , H01L21/288 , H01L21/768
CPC分类号： C25D3/38 , C25D5/02 , C25D5/18 , C25D7/123 , C25D17/001 , C25D17/007 , C25D17/008 , H01L21/2885 , H01L21/76877
摘要： A plating method is capable of mechanically and electrochemically preferentially depositing a plated film in fine interconnect recesses such as trenches and via holes, and depositing the plated film to a flatter surface. The plating method including: disposing a substrate having fine interconnect recesses such that a conductive layer faces an anode; disposing a porous member between the substrate and the anode; filling a plating solution between the substrate and the anode; and repeating a process of holding the conductive layer and the porous member in contact with each other and moving the conductive layer and the porous member relatively to each other, a process of passing an electric current between the conductive layer and the anode while keeping the conductive layer still with respect to the porous member, and a process of stopping the supply of the electric current between the conductive layer and the anode.
摘要翻译：电镀方法能够机械地和电化学地优先在诸如沟槽和通孔的精细互连凹槽中沉积镀膜，并将镀膜沉积到更平坦的表面上。电镀方法包括：设置具有导电层面向阳极的细微互连凹槽的衬底; 在基板和阳极之间设置多孔构件; 在基板和阳极之间填充电镀液; 并且重复保持导电层和多孔构件彼此接触并相对于彼此移动导电层和多孔构件的过程，使导电层和阳极之间的电流通过，同时保持导电相对于多孔构件的静止层，以及停止在导电层和阳极之间的电流的供给的处理。

3. 发明申请

US20050077173A1 Plating apparatus for substrate 有权
标题翻译：基板电镀装置
公开(公告)号：US20050077173A1
公开(公告)日：2005-04-14
申请号：US10930823
申请日：2004-09-01
申请人： Keiichi Kurashina , Mizuki Nagai , Satoru Yamamoto , Hiroyuki Kanda , Koji Mishima , Brett Baker , Hariklia Deligianni , Phillipe Vereecken
发明人： Keiichi Kurashina , Mizuki Nagai , Satoru Yamamoto , Hiroyuki Kanda , Koji Mishima , Brett Baker , Hariklia Deligianni , Phillipe Vereecken
IPC分类号： C25D17/14 , C25D7/12 , C25D17/00 , H01L21/288
CPC分类号： C25D7/123 , C25D17/001 , C25D17/004 , C25D17/008 , H01L21/2885
摘要： The present invention provides a plating apparatus for a substrate which can plate a substrate under uniform pressure without increasing a load to be applied while holding the entire surface of a porous member in contact with the surface, to be plated, of the substrate. The plating apparatus for a substrate, including: a substrate holder for holding a substrate; a cathode unit having a seal member for abutting against and sealing, in a water-tight manner, a peripheral portion of a surface, to be plated, of the substrate held by the substrate holder, and a cathode electrode which is brought into contact with the substrate to supply current to the substrate; an anode vertically moveable disposed in confronting relation to the surface, to be plated, of the substrate; a plating solution impregnated material disposed between the anode and the surface, to be plated, of the substrate, the plating solution impregnated material being made of a water-retentive material; and a porous member disposed between the plating solution impregnated material and the surface, to be plated, of the substrate; wherein the plating solution impregnated material is constructed of a plurality of separate members.
摘要翻译：本发明提供了一种用于基板的电镀装置，其能够在保持多孔构件的整个表面与基板的被镀表面接触的同时，在均匀的压力下对基板进行平板化，而不增加要施加的载荷。一种基板电镀装置，包括：用于保持基板的基板支架; 阴极单元，具有密封构件，该密封构件以水密方式邻接并密封被基板保持件保持的基板的待镀表面的周边部分，以及与基板保持件接触的阴极电极所述基板向所述基板提供电流; 可垂直移动的阳极，其被布置成与所述基板的要被电镀的表面相对; 电镀溶液浸渍材料，其设置在阳极和要被电镀的表面之间，所述电镀液浸渍材料由保水材料制成; 以及设置在所述电镀溶液浸渍材料和要被电镀的所述表面的多孔构件之间; 其中所述电镀溶液浸渍材料由多个分开的构件构成。

