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1. 发明申请

US20120000369A1 DRIP BAG 有权
标题翻译： DRIP袋
公开(公告)号：US20120000369A1
公开(公告)日：2012-01-05
申请号：US12990303
申请日：2008-12-24
申请人： Mitsunori Saitoh , Naoko Yamaguchi
发明人： Mitsunori Saitoh , Naoko Yamaguchi
IPC分类号： A47J31/44
CPC分类号： A47J31/0626 , A47J31/005 , A47J31/02 , A47J31/08
摘要： A drip bag having a bag body and a holder which is formed from a sheet material and is adhered to the bag body. The holder is folded into two parts, a front surface and a rear surface, on a center fold line, and the center fold line overlaps a lateral side of the bag body. V-shaped fold lines bent in V-shapes and extending from the open edge of the drip bag toward the bottom direction thereof are formed in regions on the side of the center fold line of the front surface and the rear surface of the holder. In addition, overhanging parts, which have concave portions for hooking, are formed in a manner that allows them to be pulled open on both the left and right sides of the lower end of each of the front surface and the rear surface of the holder.
摘要翻译：一种具有袋体和由片状材料形成并粘附到袋体的保持器的滴水袋。保持架在中心折叠线上折叠成前表面和后表面的两个部分，并且中心折叠线与袋体的侧面重叠。在保持器的前表面和后表面的中心折叠线的一侧的区域中形成有V形弯曲并且从滴水袋的开口边缘朝向其底部方向延伸的V形折叠线。此外，具有用于钩住的凹部的突出部分以允许它们在保持器的前表面和后表面的每个的下端的左右两侧被拉开的方式形成。

2. 发明授权

US08746131B2 Drip bag 有权
标题翻译：滴袋
公开(公告)号：US08746131B2
公开(公告)日：2014-06-10
申请号：US12990303
申请日：2008-12-24
申请人： Mitsunori Saitoh , Naoko Yamaguchi
发明人： Mitsunori Saitoh , Naoko Yamaguchi
IPC分类号： A47J31/44
CPC分类号： A47J31/0626 , A47J31/005 , A47J31/02 , A47J31/08
摘要： A drip bag having a bag body and a holder which is formed from a sheet material and is adhered to the bag body. The holder is folded into two parts, a front surface and a rear surface, on a center fold line, and the center fold line overlaps a lateral side of the bag body. V-shaped fold lines bent in V-shapes and extending from the open edge of the drip bag toward the bottom direction thereof are formed in regions on the side of the center fold line of the front surface and the rear surface of the holder. In addition, overhanging parts, which have concave portions for hooking, are formed in a manner that allows them to be pulled open on both the left and right sides of the lower end of each of the front surface and the rear surface of the holder.
摘要翻译：一种具有袋体和由片状材料形成并粘附到袋体的保持器的滴水袋。保持架在中心折叠线上折叠成前表面和后表面的两个部分，并且中心折叠线与袋体的侧面重叠。在保持器的前表面和后表面的中心折叠线的一侧的区域中形成有V形弯曲并且从滴水袋的开口边缘朝向其底部方向延伸的V形折叠线。此外，具有用于钩住的凹部的突出部分以允许它们在保持器的前表面和后表面的每个的下端的左右两侧被拉开的方式形成。

