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    • 2. 发明授权
    • Top coating composition for photoresist and method of forming photoresist pattern using same
    • 用于光致抗蚀剂的顶涂层组合物和使用其形成光刻胶图案的方法
    • US07384730B2
    • 2008-06-10
    • US11281775
    • 2005-11-17
    • Mitsuhiro HataMan-Hyoung RyooSang-Gyun WooHyun-Woo KimJin-Young YoonJung-Hwan Hah
    • Mitsuhiro HataMan-Hyoung RyooSang-Gyun WooHyun-Woo KimJin-Young YoonJung-Hwan Hah
    • G03F7/38H01L21/027G03F7/11
    • G03F7/11C08F220/06C08F220/18G03F7/2041Y10S430/146Y10S430/162
    • Top coating compositions capable of being used in immersion lithography, and methods of forming photoresist patterns using the same, are provided. The top coating composition includes: a polymer, a base; and a solvent, wherein the polymer may be represented by Formula I: wherein R1 and R2 are independently selected from the group consisting of hydrogen, fluoro, methyl, and trifluoromethyl; X is a carboxylic acid group or a sulfonic acid group; Y is a carboxylic acid group or a sulfonic acid group, wherein the carboxylic acid group or sulfonic acid group is protected; Z is a monomer selected from the group consisting of a vinyl monomer, an alkyleneglycol, a maleic anhydride, an ethyleneimine, an oxazoline-containing monomer, acrylonitrile, an allylamide, a 3,4-dihydropyran, a 2,3-dihydrofuran, tetrafluoroethylene, or a combination thereof; and m, n, and q are integers wherein 0.03≦m/(m+n+q)≦0.97, 0.03≦n/(m+n+q)≦0.97, 0≦q/(m+n+q)≦0.5; and wherein the solvent includes deionized water.
    • 提供能够用于浸没式光刻的顶涂层组合物,以及使用其形成光刻胶图案的方法。 顶部涂料组合物包括:聚合物,碱; 和溶剂,其中所述聚合物可以由式I表示:其中R 1和R 2独立地选自氢,氟,甲基和三氟甲基 ; X是羧酸基或磺酸基; Y是羧酸基或磺酸基,其中羧酸基或磺酸基被保护; Z是选自乙烯基单体,亚烷基二醇,马来酸酐,乙烯亚胺,含恶唑啉的单体,丙烯腈,烯丙基酰胺,3,4-二氢吡喃,2,3-二氢呋喃,四氟乙烯 ,或其组合; 并且m,n和q是整数,其中<?in-line-formula description =“In-line Formulas”end =“lead”?> 0.03 <= m /(m + n + q)<= 0.97, in-line-formula description =“In-line Formulas”end =“tail”?> <?in-line-formula description =“In-line Formulas”end =“lead”?> 0.03 <= n /(m + n + q)<= 0.97,<?in-line-formula description =“In-line Formulas”end =“tail”?> <?in-line-formula description =“In-line Formulas”end =“lead” α> 0 <= q /(m + n + q)<= 0.5; <?in-line-formula description =“In-line Formulas”end =“tail”?>,其中溶剂包括去离子水。
    • 5. 发明申请
    • Photo mask structure used during twice-performed photo process and methods of using the same
    • 在两次照相过程中使用的光掩模结构及其使用方法
    • US20060115747A1
    • 2006-06-01
    • US11281466
    • 2005-11-18
    • Hyung-Rae LeeJin-Young YoonSang-Gyun WooMan-Hyoung RyooMin-Jeong Oh
    • Hyung-Rae LeeJin-Young YoonSang-Gyun WooMan-Hyoung RyooMin-Jeong Oh
    • G03C5/00G03F1/00
    • G03F1/70
    • A photo mask structure used during a twice-performed photo process and methods of using the same. The photo mask structure may include first mask patterns that correspond to first photoresist patterns during a first photo process performed on a first photoresist layer and second mask patterns that correspond to second photoresist patterns during a second photo process performed on a second photoresist layer. A method of using a photo mask structure may include performing a first photo process on a first photoresist layer using first mask patterns of the photo mask structure to form first photoresist patterns on a semiconductor substrate, and performing a second photo process on a second photoresist layer using second mask patterns of the photo mask structure to form second photoresist patterns on a semiconductor substrate, wherein the second photoresist patterns are interposed between the first photoresist patterns and overlap the first photoresist patterns.
    • 在两次照相处理过程中使用的光掩模结构及其使用方法。 光掩模结构可以包括在对第一光致抗蚀剂层执行的第一光刻工艺期间对应于第一光致抗蚀剂图案的第一掩模图案和在对第二光致抗蚀剂层执行的第二光刻工艺期间对应于第二光致抗蚀剂图案的第二掩模图案。 使用光掩模结构的方法可以包括使用光掩模结构的第一掩模图案在第一光致抗蚀剂层上进行第一光刻工艺以在半导体衬底上形成第一光致抗蚀剂图案,并且在第二光刻胶层上进行第二光刻工艺 使用所述光掩模结构的第二掩模图案在半导体衬底上形成第二光致抗蚀剂图案,其中所述第二光致抗蚀剂图案插入在所述第一光致抗蚀剂图案之间并与所述第一光致抗蚀剂图案重叠。