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1. 发明授权

US08617340B2 Bonding method and bonded body 有权
标题翻译：粘合方法和粘结体
公开(公告)号：US08617340B2
公开(公告)日：2013-12-31
申请号：US12323946
申请日：2008-11-26
申请人： Takatoshi Yamamoto , Mitsuru Sato , Shintaro Asuke , Yoshiaki Mori , Kazuhiro Gomi
发明人： Takatoshi Yamamoto , Mitsuru Sato , Shintaro Asuke , Yoshiaki Mori , Kazuhiro Gomi
IPC分类号： B32B38/00
CPC分类号： C09J5/00 , C09J2205/31 , Y10T428/24851 , Y10T428/31663
摘要： A bonding method of bonding two base members together through a bonding film having a fine pattern at low cost, and a bonded body with the bonding film which is formed using the bonding method are provided. The bonding method is a method for forming a bonded body in which a first base member and a second base member are bonded together through a bonding film having a predetermined pattern. The bonding method includes: applying a liquid material containing a silicone material composed of silicone compounds onto a surface of at least one of the first and second base members using a liquid droplet ejecting method, to form a liquid coating having a pattern corresponding to the predetermined pattern on the surface; drying the liquid coating so that it is transformed into the bonding film having the predetermined pattern on the surface of the at least one of the first and second base members; and applying energy to the bonding film so that a bonding property is developed in the vicinity of a surface thereof, to thereby bond the first and second base members together through the bonding film.
摘要翻译：提供了一种通过低成本的具有精细图案的接合膜将两个基底部件接合在一起的接合方法，以及使用该接合方法形成的接合膜的接合体。接合方法是用于形成通过具有预定图案的接合膜将第一基底部件和第二基材部件接合在一起的接合体的方法。接合方法包括：使用液滴喷射方法将含有硅酮化合物的硅酮材料的液体材料涂覆在至少一个第一和第二基底构件的表面上，以形成具有对应于预定的表面图案; 干燥所述液体涂层，使其在所述第一和第二基底构件中的至少一个的表面上转变为具有预定图案的接合膜; 并且向接合膜施加能量，使得在其表面附近形成接合特性，从而通过接合膜将第一和第二基底部件结合在一起。

2. 发明授权

US08679283B2 Bonding method and bonded body 有权
标题翻译：粘合方法和粘结体
公开(公告)号：US08679283B2
公开(公告)日：2014-03-25
申请号：US13533521
申请日：2012-06-26
申请人： Takatoshi Yamamoto , Mitsuru Sato , Shintaro Asuke , Yoshiaki Mori , Kazuhiro Gomi
发明人： Takatoshi Yamamoto , Mitsuru Sato , Shintaro Asuke , Yoshiaki Mori , Kazuhiro Gomi
IPC分类号： B32B38/00
CPC分类号： C09J5/00 , C09J2205/31 , Y10T428/24851 , Y10T428/31663
摘要： A bonding method of bonding two base members together through a bonding film is provided. The bonding method is a method for forming a bonded body in which a first base member and a second base member are bonded together through the bonding film. The bonding method includes: applying a liquid material containing a silicone material composed of silicone compounds onto a surface of at least one of the first and second base members to form a liquid coating on the surface; drying the liquid coating so that it is transformed into the bonding film on the surface of the at least one of the first and second base members; and applying energy to the bonding film so that a bonding property is developed in the vicinity of a surface thereof, to thereby bond the first and second base members together through the bonding film.
摘要翻译：提供了通过接合膜将两个基底部件接合在一起的接合方法。接合方法是通过接合膜将第一基底构件和第二基底构件接合在一起的接合体的形成方法。接合方法包括：将含有由硅氧烷化合物构成的硅酮材料的液体材料涂覆在第一和第二基底构件中的至少一个的表面上，以在表面上形成液体涂层; 干燥所述液体涂层，使其在所述第一和第二基底构件中的至少一个的表面上转变成粘结膜; 并且向接合膜施加能量，使得在其表面附近形成接合特性，从而通过接合膜将第一和第二基底部件结合在一起。