4. 发明授权

US07311809B2 Plating apparatus for substrate 有权
标题翻译：基板电镀装置
公开(公告)号：US07311809B2
公开(公告)日：2007-12-25
申请号：US10930823
申请日：2004-09-01
申请人： Keiichi Kurashina , Mizuki Nagai , Satoru Yamamoto , Hiroyuki Kanda , Koji Mishima , Brett Baker , Hariklia Deligianni , Phillipe Vereecken
发明人： Keiichi Kurashina , Mizuki Nagai , Satoru Yamamoto , Hiroyuki Kanda , Koji Mishima , Brett Baker , Hariklia Deligianni , Phillipe Vereecken
IPC分类号： C25D17/00
CPC分类号： C25D7/123 , C25D17/001 , C25D17/004 , C25D17/008 , H01L21/2885
摘要： The present invention provides a plating apparatus for a substrate which can plate a substrate under uniform pressure without increasing a load to be applied while holding the entire surface of a porous member in contact with the surface, to be plated, of the substrate. The plating apparatus for a substrate, includes: a substrate holder for holding a substrate; a cathode unit having a seal member for abutting against and sealing, in a water-tight manner, a peripheral portion of a surface, to be plated, of the substrate held by the substrate holder, and a cathode electrode which is brought into contact with the substrate to supply current to the substrate. An anode which is vertically moveable is disposed in confronting relation to the surface, to be plated, of the substrate; a plating solution impregnated material is disposed between the anode and the surface, to be plated, of the substrate, the plating solution impregnated material being made of a water-retentive material; and a porous member is disposed between the plating solution impregnated material and the surface, to be plated, of the substrate. The plating solution impregnated material is constructed of a plurality of separate members.
摘要翻译：本发明提供了一种用于基板的电镀装置，其能够在保持多孔构件的整个表面与基板的被镀表面接触的同时，在均匀的压力下对基板进行平板化，而不增加要施加的载荷。用于基板的电镀装置包括：用于保持基板的基板保持器; 阴极单元，具有密封构件，该密封构件以水密方式邻接并密封被基板保持件保持的基板的待镀表面的周边部分，以及与基板保持件接触的阴极电极该基板向基板提供电流。可垂直移动的阳极以与基板的待镀表面相对的方式设置; 电镀溶液浸渍材料设置在阳极和待镀覆的表面之间，电镀液浸渍材料由保水材料制成; 并且多孔构件设置在电镀溶液浸渍材料和要被电镀的表面之间。电镀溶液浸渍材料由多个分开的构件构成。

5. 发明申请

US20050061659A1 Plating apparatus and plating method 审中-公开
标题翻译：电镀装置及电镀方法
公开(公告)号：US20050061659A1
公开(公告)日：2005-03-24
申请号：US10886716
申请日：2004-07-09
申请人： Keiichi Kurashina , Mizuki Nagai , Satoru Yamamoto , Hiroyuki Kanda , Koji Mishima , Brett Baker , Keith Kwietniak , Hariklia Deligianni , Panos Andricacos
发明人： Keiichi Kurashina , Mizuki Nagai , Satoru Yamamoto , Hiroyuki Kanda , Koji Mishima , Brett Baker , Keith Kwietniak , Hariklia Deligianni , Panos Andricacos
IPC分类号： C25D7/12 , C25D5/06 , C25D5/08 , C25D5/18 , C25D5/22 , C25D17/00 , C25D17/14 , C25D21/00 , C25D21/12 , H01L21/00 , H01L21/02 , H01L21/288 , H01L21/677 , H01L21/768
CPC分类号： H01L21/288 , C25D5/06 , C25D5/08 , C25D7/123 , C25D17/001 , H01L21/02068 , H01L21/02074 , H01L21/02087 , H01L21/0209 , H01L21/2885 , H01L21/67028 , H01L21/6708 , H01L21/67109 , H01L21/6723 , H01L21/67751 , H01L21/7684 , H01L21/76849 , H01L21/76877
摘要： A plating apparatus is used for filling a fine interconnect pattern formed in a substrate with metal to form interconnects. The plating apparatus includes a cathode unit having a seal member for hermetically sealing a peripheral portion of a surface, to be plated, of the substrate and a cathode electrode which is brought into contact with the substrate to supply current to the substrate; an electrode head disposed so as to be movable toward and away from the surface to be plated and having an anode and a porous member with water retentivity at upper and lower parts of the electrode head; a pressing mechanism for pressing the porous member against the surface, to be plated, of the substrate under a desired pressure; and a driving mechanism for making a relative motion between the porous member and the substrate while the porous member and the surface, to be plated, of the substrate are brought into contact with each other.
摘要翻译：电镀装置用于用金属填充形成在衬底中的精细互连图案以形成互连。电镀装置包括：阴极单元，具有密封部件，用于密封要被电镀的基板的周边部分和与基板接触的阴极电极，以向基板提供电流; 电极头，其设置成能够朝向和远离待镀表面移动，并且在电极头的上部和下部具有阳极和具有保水性的多孔构件; 用于在所需压力下将所述多孔构件按压在所述基板的要被电镀的表面上的按压机构; 以及用于在多孔构件和被电镀的表面彼此接触的同时在多孔构件和基底之间进行相对运动的驱动机构。

