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1. 发明授权

US07829992B2 Semiconductor device and method for manufacturing semiconductor device 有权
标题翻译：半导体装置及半导体装置的制造方法
公开(公告)号：US07829992B2
公开(公告)日：2010-11-09
申请号：US11886904
申请日：2007-04-24
申请人： Mitsuo Sugino , Satoru Katsurayama , Tomoe Yamashiro , Tetsuya Miyamoto , Hiroyuki Yamashita
发明人： Mitsuo Sugino , Satoru Katsurayama , Tomoe Yamashiro , Tetsuya Miyamoto , Hiroyuki Yamashita
IPC分类号： H01L23/02 , H01L23/04 , H01L23/053 , H01L23/12 , H01L23/48
CPC分类号： H01L25/0657 , H01L23/16 , H01L23/3128 , H01L23/562 , H01L24/48 , H01L24/73 , H01L25/105 , H01L25/18 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2225/0651 , H01L2225/06517 , H01L2225/0652 , H01L2225/06541 , H01L2225/06551 , H01L2225/06572 , H01L2225/06582 , H01L2225/06586 , H01L2225/1023 , H01L2225/1058 , H01L2225/107 , H01L2924/00014 , H01L2924/01012 , H01L2924/01019 , H01L2924/0102 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/07802 , H01L2924/07811 , H01L2924/09701 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/3511 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor device (100) comprises a first resin substrate (101) on which a first semiconductor chip (125) is mounted a surface thereof; a second resin substrate (111) on which a second semiconductor chip (131) is mounted on a surface thereof; and a resin base material (109), joined to a front surface of the first resin substrate (101) and to a back surface of the second resin substrate (111), so that these surfaces are electrically connected. The resin base material (109) is disposed in a circumference of the first resin substrate (101) in the surface of the first resin substrate (101). Further, the first semiconductor chip (125) is disposed in a space section provided among the first resin substrate (101), the second resin substrate (111) and the resin base material (109) in the surface of the first resin substrate (101).
摘要翻译：半导体器件（100）包括第一树脂基板（101），第一半导体芯片（125）的表面安装有第一树脂基板（101）第二树脂基板（111），其表面上安装有第二半导体芯片（131）; 以及与第一树脂基板（101）的前表面和第二树脂基板（111）的背面接合的树脂基材（109），使得这些表面电连接。树脂基材（109）在第一树脂基板（101）的表面设置在第一树脂基板（101）的周围。此外，第一半导体芯片（125）设置在设置在第一树脂基板（101），第二树脂基板（111）和树脂基材（109）之间的空间部分中，第一树脂基板）。

2. 发明授权

US08704378B2 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US08704378B2
公开(公告)日：2014-04-22
申请号：US11887235
申请日：2007-05-15
申请人： Mitsuo Sugino , Satoru Katsurayama , Hiroyuki Yamashita
发明人： Mitsuo Sugino , Satoru Katsurayama , Hiroyuki Yamashita
IPC分类号： H01L23/48
CPC分类号： H01L23/145 , H01L23/3735 , H01L23/3737 , H01L24/45 , H01L24/48 , H01L24/73 , H01L25/105 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/45139 , H01L2224/48091 , H01L2224/48227 , H01L2224/73203 , H01L2224/73204 , H01L2224/73265 , H01L2225/1023 , H01L2225/1058 , H01L2924/00011 , H01L2924/00014 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/30107 , H01L2924/3511 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2924/01049
摘要： A semiconductor device 1 is equipped with a first substrate 3 on which a first semiconductor chip 2 is mounted, a second substrate 5 on which a second semiconductor chip 4 is mounted, and connecting sections 6 that electrically connect the first substrate 3 and the second substrate 5. The first substrate 3 has build-up layers 31A and 31B in each of which an insulating layer 311 containing a resin and conductor interconnect layers 312 and 313 are laminated alternately, and the respective conductor interconnect layers 312 are connected by a conductive layer 314 provided in via holes of the insulating layers 311. The second substrate 5 also has build-up layers 31A and 31B. In the insulating layers 311 of the build-up layers in at least one substrate of the first substrate 3 and the second substrate 5, the average coefficient of thermal expansion of at least one insulating layer along the substrate inplane direction at from 25 degrees centigrade to the glass transition point is 35 ppm/degrees centigrade or less, and the average coefficient of thermal expansion along the substrate thickness direction is 35 ppm/degrees centigrade or less.
摘要翻译：半导体器件1配备有安装有第一半导体芯片2的第一基板3，安装有第二半导体芯片4的第二基板5和将第一基板3与第二基板电连接的连接部6 第一基板3具有堆积层31A和31B，每个层叠有包含树脂和导体互连层312和313的绝缘层311交替层叠，并且各个导体互连层312通过导电层314连接设置在绝缘层311的通孔中。第二基板5还具有堆积层31A和31B。在第一基板3和第二基板5的至少一个基板中的堆积层的绝缘层311中，沿着基板面内方向的至少一个绝缘层的平均热膨胀系数在25摄氏度到玻璃化转变温度为35ppm /摄氏度以下，沿着基板厚度方向的平均热膨胀系数为35ppm /摄氏度以下。