3. 发明申请

US20120315450A1 Bonding Method and Bonded Body 有权
标题翻译：粘结方法和粘结体
公开(公告)号：US20120315450A1
公开(公告)日：2012-12-13
申请号：US13533521
申请日：2012-06-26
申请人： Takatoshi Yamamoto , Mitsuru Sato , Shintaro Asuke , Yoshiaki Mori , Kazuhiro Gomi
发明人： Takatoshi Yamamoto , Mitsuru Sato , Shintaro Asuke , Yoshiaki Mori , Kazuhiro Gomi
IPC分类号： B32B37/12 , B32B3/10 , B32B37/06
CPC分类号： C09J5/00 , C09J2205/31 , Y10T428/24851 , Y10T428/31663
摘要： A bonding method of bonding two base members together through a bonding film is provided. The bonding method is a method for forming a bonded body in which a first base member and a second base member are bonded together through the bonding film. The bonding method includes: applying a liquid material containing a silicone material composed of silicone compounds onto a surface of at least one of the first and second base members to form a liquid coating on the surface; drying the liquid coating so that it is transformed into the bonding film on the surface of the at least one of the first and second base members; and applying energy to the bonding film so that a bonding property is developed in the vicinity of a surface thereof, to thereby bond the first and second base members together through the bonding film.
摘要翻译：提供了通过接合膜将两个基底部件接合在一起的接合方法。接合方法是通过接合膜将第一基底构件和第二基底构件接合在一起的接合体的形成方法。接合方法包括：将含有由硅氧烷化合物构成的硅酮材料的液体材料涂覆在第一和第二基底构件中的至少一个的表面上，以在表面上形成液体涂层; 干燥所述液体涂层，使其在所述第一和第二基底构件中的至少一个的表面上转变成粘结膜; 并且向接合膜施加能量，使得在其表面附近形成接合特性，从而通过接合膜将第一和第二基底部件结合在一起。

4. 发明授权

US08211259B2 Separating method of bonded body 有权
标题翻译：粘结体分离方法
公开(公告)号：US08211259B2
公开(公告)日：2012-07-03
申请号：US12323562
申请日：2008-11-26
申请人： Mitsuru Sato , Takatoshi Yamamoto , Shintaro Asuke , Yoshiaki Mori , Kazuhiro Gomi
发明人： Mitsuru Sato , Takatoshi Yamamoto , Shintaro Asuke , Yoshiaki Mori , Kazuhiro Gomi
IPC分类号： B29C65/00
CPC分类号： B32B43/006 , B08B7/0057 , B09B5/00 , B32B37/06 , B32B2309/02 , B32B2309/105 , B32B2310/0831 , Y10T156/1153 , Y10T156/1158 , Y10T156/1911 , Y10T156/1917
摘要： A separating method of a bonded body, the bonded body including two base members and a bonding film through which the base members are boded together, enabling to easily and efficiently separating the bonded body into the two original base members is provided. Further, the bonding film contains a silicone material composed of silicone compounds. The separating method includes: preparing the bonded body with the bonding film; and applying energy for separation to the bonding film so that cleavage is generated within the bonding film due to breakage of a part of molecular bonds of the silicone compounds, to thereby separate the bonded body into the first and second base members.
摘要翻译：提供了一种接合体的分离方法，所述粘合体包括两个基底构件和接合膜，通过该接合膜将基底构件接合在一起，使得能够容易且有效地将接合体分离成两个原始基底构件。此外，接合膜含有由硅氧烷化合物构成的硅酮材料。分离方法包括：用接合膜制备粘合体; 并将能量分离到接合薄膜上，使得由于硅酮化合物的分子键的一部分断裂而在接合薄膜内产生裂纹，从而将粘合体分离成第一和第二基底部件。