6. 发明授权

US07479213B2 Plating method and plating apparatus 失效
标题翻译：电镀方法和电镀装置
公开(公告)号：US07479213B2
公开(公告)日：2009-01-20
申请号：US11020068
申请日：2004-12-23
申请人： Mizuki Nagai , Hiroyuki Kanda , Keiichi Kurashina , Satoru Yamamoto , Hidenao Suzuki , Koji Mishima , Brett C. Baker-O'Neal , Hariklia Deligianni , Keith Kwietniak
发明人： Mizuki Nagai , Hiroyuki Kanda , Keiichi Kurashina , Satoru Yamamoto , Hidenao Suzuki , Koji Mishima , Brett C. Baker-O'Neal , Hariklia Deligianni , Keith Kwietniak
IPC分类号： C25D5/10
CPC分类号： C25D17/001 , C25D5/10 , C25D5/18 , C25D7/123 , H01L21/2885 , H01L21/7684 , H01L21/76877
摘要： A plating method is capable of preferentially precipitating a plated film fully and uniformly in trenches and via holes according to a mechanical and electrochemical process, and of easily forming a plated film having higher flatness surface without being affected by variations in the shape of trenches and via holes. The plating method includes a first plating process and a second plating process. The second plating process is performed by filling a plating solution between an anode and a substrate, with a porous member placed in the plating solution, repeatedly bringing the porous member and the substrate into and out of contact with each other, passing a current between the anode and the substrate while the porous member is being held in contact with the substrate.
摘要翻译：电镀方法能够根据机械和电化学方法优先将电镀膜完全均匀地沉积在沟槽和通孔中，并且容易地形成具有较高平坦度表面的电镀膜，而不受沟槽形状和通孔形状的变化的影响孔。电镀方法包括第一电镀工艺和第二电镀工艺。通过在阳极和基板之间填充电镀液，将多孔构件放置在电镀液中，反复使多孔构件和基板彼此接触和脱离接触来进行第二电镀工艺，使电流在阳极和衬底，同时多孔构件被保持与衬底接触。

7. 发明申请

US20060086616A1 Plating apparatus and plating method 失效
标题翻译：电镀装置及电镀方法
公开(公告)号：US20060086616A1
公开(公告)日：2006-04-27
申请号：US11245490
申请日：2005-10-07
申请人： Keiichi Kurashina , Mizuki Nagai , Satoru Yamamoto , Hiroyuki Kanda , Koji Mishima , Shinya Morisawa , Junji Kunisawa , Kunihito Ide , Hidenao Suzuki , Emanuel Cooper , Philippe Vereecken , Brett Baker-O' Neal , Hariklia Deligianni
发明人： Keiichi Kurashina , Mizuki Nagai , Satoru Yamamoto , Hiroyuki Kanda , Koji Mishima , Shinya Morisawa , Junji Kunisawa , Kunihito Ide , Hidenao Suzuki , Emanuel Cooper , Philippe Vereecken , Brett Baker-O' Neal , Hariklia Deligianni
IPC分类号： C25D21/12 , C25B15/00
CPC分类号： C25D5/22 , C25D5/18 , C25D7/123 , C25D17/001 , C25D17/002 , C25D17/004 , C25D17/005 , C25D17/12 , C25D21/12 , H01L21/2885 , H01L21/7684 , H01L21/76849 , H01L21/76877
摘要： A plating apparatus can securely carry out a flattening plating of a substrate to form a plated film having a flat surface without using a costly mechanism, and without applying an extra plating to the substrate. The plating apparatus includes a substrate holder; a cathode section having a seal member for watertightly sealing a peripheral portion of the substrate, and a cathode electrode for supplying an electric current to the substrate; an anode disposed in a position facing the surface of the substrate; a porous member disposed between the anode and the surface of the substrate; a constant-voltage control section for controlling a voltage applied between the cathode electrode and the anode at a constant value; and a current monitor section for monitoring an electric current flowing between the cathode electrode and the anode, and feeding back a detection signal to the constant-voltage control section.
摘要翻译：电镀装置可以可靠地进行基板的平坦化镀以形成具有平坦表面的镀膜而不使用昂贵的机构，并且不对基板施加额外的电镀。电镀装置包括：基板支架; 具有用于水密密封基板的周边部分的密封部件的阴极部分和用于向基板供给电流的阴极电极; 设置在面向所述基板的表面的位置的阳极; 设置在所述阳极和所述基板的表面之间的多孔构件; 恒定电压控制部分，用于以恒定值控制在所述阴极和所述阳极之间施加的电压; 以及电流监视部分，用于监视在阴极和阳极之间流动的电流，并将检测信号反馈到恒压控制部分。

