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1. 发明授权

US06989985B2 Electronic apparatus having display unit rotatably connected to main unit 失效
标题翻译：具有可旋转地连接到主单元的显示单元的电子设备
公开(公告)号：US06989985B2
公开(公告)日：2006-01-24
申请号：US10653355
申请日：2003-08-28
申请人： Mitsuyoshi Tanimoto , Hiroshi Nakamura
发明人： Mitsuyoshi Tanimoto , Hiroshi Nakamura
IPC分类号： G06F1/16
CPC分类号： G06F1/162 , G06F1/1643 , G06F1/1679 , G06F1/1681 , Y10T16/5353
摘要： An electronic apparatus has a hinge mechanism, which connects a main unit and a display unit. A first shaft of the hinge mechanism connects the display unit to the main unit such that the display unit is rotatable between a closed position where the display unit overlies the main unit and an open position where the display unit is raised up from the main unit. A second shaft of the hinge mechanism is perpendicular to the first shaft and connects the display unit to the main unit so as to be rotatable in a circumferential direction of the second shaft. The main unit has a braking mechanism, which generates braking force that limits rotation of the display unit between the closed position and the open position. The display unit has an engagement member, which is removaly engaged with the braking mechanism.
摘要翻译：电子设备具有连接主单元和显示单元的铰链机构。铰链机构的第一轴将显示单元连接到主单元，使得显示单元可以在显示单元覆盖主单元的关闭位置和显示单元从主单元升高的打开位置之间旋转。铰链机构的第二轴垂直于第一轴，并将显示单元连接到主单元，以便能够在第二轴的圆周方向上旋转。主单元具有制动机构，其产生限制显示单元在关闭位置和打开位置之间的旋转的制动力。显示单元具有接合构件，其与制动机构移除接合。

2. 发明申请

US20050206615A1 Display support mechanism for an electronic apparatus 审中-公开
标题翻译：电子设备的显示支持机构
公开(公告)号：US20050206615A1
公开(公告)日：2005-09-22
申请号：US10805848
申请日：2004-03-22
申请人： Mitsuyoshi Tanimoto , Hiroshi Nakamura , Toshiyuki Tanaka , Yves Behar
发明人： Mitsuyoshi Tanimoto , Hiroshi Nakamura , Toshiyuki Tanaka , Yves Behar
IPC分类号： G09G5/00
CPC分类号： G06F1/1616 , G06F1/1669 , G06F1/1679 , G06F1/1688 , G06F1/169 , G06F1/1698
摘要： An electronic apparatus is designed for conversion from a portable computer configuration to a flat panel television configuration. The electronic apparatus comprises (i) a body having a first edge and a second edge, (ii) a display housing, (iii) a display adjustment unit, and (iv) a display support unit. The display adjustment unit is coupled to the display housing and is rotationally coupled to the body proximate to the first edge of the body. The display support unit is rotationally coupled to the body proximate to the second edge of the body, and when rotated, supports the display housing.
摘要翻译：电子设备被设计用于从便携式计算机配置到平板电视配置的转换。电子设备包括（i）具有第一边缘和第二边缘的主体，（ii）显示器外壳，（iii）显示调整单元，以及（iv）显示支持单元。显示调整单元联接到显示器外壳，并且在身体的第一边缘附近旋转地联接到主体。显示支撑单元旋转地联接到靠近主体的第二边缘的主体，并且当旋转时支撑显示器壳体。

3. 发明授权

US06850407B2 Electronic apparatus having two housings coupled by hinge mechanism, one of which is reversible to the other 有权
标题翻译：具有通过铰链机构联接的两个壳体的电子设备，其中一个壳体可逆地连接到另一壳体
公开(公告)号：US06850407B2
公开(公告)日：2005-02-01
申请号：US10421801
申请日：2003-04-24
申请人： Mitsuyoshi Tanimoto , Hiroshi Nakamura
发明人： Mitsuyoshi Tanimoto , Hiroshi Nakamura
IPC分类号： G06F1/16 , G09F9/00 , H05K5/00
CPC分类号： G06F1/1679 , G06F1/162 , G06F1/1681 , Y10S248/921 , Y10S248/923 , Y10T16/5402 , Y10T16/5403
摘要： An electronic apparatus has a first housing, a second housing, a hinge mechanism and an interlocking mechanism. The hinge mechanism couples the first and second housings so that the housings are relatively rotated about first and second axes intersected with each other. An interlocking mechanism decreases a rotational resistance between the first and second housings about one of the two axes, while the first and second housing are relatively situated to each other at a position of the rotation about the other axis.
摘要翻译：电子设备具有第一壳体，第二壳体，铰链机构和互锁机构。铰链机构联接第一和第二壳体，使得壳体相对于彼此相交的第一和第二轴线相对旋转。互锁机构减小了围绕两个轴之一的第一和第二壳体之间的旋转阻力，而第一和第二壳体在围绕另一个轴线的旋转的位置处彼此相对定位。

