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1. 发明授权

US10557185B2 Free-cutting copper alloy, and method for producing free-cutting copper alloy 有权
公开(公告)号：US10557185B2
公开(公告)日：2020-02-11
申请号：US16274622
申请日：2019-02-13
申请人： Mitsubishi Shindoh Co., Ltd.
发明人： Keiichiro Oishi , Kouichi Suzaki , Shinji Tanaka , Takayuki Oka
IPC分类号： C22C9/04 , C22F1/00 , C22F1/08
摘要： This free-cutting copper alloy contains 75.0%-78.5% Cu, 2.95%-3.55% Si, 0.07%-0.28% Sn, 0.06%-0.14% P, and 0.022%-0.25% Pb, with the remainder being made up of Zn and inevitable impurities. The composition satisfies the following relations: 76.2≤f1=Cu+0.8×Si−8.5×Sn+P+0.5×Pb≤80.3, 61.5≤f2=Cu−4.3×Si−0.7×Sn−P+0.5×Pb≤63.3. The area ratios (%) of the constituent phases satisfy the following relations: 25≤κ≤65, 0≤γ≤1.5, 0≤β≤0.2, 0≤μ≤2.0, 97.0≤f3=α+κ, 99.4≤f4=α+κ+γ+μ, 0≤f5=γ+μ≤2.5, 27≤f6=κ+6×γ1/2+0.5×μ≤70. The long side of the γ phase does not exceed 40 μm, the long side of the μ phase does not exceed 25 μm, and the κ phase is present within the α phase.

2. 发明授权

US10538828B2 Free-cutting copper alloy, and method for producing free-cutting copper alloy 有权
公开(公告)号：US10538828B2
公开(公告)日：2020-01-21
申请号：US16325267
申请日：2017-08-15
申请人： Mitsubishi Shindoh Co., Ltd.
发明人： Keiichiro Oishi , Kouichi Suzaki , Shinji Tanaka , Takayuki Oka
IPC分类号： C22C9/04 , C22F1/00 , C22F1/08
摘要： This free-cutting copper alloy contains 75.0 %-78.5% Cu, 2.95%-3.55% Si, 0.07%-0.28% Sn, 0.06%-0.14% P, and 0.022%-0.25% Pb, with the remainder being made up of Zn and inevitable impurities. The composition satisfies the following relations: 76.2≤f1=Cu+0.8×Si−8.5×Sn+P+0.5×Pb≤80.3, 61.5≤f2=Cu−4.3×Si−0.7×Sn−P+0.5×Pb≤63.3. The area ratios (%) of the constituent phases satisfy the following relations: 25≤κ≤65, 0≤γ≤1.5, 0≤β≤0.2, 0≤μ≤2.0, 97.0≤f3=α+κ, 99.4≤f4=α+κ+γ+μ, 0≤f5=γ+μ≤2.5, 27≤f6=κ+6×γ1/2+0.5×μ≤70. The long side of the γ phase does not exceed 40 μm, the long side of the μ phase does not exceed 25 μm, and the κ phase is present within the α phase.

3. 发明申请

US20190241999A1 FREE-CUTTING COPPER ALLOY, AND METHOD FOR PRODUCING FREE-CUTTING COPPER ALLOY 审中-公开
公开(公告)号：US20190241999A1
公开(公告)日：2019-08-08
申请号：US16274622
申请日：2019-02-13
申请人： Mitsubishi Shindoh Co., Ltd.
发明人： Keiichiro Oishi , Kouichi Suzaki , Shinji Tanaka , Takayuki Oka
IPC分类号： C22F1/08 , C22C9/04
摘要： This free-cutting copper alloy contains 75.0%-78.5% Cu, 2.95%-3.55% Si, 0.07%-0.28% Sn, 0.06%-0.14% P, and 0.022%-0.25% Pb, with the remainder being made up of Zn and inevitable impurities. The composition satisfies the following relations: 76.2≤f1=Cu+0.8×Si−8.5×Sn+P+0.5×Pb≤80.3, 61.5≤f2=Cu−4.3×Si−0.7×Sn−P+0.5×Pb≤63.3. The area ratios (%) of the constituent phases satisfy the following relations: 25≤κ≤65, 0≤γ≤1.5, 0≤β≤0.2, 0≤μ≤2.0, , 97.0≤f3=α+κ, 99.4≤f4=α+κ+γ+μ, 0≤f5=γ+μ≤2.5, 27≤f6=κ+6×γ1/2+0.5×μ≤70. The long side of the γ phase does not exceed 40 μm, the long side of the μ phase does not exceed 25 μm, and the κ phase is present within the α phase.