5. 发明授权

US07148148B2 Mask forming and removing method, and semiconductor device, an electric circuit, a display module, a color filter and an emissive device manufactured by the same method 有权
标题翻译：掩模形成和去除方法，半导体器件，电路，显示模块，滤色器和通过相同方法制造的发射器件
公开(公告)号：US07148148B2
公开(公告)日：2006-12-12
申请号：US10309198
申请日：2002-12-04
申请人： Yoshiaki Mori , Takuya Miyakawa , Mitsuru Sato , Shintaro Asuke , Kenichi Takagi
发明人： Yoshiaki Mori , Takuya Miyakawa , Mitsuru Sato , Shintaro Asuke , Kenichi Takagi
IPC分类号： H01L21/302
CPC分类号： H01L21/76838 , C25D5/022 , C25D7/12 , H01L21/0272 , H01L21/0274 , H01L21/288 , H01L21/31127 , H01L21/31133
摘要： A mask forming method that can reduce manufacturing cost is disclosed. The method forms a mask on the surface of a member to be processed in order to form a desired pattern using liquid material for patterning. The method also includes applying resist to the entire surface of the member to be processed, drying the applied resist, patterning by removing the resist in a pattern-formation area using photolithography, and heating the resist.
摘要翻译：公开了一种降低制造成本的掩模形成方法。该方法在待加工构件的表面上形成掩模，以便使用液体材料形成图案化所需的图案。该方法还包括将抗蚀剂施加到待加工构件的整个表面，干燥所施加的抗蚀剂，通过使用光刻法去除图案形成区域中的抗蚀剂，并加热抗蚀剂来进行图案化。

6. 发明授权

US07098121B2 Method of forming a film of predetermined pattern on a surface as well as device manufactured by employing the same, and method of manufacturing device 有权
标题翻译：在表面上形成预定图案的膜的方法以及使用该膜的装置以及制造装置的方法
公开(公告)号：US07098121B2
公开(公告)日：2006-08-29
申请号：US10367854
申请日：2003-02-19
申请人： Yoshiaki Mori , Takuya Miyakawa , Mitsuru Sato , Shintaro Asuke , Kenichi Takagi
发明人： Yoshiaki Mori , Takuya Miyakawa , Mitsuru Sato , Shintaro Asuke , Kenichi Takagi
IPC分类号： H01L21/22
CPC分类号： H01L21/3127 , H01L21/0212 , H01L21/02274 , H01L21/0272 , H01L21/0273 , H01L21/288 , H01L21/76838 , H01L27/1292
摘要： An object is to provide a mask formation method, which can curtail a manufacturing cost.A method of forming a film of predetermined pattern on the front surface of a member to-be-processed is so constructed as to carry out the step (S178) of improving the adherence of a pattern material solution to the member to-be-processed, the step (S180) of filling up a pattern forming recess provided in a mask on the surface of the member to-be-processed with a pattern material solution, the step (S186) of improving the film quality of the pattern film to-be-formed by processing the pattern material solution, the step (S188) of removing the pattern material solution having adhered on the mask, the step (S190) of drying the pattern material solution, and the step (S196) of subjecting the pattern film to annealing processing.
摘要翻译：目的在于提供掩模形成方法，可以减少制造成本。在待处理构件的正面上形成预定图案的膜的方法被构造成执行改善图案材料溶液与要被加工的构件的粘附的步骤（S 178）在图案材料溶液的待处理部件的表面上填充设置在掩模中的图案形成用凹部的工序（S180），提高图案的膜质量的工序（S188）通过处理图案材料溶液形成的薄膜，去除已经粘附在掩模上的图案材料溶液的步骤（S 188），干燥图案材料溶液的步骤（S190）和步骤（S1996））对图案膜进行退火处理。

7. 发明授权

US08517519B2 Liquid droplet ejection head and liquid droplet ejection apparatus 有权
标题翻译：液滴喷射头和液滴喷射装置
公开(公告)号：US08517519B2
公开(公告)日：2013-08-27
申请号：US13104268
申请日：2011-05-10
申请人： Mitsuru Sato , Takatoshi Yamamoto
发明人： Mitsuru Sato , Takatoshi Yamamoto
IPC分类号： B41J2/045
CPC分类号： B41J2/1433 , B41J2/14274 , B41J2/1612 , B41J2/162 , B41J2/1623 , B41J2/1645 , B41J2/1646
摘要： An ink jet type recording head includes a substrate, a nozzle plate having nozzles, and a sealing sheet, and the substrate and the nozzle plate are bonded to each other through a bonding film, and the substrate and the sealing sheet are bonded to each other through a bonding film. These bonding films are each obtained by drying and/or curing a liquid material containing an epoxy-modified silicone material. Further, by applying energy to each bonding film, the surface thereof is activated, and therefore, each bonding film exhibits a bonding property. By this bonding property, the substrate is bonded to the nozzle plate and to the sealing sheet.
摘要翻译：喷墨型记录头包括基板，具有喷嘴的喷嘴板和密封片，并且基板和喷嘴板通过接合膜彼此接合，并且基板和密封片彼此接合通过粘合膜。这些接合膜各自通过干燥和/或固化含有环氧改性的有机硅材料的液体材料而获得。此外，通过向每个接合膜施加能量，其表面被激活，因此每个接合膜都具有接合性。通过这种粘合特性，将基板粘合到喷嘴板和密封片上。