3. 发明申请

US20090243065A1 Semiconductor Device and Method for Manufacturing Semiconductor Device 有权
标题翻译：半导体器件及半导体器件制造方法
公开(公告)号：US20090243065A1
公开(公告)日：2009-10-01
申请号：US11886904
申请日：2007-04-24
申请人： Mitsuo Sugino , Satoru Katsurayama , Tomoe Yamashiro , Tetsuya Miyamoto , Hiroyuki Yamashita
发明人： Mitsuo Sugino , Satoru Katsurayama , Tomoe Yamashiro , Tetsuya Miyamoto , Hiroyuki Yamashita
IPC分类号： H01L23/498 , H01L23/00 , H01L23/28 , H01L21/50 , H01L21/56
CPC分类号： H01L25/0657 , H01L23/16 , H01L23/3128 , H01L23/562 , H01L24/48 , H01L24/73 , H01L25/105 , H01L25/18 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2225/0651 , H01L2225/06517 , H01L2225/0652 , H01L2225/06541 , H01L2225/06551 , H01L2225/06572 , H01L2225/06582 , H01L2225/06586 , H01L2225/1023 , H01L2225/1058 , H01L2225/107 , H01L2924/00014 , H01L2924/01012 , H01L2924/01019 , H01L2924/0102 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/07802 , H01L2924/07811 , H01L2924/09701 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/3511 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor device (100) comprises a first resin substrate (101) on which a first semiconductor chip (125) is mounted a surface thereof; a second resin substrate (111) on which a second semiconductor chip (131) is mounted on a surface thereof; and a resin base material (109), joined to a front surface of the first resin substrate (101) and to a back surface of the second resin substrate (111), so that these surfaces are electrically connected. The resin base material (109) is disposed in a circumference of the first resin substrate (101) in the surface of the first resin substrate (101). Further, the first semiconductor chip (125) is disposed in a space section provided among the first resin substrate (101), the second resin substrate (111) and the resin base material (109) in the surface of the first resin substrate (101).
摘要翻译：半导体器件（100）包括第一树脂基板（101），第一半导体芯片（125）的表面安装有第一树脂基板（101）第二树脂基板（111），其表面上安装有第二半导体芯片（131）; 以及与第一树脂基板（101）的前表面和第二树脂基板（111）的背面接合的树脂基材（109），使得这些表面电连接。树脂基材（109）在第一树脂基板（101）的表面设置在第一树脂基板（101）的周围。此外，第一半导体芯片（125）设置在设置在第一树脂基板（101），第二树脂基板（111）和树脂基材（109）之间的空间部分中，第一树脂基板）。

4. 发明申请

US20100181686A1 Semiconductor Device 有权
标题翻译：半导体器件
公开(公告)号：US20100181686A1
公开(公告)日：2010-07-22
申请号：US11887235
申请日：2007-05-15
申请人： Mitsuo Sugino , Satoru Katsurayama , Hiroyuki Yamashita
发明人： Mitsuo Sugino , Satoru Katsurayama , Hiroyuki Yamashita
IPC分类号： H01L23/538 , H01L23/28
CPC分类号： H01L23/145 , H01L23/3735 , H01L23/3737 , H01L24/45 , H01L24/48 , H01L24/73 , H01L25/105 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/45139 , H01L2224/48091 , H01L2224/48227 , H01L2224/73203 , H01L2224/73204 , H01L2224/73265 , H01L2225/1023 , H01L2225/1058 , H01L2924/00011 , H01L2924/00014 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/30107 , H01L2924/3511 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2924/01049
摘要： A semiconductor device 1 is equipped with a first substrate 3 on which a first semiconductor chip 2 is mounted, a second substrate 5 on which a second semiconductor chip 4 is mounted, and connecting sections 6 that electrically connect the first substrate 3 and the second substrate 5. The first substrate 3 has build-up layers 31A and 31B in each of which an insulating layer 311 containing a resin and conductor interconnect layers 312 and 313 are laminated alternately, and the respective conductor interconnect layers 312 are connected by a conductive layer 314 provided in via holes of the insulating layers 311. The second substrate 5 also has build-up layers 31A and 31B. In the insulating layers 311 of the build-up layers in at least one substrate of the first substrate 3 and the second substrate 5, the average coefficient of thermal expansion of at least one insulating layer along the substrate inplane direction at from 25 degrees centigrade to the glass transition point is 35 ppm/degrees centigrade or less, and the average coefficient of thermal expansion along the substrate thickness direction is 35 ppm/degrees centigrade or less.
摘要翻译：半导体器件1配备有安装有第一半导体芯片2的第一基板3，安装有第二半导体芯片4的第二基板5和将第一基板3与第二基板电连接的连接部6 第一基板3具有堆积层31A和31B，每个层叠有包含树脂和导体互连层312和313的绝缘层311交替层叠，并且各个导体互连层312通过导电层314连接设置在绝缘层311的通孔中。第二基板5还具有堆积层31A和31B。在第一基板3和第二基板5的至少一个基板中的堆积层的绝缘层311中，沿着基板面内方向的至少一个绝缘层的平均热膨胀系数在25摄氏度到玻璃化转变温度为35ppm /摄氏度以下，沿着基板厚度方向的平均热膨胀系数为35ppm /摄氏度以下。