3. 发明申请

US20100330236A1 FIBER SHEET 审中-公开
标题翻译：纤维板
公开(公告)号：US20100330236A1
公开(公告)日：2010-12-30
申请号：US12866936
申请日：2009-04-16
申请人： Fumio Miyahara , Mitsunori Saitoh , Naoko Yamaguchi
发明人： Fumio Miyahara , Mitsunori Saitoh , Naoko Yamaguchi
IPC分类号： B32B5/26 , B65D85/808 , D04H1/42
CPC分类号： B32B37/06 , B01D39/083 , B01D39/163 , B01D2239/0233 , B01D2239/0266 , B01D2239/0681 , B01D2239/1233 , B01D2239/1291 , B32B5/022 , B32B5/024 , B32B5/08 , B32B5/22 , B32B5/26 , B32B2262/0253 , B32B2262/0276 , B32B2262/12 , B32B2305/18 , B32B2305/20 , B32B2307/31 , B32B2307/412 , B32B2307/50 , B32B2307/7163 , B32B2307/718 , B32B2439/46 , B32B2439/70 , D04H1/4374 , D04H1/559 , D04H1/56 , D04H1/587 , D04H1/593 , D04H3/16 , Y10T428/24992
摘要： A fiber sheet is obtained by laminating a nonwoven fabric on a gauze. The gauze satisfies a warp fineness of 5 to 40 deniers, a warp density of 40 to 100 warps/inch, a weft fineness of 5 to 40 deniers, and a weft density of 20 to 100 wefts/inch. The nonwoven fabric is made of a melt-blown nonwoven fabric, a spunbonded nonwoven fabric, or a carded nonwoven fabric, having a fineness of 4.0 deniers or less. The fiber sheet has a basis weight of 7.5 to 20 g/m2. The fiber sheet is excellent like a gauze in terms of its transparency and strength and suitable also for contents having fine particle diameters. The fiber sheet can be obtained at a high productivity.
摘要翻译：通过将无纺布层叠在纱布上而获得纤维片材。该纱布满足5至40旦尼尔的经纱细度，40至100根经纱/英寸的经纱密度，5至40旦尼尔的纬纱细度和20至100纬纱/英寸的纬纱密度。无纺布由细度为4.0旦尼尔以下的熔喷无纺布，纺粘无纺布或梳理无纺布制成。纤维片的单位面积重量为7.5〜20g / m 2。纤维片在透明性和强度方面优于纱布，并且也适用于具有细粒径的内容物。可以高生产率获得纤维片。

4. 发明授权

US08609511B2 Semiconductor device manufacturing method, semiconductor device, and camera module 失效
标题翻译：半导体器件制造方法，半导体器件和相机模块
公开(公告)号：US08609511B2
公开(公告)日：2013-12-17
申请号：US13220001
申请日：2011-08-29
申请人： Takashi Shirono , Kazumasa Tanida , Naoko Yamaguchi , Satoshi Hongo , Tsuyoshi Matsumura
发明人： Takashi Shirono , Kazumasa Tanida , Naoko Yamaguchi , Satoshi Hongo , Tsuyoshi Matsumura
IPC分类号： H01L21/46
CPC分类号： H01L27/14618 , H01L27/1464 , H01L2924/0002 , H01L2924/00
摘要： According to one embodiment, an insulation film is formed over the surface, backside, and sides of a first substrate. Next, the insulation film formed over the surface of the first substrate is removed. Then, a joining layer is formed over the surface of the first substrate, from which the insulation film has been removed. Subsequently, the first substrate is bonded to a second substrate via a joining layer.
摘要翻译：根据一个实施例，在第一基板的表面，背面和侧面上形成绝缘膜。接下来，去除在第一基板的表面上形成的绝缘膜。然后，在第一基板的表面上形成接合层，绝缘膜已经从该表面移除。随后，第一基板经由接合层与第二基板接合。