8. 发明授权

US07963435B2 Method of forming bonded body and bonded body 有权
标题翻译：形成粘结体和粘结体的方法
公开(公告)号：US07963435B2
公开(公告)日：2011-06-21
申请号：US12358689
申请日：2009-01-23
申请人： Mitsuru Sato , Takatoshi Yamamoto
发明人： Mitsuru Sato , Takatoshi Yamamoto
IPC分类号： B23K31/02
CPC分类号： B32B37/00 , B23K20/02 , B23K2101/40 , B32B7/04 , B32B7/12 , B32B15/043 , B32B15/08 , B32B27/08 , B32B27/283 , B32B38/0008 , B32B2038/0092 , B32B2255/06 , B32B2255/10 , B32B2255/205 , B32B2255/28 , B32B2307/202 , B32B2307/302 , B32B2307/308 , B32B2307/54 , B32B2310/14 , B32B2457/00 , B32B2457/18 , B32B2457/202 , B32B2457/206 , C23C16/18 , C23C16/30 , Y10T428/265
摘要： A method of forming a bonded body comprised of a first base member, a second base member, and a first bonding film and a second bonding film provided between the first base member and the second base member is provided. The first bonding film and the second bonding film are constituted of copper and an organic component, and an amount of copper contained in each of the first bonding film and the second bonding film is 90 atom % or higher but lower than 99 atom % at an atomic ratio. The method is comprised of: forming the first bonding film on the first base member by using a chemical vapor-film formation method; forming the second bonding film on the second base member by using a chemical vapor-film formation method; bringing the first bonding film formed on the first base member into contact with the second bonding film formed on the second base member so that the first bonding film faces the second bonding film; and applying a compressive force to the first base member and the second base member so that the first bonding film and the second bonding film are bonded together to thereby obtain the bonded body. Two base members can be firmly and efficiently bonded together with high dimensional accuracy at a low temperature, and the two base members can be efficiently separated (peeled off) to each other after use of the bonded body. Further, a bonded body is also provided.
摘要翻译：提供一种形成由第一基底构件，第二基底构件和第一接合膜构成的接合体的方法和设置在第一基底构件和第二基底构件之间的第二接合薄膜。第一接合膜和第二接合膜由铜和有机成分构成，并且在第一接合膜和第二接合膜中的每一个中的铜量为90原子％以上且低于99原子％原子比。该方法包括：通过使用化学气相成膜法在第一基底构件上形成第一接合膜; 通过使用化学气相成膜法在第二基底构件上形成第二接合膜; 使形成在第一基底构件上的第一接合膜与形成在第二基底构件上的第二接合膜接触，使得第一接合膜面向第二接合膜; 并且向第一基底构件和第二基底构件施加压缩力，使得第一接合膜和第二接合膜接合在一起，从而获得接合体。两个基底构件可以在低温下以高尺寸精度牢固有效地粘合在一起，并且在使用粘合体之后可以将两个基底构件彼此有效地分离（剥离）。此外，还提供了粘合体。