5. 发明授权

US11913152B2 Liquid discharge apparatus, dyeing apparatus, embroidery machine, and maintenance device 有权
公开(公告)号：US11913152B2
公开(公告)日：2024-02-27
申请号：US17417379
申请日：2019-12-03
申请人： Hiroyuki Yamashita
发明人： Hiroyuki Yamashita
IPC分类号： D05C11/24 , B41J2/165 , B41J3/407 , D06P5/30
CPC分类号： D05C11/24 , B41J2/16508 , B41J2/16523 , B41J2/16532 , B41J3/4076 , D06P5/30
摘要： A liquid discharge apparatus includes heads to discharge a liquid; caps to contact and move away from the plurality of heads, respectively; individual drain passages communicating with the plurality of caps, respectively; at least one common drain passage communicating with at least two of the individual drain passages; suction devices provided in the individual drain passages, respectively; and a controller. Each of the individual drain passages is to allow and shut off communication between the cap and the common drain passage. The controller causes the individual drain passage to allow the communication between the cap and the common drain passage when performing capping and decapping of the head. The controller caps the sucking target with the cap after shutting off each individual drain passage communicating with the cap corresponding to the head that is not a sucking target.

6. 发明授权

US10974511B2 Liquid discharge device, and liquid discharge apparatus and dyeing apparatus including same 有权
公开(公告)号：US10974511B2
公开(公告)日：2021-04-13
申请号：US16714843
申请日：2019-12-16
申请人： Shinya Tanaka , Hiroyuki Yamashita
发明人： Shinya Tanaka , Hiroyuki Yamashita
IPC分类号： B41J2/165 , D06B11/00 , B41J2/145 , D05C13/00 , D05C11/24 , B41J3/407 , D06P5/30 , B41J11/00
摘要： A liquid discharge apparatus includes a head including a nozzle plate having a plurality of nozzles lined in a row and configured to discharge a liquid, a conveyor configured to convey the liquid application target, and a liquid receptacle configured to receive the liquid discharged from the head. The conveyor defines a conveyance passage of a liquid application target to which the head applies the liquid. The liquid receptacle has an opening through which the liquid discharged from the head passes. A longitudinal direction of the opening is along a movement direction of the liquid application target. A width of the opening is greater than a width of the liquid application target in a direction orthogonal to the movement direction.

7. 发明授权

US10723158B2 Liquid discharge apparatus and liquid discharge method 有权
公开(公告)号：US10723158B2
公开(公告)日：2020-07-28
申请号：US16363319
申请日：2019-03-25
申请人： Naohiro Toda , Takuma Nakamura , Yukie Inoue , Masaya Hamaguchi , Hiroyuki Yamashita
发明人： Naohiro Toda , Takuma Nakamura , Yukie Inoue , Masaya Hamaguchi , Hiroyuki Yamashita
IPC分类号： B41M5/00 , B41J11/00 , C09D11/322 , C09D11/54
摘要： A line head type liquid discharge apparatus includes a treatment liquid applying device, a first discharging device, a heating device, and a second discharging device. The treatment liquid applying device applies a treatment liquid to a non-permeable base material. The first discharging device discharges a first ink containing an organic solvent onto the non-permeable base material to which the treatment liquid has been applied. The heating device heats, with an infrared ray, the non-permeable base material onto which the first ink has been discharged. The second discharging device discharges a second ink containing an organic solvent onto the non-permeable base material heated by the heating device. A content ratio of the organic solvent contained in the first ink is higher than a content ratio of the organic solvent contained in the second ink.