4. 发明申请

US20200165706A1 FREE-CUTTING COPPER ALLOY AND METHOD FOR PRODUCING FREE-CUTTING COPPER ALLOY 审中-公开
公开(公告)号：US20200165706A1
公开(公告)日：2020-05-28
申请号：US16482913
申请日：2018-02-21
申请人： Mitsubishi Shindoh Co., Ltd.
发明人： Keiichiro Oishi , Kouichi Suzaki , Shinji Tanaka , Takayuki Oka
IPC分类号： C22C9/04 , C22F1/08
摘要： This free-cutting copper alloy comprises 75.4-78.7% Cu, 3.05-3.65% Si, 0.10-0.28% Sn, 0.05-0.14% P, and at least 0.005% to less than 0.020% Pb, with the remainder comprising Zn and inevitable impurities. The composition satisfies the following relations: 76.5≤f1=Cu+0.8×Si−8.5×Sn+P≤80.3; 60.7≤f2=Cu−4.6×Si−0.7×Sn−P≤62.1; and 0.25≤f7=P/Sn≤1.0. The area percentage (%) of respective constituent phases satisfies the following relations: 28≤κ≤67; 0≤γ≤1.0; 0≤β≤0.2; 0≤μ≤1.5; 97.4≤f3=α+κ; 99.4≤f4=α+κ+γ+μ; 0≤f5=γ+μ≤2.0; and 30≤f6=κ+6×γ1/2+0.5×μ≤70. The long side of the γ phase is at most 40 μm, the long side of the μ phase is at most 25 μm, and κ phase is present in α phase.

5. 发明申请

US20190256960A1 FREE-CUTTING COPPER ALLOY CASTING, AND METHOD FOR PRODUCING FREE-CUTTING COPPER ALLOY CASTING 审中-公开
公开(公告)号：US20190256960A1
公开(公告)日：2019-08-22
申请号：US16323112
申请日：2017-08-15
申请人： Mitsubishi Shindoh Co., Ltd.
发明人： Keiichiro Oishi , Kouichi Suzaki , Shinji Tanaka , Yoshiyuki Goto
IPC分类号： C22F1/08 , C22C9/04
摘要： This free-cutting copper alloy casting contains 75.0-78.5% Cu, 2.95-3.55% Si, 0.07-0.28% Sn, 0.06-0.14% P, 0.022-0.20% Pb, with the remainder being made up of Zn and unavoidable impurities. The composition satisfies the following relations: 76.2≤f1=Cu+0.8×Si−8.5×Sn+P+0.5×Pb≤80.3, 61.2≤f2=Cu−4.4×Si−0.8×Sn−P+0.5×Pb≤62.8. The area ratios (%) of the constituent phases satisfy the following relations: 2.5≤κ65, 0≤γ≤2.0, 0≤β≤0.3, 0≤μ≤2.0, 96.5≤f3=α+κ, 99.2≤f4=α+κ+γ+μ, 0≤f6=γ+μ≤3.0, 29≤f6=κ+6×γ1/2+0.5×μ≤66. The long side of the γ phase does not exceed 50 μm, the long side of the μ phase does not exceed 25 μm, and the κ phase is present within the α phase.