8. 发明申请

US20100219078A1 PLATING APPARATUS AND PLATING METHOD 审中-公开
标题翻译：电镀设备和电镀方法
公开(公告)号：US20100219078A1
公开(公告)日：2010-09-02
申请号：US12771056
申请日：2010-04-30
申请人： Keiichi KURASHINA , Mizuki Nagai , Satoru Yamamoto , Hiroyuki Kanda , Koji Mishima , Shinya Morisawa , Junji Kunisawa , Kunihito Ide , Hidenao Suzuki , Emanuel Cooper , Philippe Vereecken , Brett Baker-O'Neal , Hariklia Deligianni
发明人： Keiichi KURASHINA , Mizuki Nagai , Satoru Yamamoto , Hiroyuki Kanda , Koji Mishima , Shinya Morisawa , Junji Kunisawa , Kunihito Ide , Hidenao Suzuki , Emanuel Cooper , Philippe Vereecken , Brett Baker-O'Neal , Hariklia Deligianni
IPC分类号： C25D21/12 , C25D5/00
CPC分类号： C25D5/22 , C25D5/18 , C25D7/123 , C25D17/001 , C25D17/002 , C25D17/004 , C25D17/005 , C25D17/12 , C25D21/12 , H01L21/2885 , H01L21/7684 , H01L21/76849 , H01L21/76877
摘要： A plating apparatus securely carries out a flattening plating of a substrate to form a plated film having a flat surface without using a costly mechanism, and without applying an extra plating to the substrate. The plating apparatus includes a substrate holder; a cathode section having a seal member for watertightly sealing a peripheral portion of the substrate, and a cathode electrode for supplying an electric current to the substrate; an anode disposed in a position facing the surface of the substrate; a porous member disposed between the anode and the surface of the substrate; a constant-voltage control section for controlling a voltage applied between the cathode electrode and the anode at a constant value; and a current monitor section for monitoring an electric current flowing between the cathode electrode and the anode, and feeding back a detection signal to the constant-voltage control section.
摘要翻译：电镀装置可以牢固地进行基板的平坦化镀以形成具有平坦表面的镀膜而不使用昂贵的机构，并且不对基板施加额外的电镀。电镀装置包括：基板支架; 具有用于水密密封基板的周边部分的密封部件的阴极部分和用于向基板供给电流的阴极电极; 设置在面向所述基板的表面的位置的阳极; 设置在所述阳极和所述基板的表面之间的多孔构件; 恒定电压控制部分，用于以恒定值控制在所述阴极和所述阳极之间施加的电压; 以及电流监视部分，用于监视在阴极和阳极之间流动的电流，并将检测信号反馈到恒压控制部分。