4. 发明授权

US06988537B2 Cooling unit having a plurality of heat-radiating fins, and electronic apparatus with the cooling unit 失效
标题翻译：具有多个散热片的冷却单元和具有冷却单元的电子设备
公开(公告)号：US06988537B2
公开(公告)日：2006-01-24
申请号：US10853016
申请日：2004-05-25
申请人： Yukihiko Hata , Kentaro Tomioka , Mitsuyoshi Tanimoto
发明人： Yukihiko Hata , Kentaro Tomioka , Mitsuyoshi Tanimoto
IPC分类号： F28D15/00
CPC分类号： G06F1/1637 , G06F1/1616 , G06F1/203 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A cooling unit including a fan, a plurality of heat-radiating fins and a tube. Liquid coolant that has absorbed heat from a heat-radiating component is made to circulate in the tube. The fan has an impeller. The draws cooling air at its center part and expels the cooling air at its periphery. The heat-radiating fins oppose the periphery of the impeller. The tube is thermally connected to the heat-radiating fins.
摘要翻译：一种冷却单元，包括风扇，多个散热翅片和管。已经吸收了来自散热部件的热量的液体冷却剂在管中循环。风扇有一个叶轮。在其中心部分抽取冷却空气并排出其周边的冷却空气。散热片与叶轮的周边相对。管与热辐射翅片热连接。

5. 发明申请

US20070227705A1 Electronic Apparatus Having a Heat-Radiating Unit for Radiating Heat of Heat-Generating Components 审中-公开
标题翻译：具有用于发热元件散热的散热单元的电子设备
公开(公告)号：US20070227705A1
公开(公告)日：2007-10-04
申请号：US11741485
申请日：2007-04-27
申请人： Yukihiko Hata , Kentaro Tomioka , Mitsuyoshi Tanimoto , Hiroyuki Kusaka
发明人： Yukihiko Hata , Kentaro Tomioka , Mitsuyoshi Tanimoto , Hiroyuki Kusaka
IPC分类号： F28D15/00
CPC分类号： G06F1/203 , G06F1/1616 , G06F1/1637 , G06F2200/201 , G06F2200/203 , H01L2924/0002 , H01L2924/00
摘要： An electronic apparatus includes a main unit, support unit and display unit. The main unit has a heat-receiving portion thermally connected to a heat-generating component. The support unit has first and second edges. The first edge is coupled to the main unit. The second edge is located opposite to the first edge. The display unit is coupled to the second edge of the support unit. The support unit contains a heat-radiating portion. The heat-radiating portion includes a tube to convey the medium heated at the heat-receiving portion, a plurality of heat-radiating fins coupled to the tube, and a fan to supply cooling air to the fins.
摘要翻译：电子设备包括主单元，支撑单元和显示单元。主单元具有热连接到发热部件的热接收部分。支撑单元具有第一和第二边缘。第一边缘连接到主单元。第二边缘与第一边缘相对。显示单元联接到支撑单元的第二边缘。支撑单元包含热辐射部分。散热部包括用于输送在受热部分加热的介质的管，耦合到管的多个散热翅片，以及向散热片供给冷却空气的风扇。