5. 发明授权

US07877871B2 Method of manufacturing an electronic circuit formed on a substrate 有权
标题翻译：制造形成在基板上的电子电路的方法
公开(公告)号：US07877871B2
公开(公告)日：2011-02-01
申请号：US12230280
申请日：2008-08-27
申请人： Hideo Aoki , Naoko Yamaguchi , Chiaki Takubo , Toshiaki Yamauchi , Koji Imamiya , Hiroshi Hashizume
发明人： Hideo Aoki , Naoko Yamaguchi , Chiaki Takubo , Toshiaki Yamauchi , Koji Imamiya , Hiroshi Hashizume
IPC分类号： H05K3/02 , G03G15/16
CPC分类号： H05K3/207 , G03G15/6591 , G03G2215/00523 , H05K1/095 , H05K3/1266 , H05K3/246 , H05K2201/0347 , H05K2201/09781 , H05K2203/0517 , H05K2203/105 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49165
摘要： An image forming apparatus comprises an exposure unit forming an electrostatic latent image on a photo conductor based on image information, a developing unit developing the electrostatic latent image by toner made of formation material of a circuitry layer, and an electrostatic transferring unit transferring a toner image on the photo conductor onto a substrate. The toner image is transferred so as to cover at least a part of a conductor layer formed on the substrate. At this time, excessive charges caused in the conductor layer accompanying the start of the transfer of the toner image are removed. Alternatively, charges of which polarity is reverse to that of the toner are added to the conductor layer. These allow the circuitry layer to be formed to have a desired pattern favorably and securely on the conductor layer.
摘要翻译：图像形成装置包括基于图像信息在光导体上形成静电潜像的曝光单元，通过电路层的形成材料制成的调色剂来显影静电潜像的显影单元和传送调色剂图像的静电转印单元在光导体上的基片上。转印调色剂图像以覆盖形成在基板上的导体层的至少一部分。此时，伴随着调色剂图像的转印开始导致的导体层中引起的过多的电荷被去除。或者，将与该调色剂相反极性的电荷加到导体层中。这些允许电路层形成为在导体层上有利地并且牢固地具有期望的图案。

6. 发明申请

US20100000083A1 METAL-CONTAINING RESIN PARTICLE, RESIN PARTICLE, ELECTRONIC CIRCUIT SUBSTRATE, AND METHOD OF PRODUCING ELECTRONIC CIRCUIT 有权
标题翻译：含金属树脂颗粒，树脂颗粒，电子电路基板以及生产电子电路的方法
公开(公告)号：US20100000083A1
公开(公告)日：2010-01-07
申请号：US12541568
申请日：2009-08-14
申请人： Naoko Yamaguchi , Hideo Aoki , Chiaki Takubo
发明人： Naoko Yamaguchi , Hideo Aoki , Chiaki Takubo
IPC分类号： H05K3/10 , H05K3/20
CPC分类号： H05K3/246 , G03G15/6585 , H01L23/49883 , H01L2924/0002 , H05K1/095 , H05K3/1266 , H05K3/4664 , H05K2201/0212 , H05K2201/0347 , H05K2203/0517 , Y10T29/49128 , Y10T29/49155 , Y10T29/49158 , Y10T29/4916 , Y10T428/12097 , Y10T428/12104 , Y10T428/12111 , Y10T428/24917 , H01L2924/00
摘要： According to one mode of the present invention, metal-containing resin particles comprising a resin containing a thermosetting resin at 50 wt % or more and having a rate of moisture absorption from 500 to 14500 ppm, and fine metal particles contained in the resin, is provided.
摘要翻译：根据本发明的一种模式，含有含有50重量％以上的热固性树脂的树脂含水率为500〜14500ppm的含金属的树脂粒子和树脂中含有的微细金属粒子是提供。