8. 发明申请

US20190283459A1 DRYER, LIQUID DISCHARGE APPARATUS, DRYING METHOD, AND INKJET RECORDING APPARATUS 审中-公开
公开(公告)号：US20190283459A1
公开(公告)日：2019-09-19
申请号：US16299016
申请日：2019-03-11
申请人： Takuma Nakamura , Naohiro Toda , Hiroyuki Yamashita , Masaya Hamaguchi , Yukie Inoue
发明人： Takuma Nakamura , Naohiro Toda , Hiroyuki Yamashita , Masaya Hamaguchi , Yukie Inoue
IPC分类号： B41J11/00 , B41J2/21
摘要： A dryer includes a conveyor to convey a film including a first surface onto which a liquid is applied, a noncontact heater to heat the first surface of the film conveyed by the conveyor without contacting the first surface, a contact heater to contact and heat a second surface of the film opposite the first surface, and circuitry to set a first heating temperature of the contact heater less than 85° C. and set a second heating temperature of the noncontact heater to be 30° C. to 90° C. higher than the first heating temperature.

9. 发明授权

US09496823B2 Fault diagnosis system, fault diagnosis device, fault diagnosis method, program, computer-readable medium, and device under test 有权
标题翻译：故障诊断系统，故障诊断装置，故障诊断方法，程序，计算机可读介质和被测设备
公开(公告)号：US09496823B2
公开(公告)日：2016-11-15
申请号：US14125145
申请日：2012-06-05
申请人： Toshiyuki Shigemura , Shigenori Matsuo , Hiroyuki Yamashita , Hiroshi Date
发明人： Toshiyuki Shigemura , Shigenori Matsuo , Hiroyuki Yamashita , Hiroshi Date
IPC分类号： H02S50/10 , G01R31/11
CPC分类号： H02S50/10 , G01R31/11
摘要： A fault diagnosis method utilizing a fault diagnosis system for diagnosing a photovoltaic module by estimating a fault location, the fault diagnosis system including a signal generator for generating and inputting an input signal into a positive terminal or a negative terminal of the photovoltaic module, a waveform observer for observing a reflected output signal from an open end or the fault location, a diagnosis unit for estimating the fault location based on the output signal, a conductive body, and an alignment unit for controlling the positions of the conductive body and/or the photovoltaic module. The diagnosis method includes controlling the positions of the conductive body and/or the photovoltaic module, observing the output signal of the input signal, and estimating the fault location based on two reflected output signals of input signals inputted into the positive terminal and the negative terminal of the photovoltaic module.
摘要翻译：一种利用故障诊断系统通过估计故障位置诊断光伏模块的故障诊断方法，所述故障诊断系统包括用于产生并输入到所述光伏模块的正极端子或负极端子的输入信号的信号发生器，波形用于观察来自开放端或故障位置的反射输出信号的观测器，用于基于输出信号估计故障位置的诊断单元，导电体和用于控制导电体和/或光伏组件。诊断方法包括控制导电体和/或光伏模块的位置，观察输入信号的输出信号，并且基于输入到正极端子和负极端子的输入信号的两个反射输出信号来估计故障位置的光伏组件。

10. 发明授权

US09488066B2 Turbine vane of steam turbine and steam turbine 有权
标题翻译：汽轮机和蒸汽轮机的涡轮叶片
公开(公告)号：US09488066B2
公开(公告)日：2016-11-08
申请号：US13989842
申请日：2011-12-06
申请人： Hiroyuki Yamashita , Hiroharu Oyama , Takashi Maruyama , Yuki Yamamoto , Shohei Danno
发明人： Hiroyuki Yamashita , Hiroharu Oyama , Takashi Maruyama , Yuki Yamamoto , Shohei Danno
IPC分类号： F01D25/00 , F01D5/16 , F01D25/06 , F01D9/04
CPC分类号： F01D25/00 , F01D5/16 , F01D9/041 , F01D25/06 , F05D2300/501
摘要： Vane members have a space formed therein and a plate spring member is disposed inside the space of the vane members and elastically contacts inner surfaces of the vane members. The plate spring member includes a positioning portion, an elastic contact portion, and a connection portion. The elastic contact portion is divided into a plurality of segments in a length direction of the vane members. The elastic contact portion elastically contacts the inner surfaces of the vane members without any partial contact throughout an entire surface thereof. The elastic contact area between the elastic contact portion and the inner surfaces of the vane members is widened.
摘要翻译：叶片构件具有形成在其中的空间，并且板簧构件设置在叶片构件的空间内并且弹性地接触叶片构件的内表面。板簧构件包括定位部，弹性接触部和连接部。弹性接触部分在叶片构件的长度方向上分成多个段。弹性接触部分在叶片构件的内表面弹性地接触，而在其整个表面上没有任何部分接触。弹性接触部分与叶片内表面之间的弹性接触面积变大。

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