9. 发明授权

US08105461B2 Method for disassembling bonded structure 有权
标题翻译：拆卸粘结结构的方法
公开(公告)号：US08105461B2
公开(公告)日：2012-01-31
申请号：US12414775
申请日：2009-03-31
申请人： Mitsuru Sato , Takatoshi Yamamoto
发明人： Mitsuru Sato , Takatoshi Yamamoto
IPC分类号： B32B38/10
CPC分类号： B32B43/006 , C09J5/06 , C09J2205/302 , H01L21/6835 , H01L2221/68318 , Y10T156/1111 , Y10T156/1153 , Y10T156/1158 , Y10T156/1911
摘要： There is provided a method for disassembling a bonded structure obtained by bonding a first base member and a second base member to each other via a bonding film mainly made of a compound having a branched polyorganosiloxane skeleton having a structural unit expressed by a following general formula (1) at a terminal portion, a structural unit expressed by a following general formula (2) at a linking portion, and a structural unit expressed by a following general formula (3) at a branched portion: In the formulas, each R independently represents a non-substituted hydrocarbon group; each Z independently represents a hydroxyl group or a hydrolytic group; each X represents a siloxane residue; a represents 0 or an integer of 1 to 3; b represents 0 or an integer of 1 or 2; and c represents 0 or 1. The disassembling method includes heating the bonding film into a molten state at a temperature equal to or higher than a glass transition point of the compound having the branched polyorganosiloxane skeleton and separating the first and the second base members from each other.
摘要翻译：提供了一种通过主要由具有由以下通式表示的结构单元的支链聚有机硅氧烷骨架的化合物形成的接合膜将第一基底构件和第二基底构件彼此接合而获得的接合结构的拆卸方法（ 1），在连结部分由下述通式（2）表示的结构单元和由分支部分由下述通式（3）表示的结构单元：式中，R各自独立地表示未取代的烃基; 每个Z独立地表示羟基或水解基团; 每个X表示硅氧烷残基; a表示0或1〜3的整数; b表示0或1或2的整数; c表示0或1.拆卸方法包括在等于或高于具有支链聚有机硅氧烷骨架的化合物的玻璃化转变点的温度下将接合膜加热至熔融状态，并将第一和第二基材从每个其他。

10. 发明授权

US07967185B2 Method of forming bonded body and bonded body 有权
标题翻译：形成粘结体和粘结体的方法
公开(公告)号：US07967185B2
公开(公告)日：2011-06-28
申请号：US12358531
申请日：2009-01-23
申请人： Mitsuru Sato , Takatoshi Yamamoto
发明人： Mitsuru Sato , Takatoshi Yamamoto
IPC分类号： B23K31/02
CPC分类号： B32B37/12 , B32B37/24 , B32B2037/1223 , B32B2037/246 , B32B2309/02 , B32B2309/04 , B32B2309/105 , B32B2309/12 , B32B2457/00 , Y10T428/12882
摘要： A method of forming a bonded body comprised of a first base member, a second base member, and a first bonding film and a second bonding film provided between the first base member and the second base member is provided. The first bonding film and the second bonding film are constituted mainly of copper. The method is comprised of: forming the first bonding film on the first base member by using a chemical vapor-film formation method; forming the second bonding film on the second base member by using a chemical vapor-film formation method; bringing the first bonding film formed on the first base member into contact with the second bonding film formed on the second base member so that the first bonding film faces the second bonding film; and applying a compressive force to the first base member and the second base member so that the first bonding film and the second bonding film are bonded together to thereby obtain the bonded body. Two base members can be firmly and efficiently bonded together with high dimensional accuracy at a low temperature, and the two base members can be efficiently separated (peeled off) to each other after use of the bonded body. Further, a bonded body is also provided.
摘要翻译：提供一种形成由第一基底构件，第二基底构件和第一接合膜构成的接合体的方法和设置在第一基底构件和第二基底构件之间的第二接合薄膜。第一接合膜和第二接合膜主要由铜构成。该方法包括：通过使用化学气相成膜法在第一基底构件上形成第一接合膜; 通过使用化学气相成膜法在第二基底构件上形成第二接合膜; 使形成在第一基底构件上的第一接合膜与形成在第二基底构件上的第二接合膜接触，使得第一接合膜面向第二接合膜; 并且向第一基底构件和第二基底构件施加压缩力，使得第一接合膜和第二接合膜接合在一起，从而获得接合体。两个基底构件可以在低温下以高尺寸精度牢固有效地粘合在一起，并且在使用粘合体之后可以将两个基底构件彼此有效地分离（剥离）。此外，还提供了粘合体。

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