9. 发明授权

US07736474B2 Plating apparatus and plating method 失效
标题翻译：电镀装置及电镀方法
公开(公告)号：US07736474B2
公开(公告)日：2010-06-15
申请号：US11245490
申请日：2005-10-07
申请人： Keiichi Kurashina , Mizuki Nagai , Satoru Yamamoto , Hiroyuki Kanda , Koji Mishima , Shinya Morisawa , Junji Kunisawa , Kunihito Ide , Hidenao Suzuki , Emanuel Cooper , Philippe Vereecken , Brett Baker-O'Neal , Hariklia Deligianni
发明人： Keiichi Kurashina , Mizuki Nagai , Satoru Yamamoto , Hiroyuki Kanda , Koji Mishima , Shinya Morisawa , Junji Kunisawa , Kunihito Ide , Hidenao Suzuki , Emanuel Cooper , Philippe Vereecken , Brett Baker-O'Neal , Hariklia Deligianni
IPC分类号： C25D17/00 , C25D7/12
CPC分类号： C25D5/22 , C25D5/18 , C25D7/123 , C25D17/001 , C25D17/002 , C25D17/004 , C25D17/005 , C25D17/12 , C25D21/12 , H01L21/2885 , H01L21/7684 , H01L21/76849 , H01L21/76877
摘要： A plating apparatus securely carries out a flattening plating of a substrate to form a plated film having a flat surface without using a costly mechanism, and without applying an extra plating to the substrate. The plating apparatus includes a substrate holder; a cathode section having a seal member for watertightly sealing a peripheral portion of the substrate, and a cathode electrode for supplying an electric current to the substrate; an anode disposed in a position facing the surface of the substrate; a porous member disposed between the anode and the surface of the substrate; a constant-voltage control section for controlling a voltage applied between the cathode electrode and the anode at a constant value; and a current monitor section for monitoring an electric current flowing between the cathode electrode and the anode, and feeding back a detection signal to the constant-voltage control section.
摘要翻译：电镀装置可以牢固地进行基板的平坦化镀以形成具有平坦表面的镀膜而不使用昂贵的机构，并且不对基板施加额外的电镀。电镀装置包括：基板支架; 具有用于水密密封基板的周边部分的密封部件的阴极部分和用于向基板供给电流的阴极电极; 设置在面向所述基板的表面的位置的阳极; 设置在所述阳极和所述基板的表面之间的多孔构件; 恒定电压控制部分，用于以恒定值控制在所述阴极和所述阳极之间施加的电压; 以及电流监视部分，用于监视在阴极和阳极之间流动的电流，并将检测信号反馈到恒压控制部分。

10. 发明申请

US20050139482A1 Plating method and plating apparatus 失效
标题翻译：电镀方法和电镀装置
公开(公告)号：US20050139482A1
公开(公告)日：2005-06-30
申请号：US11020068
申请日：2004-12-23
申请人： Mizuki Nagai , Hiroyuki Kanda , Keiichi Kurashina , Satoru Yamamoto , Hidenao Suzuki , Koji Mishima
发明人： Mizuki Nagai , Hiroyuki Kanda , Keiichi Kurashina , Satoru Yamamoto , Hidenao Suzuki , Koji Mishima
IPC分类号： C25D5/10 , C25D5/18 , C25D7/12 , H01L21/288 , H01L21/768
CPC分类号： C25D17/001 , C25D5/10 , C25D5/18 , C25D7/123 , H01L21/2885 , H01L21/7684 , H01L21/76877
摘要： A plating method is capable of preferentially precipitating a plated film fully and uniformly in trenches and via holes according to a mechanical and electrochemical process, and of easily forming a plated film having higher flatness surface without being affected by variations in the shape of trenches and via holes. The plating method includes a first plating process and a second plating process. The second plating process is performed by filling a plating solution between an anode and a substrate, with a porous member placed in the plating solution, repeatedly bringing the porous member and the substrate into and out of contact with each other, passing a current between the anode and the substrate while the porous member is being held in contact with the substrate.
摘要翻译：电镀方法能够根据机械和电化学方法优先将电镀膜完全均匀地沉积在沟槽和通孔中，并且容易地形成具有较高平坦度表面的电镀膜，而不受沟槽形状和通孔形状的变化的影响孔。电镀方法包括第一电镀工艺和第二电镀工艺。通过在阳极和基板之间填充电镀液，将多孔构件放置在电镀液中，反复使多孔构件和基板彼此接触和脱离接触来进行第二电镀工艺，使电流在阳极和衬底，同时多孔构件被保持与衬底接触。

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