6. 发明申请

US20050007739A1 Electronic apparatus having a heat-radiating unit for radiating heat of heat-generating components 失效
标题翻译：具有用于散发发热部件的热量的散热单元的电子设备
公开(公告)号：US20050007739A1
公开(公告)日：2005-01-13
申请号：US10854311
申请日：2004-05-26
申请人： Yukihiko Hata , Kentaro Tomioka , Mitsuyoshi Tanimoto , Hiroyuki Kusaka
发明人： Yukihiko Hata , Kentaro Tomioka , Mitsuyoshi Tanimoto , Hiroyuki Kusaka
IPC分类号： G06F1/16 , G06F1/20 , H01L23/473 , H05K7/20
CPC分类号： G06F1/203 , G06F1/1616 , G06F1/1637 , G06F2200/201 , G06F2200/203 , H01L2924/0002 , H01L2924/00
摘要： According to one embodiment of the invention, an electronic apparatus comprises a main unit, a display unit and a support unit. The main unit contains a heat-generating component and a heat-receiving portion. The heat-receiving portion is thermally connected to the heat-generating component. The support unit supports the display unit on the main unit and contains a heat-radiating portion that radiates the heat of the heat-generating component. The heat of the heat-generating component is transmitted to a heat-transferring medium and transferred to the heat-radiating portion through the heat-transferring medium.
摘要翻译：根据本发明的一个实施例，电子设备包括主单元，显示单元和支撑单元。主单元包含发热部件和热接收部。热接收部分与发热部件热连接。支撑单元支撑主单元上的显示单元，并且包含辐射发热部件的热量的散热部。发热部件的热量传递到传热介质，并通过传热介质传递到散热部分。

7. 发明申请

US20050007735A1 Electronic apparatus having a reserve tank and a circulation path of liquid coolant for cooling a heat-generating component 审中-公开
标题翻译：具有储存罐和用于冷却发热部件的液体冷却剂的循环路径的电子设备
公开(公告)号：US20050007735A1
公开(公告)日：2005-01-13
申请号：US10840526
申请日：2004-05-05
申请人： Yukihiko Hata , Kentaro Tomioka , Mitsuyoshi Tanimoto , Hiroyuki Kusaka
发明人： Yukihiko Hata , Kentaro Tomioka , Mitsuyoshi Tanimoto , Hiroyuki Kusaka
IPC分类号： F25D17/02 , G06F1/20 , H05K7/20
CPC分类号： G06F1/203
摘要： An electronic apparatus is provided with a circulating path used to circulate liquid coolant between a heat-receiving portion thermally connected to a CPU that generates heat and a heat-radiating portion that radiates heat generated in the CPU, so that the heat generated in the CPU is transferred to the heat-radiating portion by the liquid coolant. A reserve-tank is disposed in the circulating path and stores a portion of the liquid coolant for a reserve function. The circulating path includes a first tube to return the liquid coolant to the reserve-tank, and a second tube to lead the liquid coolant out from the reserve-tank. The second tube includes an inflow portion through which the liquid coolant inside the reserve-tank flows in, and the inflow portion is positioned at or near the center inside the reserve-tank.
摘要翻译：电子设备设置有循环路径，用于在热连接到产生热的CPU的热接收部分和散热在CPU中产生的热的散热部分之间循环液体冷却剂，从而在CPU中产生的热量被液体冷却剂转移到散热部分。在循环路径中设置有储备罐，并且储存一部分液体冷却剂用于备用功能。循环路径包括将液体冷却剂返回到储备罐的第一管和用于将液体冷却剂从储备罐引出的第二管。第二管包括流入部分，储备罐内的液体冷却剂通过该流入部分流入，并且流入部分位于储罐内部或附近。

8. 发明申请

US20070230120A1 Electronic Apparatus Having a Heat-Radiating Unit for Radiating Heat of Heat-Generating Components 审中-公开
标题翻译：具有用于发热元件散热的散热单元的电子设备
公开(公告)号：US20070230120A1
公开(公告)日：2007-10-04
申请号：US11741507
申请日：2007-04-27
申请人： Yukihiko Hata , Kentaro Tomioka , Mitsuyoshi Tanimoto , Hiroyuki Kusaka
发明人： Yukihiko Hata , Kentaro Tomioka , Mitsuyoshi Tanimoto , Hiroyuki Kusaka
IPC分类号： H05K7/20 , G06F1/20
CPC分类号： G06F1/203 , G06F1/1616 , G06F1/1637 , G06F2200/201 , G06F2200/203 , H01L2924/0002 , H01L2924/00
摘要： An electronic apparatus includes a main unit, display unit and support unit. The main unit has a heat-receiving portion thermally connected to a heat-generating component. The display unit is separated from the main unit. The support unit is coupled to the main unit and display unit. The support unit includes a heat-radiating portion to cool a liquid coolant, and a reserve tank to temporarily store the liquid coolant. The liquid coolant absorbs heat produced by the heat-generating component and transferred by the heat-receiving portion. The liquid coolant is circulated between the heat-receiving portion and the heat-radiating portion.
摘要翻译：电子设备包括主单元，显示单元和支撑单元。主单元具有热连接到发热部件的热接收部分。显示单元与主机分离。支撑单元联接到主单元和显示单元。支撑单元包括用于冷却液体冷却剂的散热部分和用于临时存储液体冷却剂的储备罐。液体冷却剂吸收由发热部件产生的热量并被热接收部分传送。液体冷却剂在热接收部分和散热部分之间循环。