7. 发明授权

US06977130B2 Method of manufacturing an electronic circuit and manufacturing apparatus of an electronic circuit 失效
标题翻译：电子电路的制造方法和电子电路的制造装置
公开(公告)号：US06977130B2
公开(公告)日：2005-12-20
申请号：US10618631
申请日：2003-07-15
申请人： Hideo Aoki , Chiaki Takubo , Atsuko Iida , Yasuyuki Hotta , Naoko Yamaguchi
发明人： Hideo Aoki , Chiaki Takubo , Atsuko Iida , Yasuyuki Hotta , Naoko Yamaguchi
IPC分类号： H01L21/28 , G03G5/05 , G03G9/09 , G03G13/26 , H01L21/288 , H01L21/3205 , H05K3/10 , H05K3/18 , H05K3/24 , H05K3/46 , G03G13/16 , B05D1/04 , H05C1/00
CPC分类号： H05K3/4664 , G03G5/056 , G03G9/0926 , G03G13/26 , G03G15/224 , G03G15/225 , G03G15/6585 , G03G15/6591 , H01L24/19 , H01L2224/04105 , H01L2224/32225 , H01L2224/73267 , H01L2224/92244 , H01L2924/12042 , H01L2924/15153 , H01L2924/15787 , H05K3/1266 , H05K3/246 , H05K2201/0212 , H05K2201/0347 , H05K2203/0425 , H05K2203/0517 , H05K2203/0522 , H05K2203/0537 , H01L2924/00
摘要： A method of manufacturing an electronic circuit satisfying demands for cost reduction, diversified small-quantity production, and a shorter cycle of design, manufacture, evaluation, correction, and so on is provided. The method includes at least forming a first pattern or forming a second pattern. Forming the first pattern comprises: forming a visible image on an electrostatic latent image formed on a photosensitive base, by the adhesion of charged particles essentially made of a resin; transferring the visible image onto the intermediate transfer base by the contact and pressurization of the visible image; heating/softening on the intermediate transfer base; and transferring a heated/softened resin layer onto a base material by the contact and pressurization of the resin layer. In forming the second pattern, using charged particles containing conductive metal particulates, a conductor metal layer is formed by electroless plating after a metal-containing resin pattern is transferred similarly to the first pattern formation.
摘要翻译：提供了一种制造满足成本降低，多样化的小批量生产和更短的设计，制造，评估和校正周期的电子电路的方法。该方法包括至少形成第一图案或形成第二图案。形成第一图案包括：通过基本上由树脂制成的带电粒子的粘附在形成在感光基底上的静电潜像上形成可见图像; 通过可见图像的接触和加压将可见图像转印到中间转印基底上; 在中间转移基体上加热/软化; 并通过树脂层的接触和加压将加热/软化的树脂层转移到基材上。在形成第二图案时，使用含有导电金属微粒的带电粒子，在与第一图案形成类似地转移含金属的树脂图案之后，通过无电镀形成导体金属层。

8. 发明授权

US06486001B1 Fabricating method of semiconductor device 失效
标题翻译：半导体器件的制造方法
公开(公告)号：US06486001B1
公开(公告)日：2002-11-26
申请号：US09522169
申请日：2000-03-09
申请人： Yumiko Ohshima , Naoko Yamaguchi
发明人： Yumiko Ohshima , Naoko Yamaguchi
IPC分类号： H01L2144
CPC分类号： H01L21/563 , H01L24/29 , H01L24/83 , H01L2224/16225 , H01L2224/29111 , H01L2224/2919 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/73253 , H01L2224/83102 , H01L2224/83192 , H01L2224/92125 , H01L2224/92225 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/16152 , H01L2924/16195 , H01L2924/351 , H01L2924/00 , H01L2224/13111 , H01L2924/00014
摘要： According to a fabricating method of the present invention, a cap shaped cover plate having a concaved portion on the inner surface is mounted on the rear surface of a semiconductor chip. After solder bumps are formed on a connecting pad of a wiring substrate, a fluid resin layer is formed on the bump formed surface. Thereafter, the semiconductor chip with the cover plate adhered is mounted with a face down on the resin layer formed surface of the wiring substrate. The solder bumps on the chip side and the solder bumps on the substrate side are contacted. At that time, the peripheral portion of the cover plate is contacted and adhered to the wiring substrate. Thereafter, while the bumps on the chip side and the bumps on the substrate side are being heated, melted, and connected, the fluid resin layer on the wiring substrate is hardened. Thus, the space between the semiconductor chip and the wiring substrate (namely, the height of the bumps) is controlled to a predetermined value. As a result, a semiconductor device having a flip-chip bonded portion with high reliability can be fabricated with simplified steps and high yield.
摘要翻译：根据本发明的制造方法，在半导体芯片的后表面上安装有在内表面上具有凹部的盖形盖板。在布线基板的连接焊盘上形成焊锡凸块之后，在凸块形成面上形成流体树脂层。此后，将具有盖板的半导体芯片粘接在面板向下安装在布线基板的树脂层形成表面上。芯片侧的焊料凸块和基板侧的焊料凸点接触。此时，盖板的周边部分接触并粘附到布线基板。此后，芯片侧的突起和基板侧的凸块被加热熔融连接，使布线基板上的流体树脂层硬化。因此，将半导体芯片和布线基板之间的空间（即凸块的高度）控制在预定值。结果，可以以简化的步骤和高产率制造具有高可靠性的倒装芯片接合部分的半导体器件。