6. 发明申请

US20140202602A1 COPPER ALLOY SHEET AND METHOD FOR MANUFACTURING COPPER ALLOY SHEET 有权
标题翻译：铜合金板和制造铜合金板的方法
公开(公告)号：US20140202602A1
公开(公告)日：2014-07-24
申请号：US14163932
申请日：2014-01-24
申请人： MITSUBISHI SHINDOH CO., LTD.
发明人： Keiichiro Oishi , Kouichi Suzaki
IPC分类号： C22F1/08
CPC分类号： C22C21/10 , B21B1/22 , B21B3/00 , C22C9/04 , C22C13/00 , C22F1/00 , C22F1/08 , H01B1/026
摘要： An aspect of the copper alloy sheet contains 5.0 mass % to 12.0 mass % of Zn, 1.1 mass % to 2.5 mass % of Sn, 0.01 mass % to 0.09 mass % of P and 0.6 mass % to 1.5 mass % of Ni with a remainder of Cu and inevitable impurities, and satisfied a relationship of 20≦[Zn]+7×[Sn]+15×[P]+4.5×[Ni]≦32. The aspect of the copper alloy sheet is manufactured using a manufacturing process including a cold finishing rolling process in which a copper alloy material is cold-rolled, the average crystal grain diameter of the copper alloy material is 1.2 μm to 5.0 μm, round or oval precipitates are present in the copper alloy material, the average grain diameter of the precipitates is 4.0 nm to 25.0 nm or a proportion of precipitates having a grain diameter of 4.0 nm to 25.0 nm in the precipitates is 70 % or more.
摘要翻译：铜合金板的一方面，含有5.0质量％〜12.0质量％的Zn，Sn：1.1质量％〜2.5质量％，P：0.01质量％〜0.09质量％，Ni：0.6质量％〜1.5质量％的Cu和不可避免的杂质，满足20＆nlE; [Zn] + 7×[Sn] + 15×[P] + 4.5×[Ni]＆nlE; 32的关系。铜合金板的方面是使用冷轧精轧方法制造的，其中铜合金材料被冷轧，铜合金材料的平均晶粒直径为1.2μm至5.0μm，圆形或椭圆形析出物存在于铜合金材料中，析出物的平均粒径为4.0nm〜25.0nm，析出物的粒径为4.0nm〜25.0nm的析出物的比例为70％以上。

7. 发明申请

US20200181748A1 FREE-CUTTING COPPER ALLOY AND METHOD FOR PRODUCING FREE-CUTTING COPPER ALLOY 审中-公开
公开(公告)号：US20200181748A1
公开(公告)日：2020-06-11
申请号：US16483858
申请日：2018-02-21
申请人： Mitsubishi Shindoh Co., Ltd.
发明人： Keiichiro Oishi , Kouichi Suzaki , Hiroki Goto , Shinji Tanaka
IPC分类号： C22F1/08 , C22C9/04
摘要： This free-cutting copper alloy comprises 76.0-78.7% Cu, 3.1-3.6% Si, 0.40-0.85% Sn, 0.05-0.14% P, and at least 0.005% to less than 0.020% Pb, with the remainder comprising Zn and inevitable impurities. The composition satisfies the following relations: 75.0≤f1=Cu+0.8×Si−7.5×Sn+0.5×Pb≤78.2; 60.0≤f2=Cu−4.8×Si—0.8×Sn−P+0.5×Pb≤61.5; and 0.09≤f3=P/Sn≤0.30. The area percentage (%) of respective constituent phases satisfies the following relations: 30≤κ≤65; 0≤γ≤2.0; 0≤β≤0.3; 0≤μ≤2.0; 96.5≤f4=α+κ; 99.4≤f5=α+κ+γ+μ; 0≤f6=γ+μ≤3.0; and 35≤f7=1.05×κ+6×γ1/2+0.5×μ≤70. κ phase is present in α phase, the long side of the γ phase is at most 50 μm, and the long side of the μ phase is at most 25 μm.