9. 发明授权

US07273089B2 Electronic apparatus having a heat-radiating unit for radiating heat of heat-generating components 失效
标题翻译：具有用于散发发热部件的热量的散热单元的电子设备
公开(公告)号：US07273089B2
公开(公告)日：2007-09-25
申请号：US10854311
申请日：2004-05-26
申请人： Yukihiko Hata , Kentaro Tomioka , Mitsuyoshi Tanimoto , Hiroyuki Kusaka
发明人： Yukihiko Hata , Kentaro Tomioka , Mitsuyoshi Tanimoto , Hiroyuki Kusaka
IPC分类号： F28D15/00 , H05K7/20
CPC分类号： G06F1/203 , G06F1/1616 , G06F1/1637 , G06F2200/201 , G06F2200/203 , H01L2924/0002 , H01L2924/00
摘要： According to one embodiment of the invention, an electronic apparatus comprises a main unit, a display unit and a support unit. The main unit contains a heat-generating component and a heat-receiving portion. The heat-receiving portion is thermally connected to the heat-generating component. The support unit supports the display unit on the main unit and contains a heat-radiating portion that radiates the heat of the heat-generating component. The heat of the heat-generating component is transmitted to a heat-transferring medium and transferred to the heat-radiating portion through the heat-transferring medium.
摘要翻译：根据本发明的一个实施例，电子设备包括主单元，显示单元和支撑单元。主单元包含发热部件和热接收部。热接收部分与发热部件热连接。支撑单元支撑主单元上的显示单元，并且包含辐射发热部件的热量的散热部。发热部件的热量传递到传热介质，并通过传热介质传递到散热部分。

10. 发明授权

US08035212B2 Semiconductor chip mounting body, method of manufacturing semiconductor chip mounting body and electronic device 有权
标题翻译：半导体芯片安装体，半导体芯片安装体和电子器件的制造方法
公开(公告)号：US08035212B2
公开(公告)日：2011-10-11
申请号：US12621387
申请日：2009-11-18
申请人： Akira Tanaka , Minoru Takizawa , Mitsuyoshi Tanimoto , Akihiko Happoya
发明人： Akira Tanaka , Minoru Takizawa , Mitsuyoshi Tanimoto , Akihiko Happoya
IPC分类号： H01L23/48
CPC分类号： H01L21/563 , H01L23/295 , H01L23/3121 , H01L24/743 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/00011 , H01L2924/00014 , H01L2924/01029 , H01L2924/10253 , H01L2924/351 , H01L2924/00 , H01L2224/0401
摘要： According to one embodiment, a semiconductor chip mounting body, with an enhanced shock-resistance at portions of the bonding member corresponding to the corners of a semiconductor chip, is provided. The semiconductor chip mounting body includes a circuit board having a circuit pattern formed on a mounting surface thereof, a semiconductor chip mounted on the circuit pattern of the circuit board, and a bonding member arranged at least between the circuit board and the semiconductor chip, and on the sides of the semiconductor chip to fix the semiconductor chip on the circuit board. The bonding member contains thermosetting resin and magnetic powder dispersed in the thermosetting resin. The magnetic powder is locally disposed in portions of the bonding member which is located the corners of the semiconductor chip.
摘要翻译：根据一个实施例，提供一种半导体芯片安装体，其在与半导体芯片的角部对应的接合部件的部分处具有增强的抗冲击性。半导体芯片安装体包括电路板，其电路图案形成在其安装表面上，安装在电路板的电路图案上的半导体芯片和至少布置在电路板和半导体芯片之间的接合部件，以及在半导体芯片的侧面上将半导体芯片固定在电路板上。接合部件包含分散在热固性树脂中的热固性树脂和磁性粉末。磁性粉末局部地设置在位于半导体芯片的角部的接合部件的部分中。

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