9. 发明授权

US08778778B2 Manufacturing method of semiconductor device, semiconductor substrate, and camera module 有权
标题翻译：半导体器件，半导体衬底和相机模块的制造方法
公开(公告)号：US08778778B2
公开(公告)日：2014-07-15
申请号：US13212644
申请日：2011-08-18
申请人： Kazumasa Tanida , Masahiro Sekiguchi , Masayuki Dohi , Tsuyoshi Matsumura , Hideo Numata , Mari Otsuka , Naoko Yamaguchi , Takashi Shirono , Satoshi Hongo
发明人： Kazumasa Tanida , Masahiro Sekiguchi , Masayuki Dohi , Tsuyoshi Matsumura , Hideo Numata , Mari Otsuka , Naoko Yamaguchi , Takashi Shirono , Satoshi Hongo
IPC分类号： H01L21/77
CPC分类号： H01L27/1464 , H01L27/14618 , H01L27/14621 , H01L27/14627 , H01L27/14683 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： According to an embodiment, an active layer is formed on a first surface of a semiconductor substrate, a wiring layer is formed on the active layer, and an insulating layer is formed covering the wiring layer. The first surface of the semiconductor substrate is bonded to a support substrate via the insulating layer, and the semiconductor substrate bonded to the support substrate is thinned leaving the semiconductor substrate having a predetermined thickness which covers the active layer from a second surface. At least a part of area of the thinned semiconductor substrate is removed to expose the active layer.
摘要翻译：根据实施例，在半导体衬底的第一表面上形成有源层，在有源层上形成布线层，并且覆盖布线层形成绝缘层。半导体衬底的第一表面经由绝缘层接合到支撑衬底，并且结合到支撑衬底的半导体衬底被薄化，从第二表面离开具有预定厚度的半导体衬底覆盖有源层。去除减薄的半导体衬底的面积的至少一部分以暴露活性层。

10. 发明授权

US07939171B2 Metal-containing resin particle, metal-containing resin layer, method of forming metal-containing resin layer, and substrate for electronic circuit 失效
标题翻译：含金属的树脂颗粒，含金属的树脂层，形成含金属的树脂层的方法和用于电子电路的基材
公开(公告)号：US07939171B2
公开(公告)日：2011-05-10
申请号：US11018473
申请日：2004-12-22
申请人： Hideo Aoki , Naoko Yamaguchi , Chiaki Takubo
发明人： Hideo Aoki , Naoko Yamaguchi , Chiaki Takubo
IPC分类号： B32B5/66
CPC分类号： H05K3/207 , H05K1/095 , H05K3/1266 , H05K2201/0212 , H05K2201/0215 , H05K2203/0517 , Y10T428/12535 , Y10T428/12556 , Y10T428/12569 , Y10T428/256 , Y10T428/2991 , Y10T428/2998
摘要： Provided is metal-containing resin particle for forming a conductor pattern in which the metal particles are dispersed in a resin matrix, and the content of the metal particles is 70 wt % or less.
摘要翻译：本发明提供用于形成金属颗粒分散在树脂基体中的金属的树脂颗粒，并且金属颗粒的含量为70重量％以下。

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