8. 发明申请

US20200157658A1 FREE-CUTTING COPPER ALLOY CASTING AND METHOD FOR PRODUCING FREE-CUTTING COPPER ALLOY CASTING 审中-公开
公开(公告)号：US20200157658A1
公开(公告)日：2020-05-21
申请号：US16325029
申请日：2017-08-15
申请人： Mitsubishi Shindoh Co., Ltd.
发明人： Keiichiro Oishi , Kouichi Suzaki , Shinji Tanaka , Yoshiyuki Goto
IPC分类号： C22C9/04 , C22F1/00 , C22F1/08
摘要： This free-cutting copper alloy casting contains: 76.0-79.0% Cu, 3.1-3.6% Si, 0.36-0.85% Sn, 0.06-0.14% P, 0.022-0.10% Pb, with the remainder being made up of Zn and unavoidable impurities. This composition satisfies the following relations: 75.5≤f1=Cu+0.8×Si−7.5×Sn+P+0.5×Pb≤78.7, 60.8≤f2=Cu−4.5×Si—0.8×Sn−P+0.5×Pb≤62.2, 0.09≤f3=P/Sn≤0.35. The area ratios (%) of the constituent phases satisfy the following relations, 30≤κ≤63, 0≤γ≤2.0, 0≤β≤0.3, 0≤μ≤2.0, 96.5≤f4=α+κ, 99.3≤f5=α+κ+γ+ρ, 0≤f6=γ+μ≤3.0, and 37≤f7=1.05×κ+6×γ1/2+0.5×μ≤72. The κ phase is present within the α phase, the long side of the γ phase does not exceed 50 μm, and the long side of the μ phase does not exceed 25 μm.

9. 发明授权

US10538827B2 Free-cutting copper alloy casting, and method for producing free-cutting copper alloy casting 有权
公开(公告)号：US10538827B2
公开(公告)日：2020-01-21
申请号：US16323112
申请日：2017-08-15
申请人： Mitsubishi Shindoh Co., Ltd.
发明人： Keiichiro Oishi , Kouichi Suzaki , Shinji Tanaka , Yoshiyuki Goto
IPC分类号： C22C9/04 , C22F1/00 , C22F1/08
摘要： This free-cutting copper alloy casting contains 75.0-78.5% Cu, 2.95-3.55% Si, 0.07-0.28% Sn, 0.06-0.14% P, 0.022-0.20% Pb, with the remainder being made up of Zn and unavoidable impurities. The composition satisfies the following relations: 76.2≤f1=Cu+0.8×Si−8.5×Sn+P+0.5×Pb≤80.3, 61.2≤f2=Cu−4.4×Si−0.8×Sn−P+0.5×Pb≤62.8. The area ratios (%) of the constituent phases satisfy the following relations: 2.5≤κ65, 0≤γ≤2.0, 0≤β≤0.3, 0≤μ≤2.0, 96.5≤f3=α+κ, 99.2≤f4=α+κ+γ+μ, 0≤f6=γ+μ≤3.0, 29≤f6=κ+6×γ1/2+0.5×μ≤66. The long side of the γ phase does not exceed 50 μm, the long side of the μ phase does not exceed 25 μm, and the κ phase is present within the α phase.

10. 发明申请

US20190249276A1 FREE-CUTTING COPPER ALLOY, AND METHOD FOR PRODUCING FREE-CUTTING COPPER ALLOY 审中-公开
公开(公告)号：US20190249276A1
公开(公告)日：2019-08-15
申请号：US16325267
申请日：2017-08-15
申请人： Mitsubishi Shindoh Co., Ltd.
发明人： Keiichiro Oishi , Kouichi Suzaki , Shinji Tanaka , Takayuki Oka
IPC分类号： C22C9/04 , C22F1/08
摘要： This free-cutting copper alloy contains 75.0%-78.5% Cu, 2.95%-3.55% Si, 0.07%-0.28% Sn, 0.06%-0.14% P, and 0.022%-0.25% Pb, with the remainder being made up of Zn and inevitable impurities. The composition satisfies the following relations: 76.2≤f1=Cu+0.8×Si−8.5×Sn+P+0.5×Pb≤80.3, 61.5≤f2=Cu−4.3×Si−0.7×Sn−P+0.5×Pb≤63.3. The area ratios (%) of the constituent phases satisfy the following relations: 25≤κ≤65, 0≤γ≤1.5, 0≤β≤0.2, 0≤μ≤2.0, 97.0≤f3=α+κ, 99.4≤f4=α+κ+γ+μ, 0≤f5=γ+μ≤2.5, 27≤f6=κ+6×γ1/2+0.5×μ≤70. The long side of the γ phase does not exceed 40 μm, the long side of the μ phase does not exceed 25 μm, and the κ phase is present within the α phase.

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