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1. 发明申请

US20090001575A1 Printed Circuit Board, Mounting Method of Electronic Component, and Electronic Apparatus 有权
标题翻译：印刷电路板，电子部件的安装方法和电子设备
公开(公告)号：US20090001575A1
公开(公告)日：2009-01-01
申请号：US12146329
申请日：2008-06-25
申请人： Minoru Takizawa , Kuniyasu Hosoda , Takahisa Funayama
发明人： Minoru Takizawa , Kuniyasu Hosoda , Takahisa Funayama
IPC分类号： H01L23/488 , H01L21/60
CPC分类号： H05K3/305 , H05K3/3436 , H05K2201/10734 , H05K2203/0545 , Y02P70/613
摘要： According to one embodiment, there is provided a printed circuit board includes a printed wiring board having a component mounting surface, a semiconductor package which is mounted on the component mounting surface of the printed wiring board by solder bonding using solder balls, and reinforcement portions which locally reinforce portions of the solder bonding of the semiconductor package at a plurality of locations on the component mounting surface of the printed wiring board, the reinforcement portions being formed of a resin material having parts entering the solder balls of the portions of the solder bonding.
摘要翻译：根据一个实施例，提供了一种印刷电路板，其包括具有部件安装表面的印刷线路板，通过使用焊球焊接而安装在印刷线路板的部件安装表面上的半导体封装，以及加强部在印刷电路板的部件安装表面上的多个位置处局部加强半导体封装的焊接部分，加强部分由具有进入焊料接合部分的焊球的部分的树脂材料形成。

2. 发明授权

US07675172B2 Printed circuit board, mounting method of electronic component, and electronic apparatus 有权
标题翻译：印刷电路板，电子部件的安装方法和电子设备
公开(公告)号：US07675172B2
公开(公告)日：2010-03-09
申请号：US12146329
申请日：2008-06-25
申请人： Minoru Takizawa , Kuniyasu Hosoda , Takahisa Funayama
发明人： Minoru Takizawa , Kuniyasu Hosoda , Takahisa Funayama
IPC分类号： H01L23/48
CPC分类号： H05K3/305 , H05K3/3436 , H05K2201/10734 , H05K2203/0545 , Y02P70/613
摘要： According to one embodiment, there is provided a printed circuit board includes a printed wiring board having a component mounting surface, a semiconductor package which is mounted on the component mounting surface of the printed wiring board by solder bonding using solder balls, and reinforcement portions which locally reinforce portions of the solder bonding of the semiconductor package at a plurality of locations on the component mounting surface of the printed wiring board, the reinforcement portions being formed of a resin material having parts entering the solder balls of the portions of the solder bonding.
摘要翻译：根据一个实施例，提供了一种印刷电路板，其包括具有部件安装表面的印刷线路板，通过使用焊球焊接而安装在印刷线路板的部件安装表面上的半导体封装，以及加强部在印刷电路板的部件安装表面上的多个位置处局部加强半导体封装的焊接部分，加强部分由具有进入焊料接合部分的焊球的部分的树脂材料形成。

3. 发明授权

US08072759B2 Electronic device 有权
标题翻译：电子设备
公开(公告)号：US08072759B2
公开(公告)日：2011-12-06
申请号：US12732037
申请日：2010-03-25
申请人： Minoru Takizawa , Takahisa Funayama
发明人： Minoru Takizawa , Takahisa Funayama
IPC分类号： H05K7/20
CPC分类号： H01L23/36 , H01L21/50 , H01L23/40 , H01L23/49816 , H01L2224/16 , H01L2924/00011 , H01L2924/00014 , H01L2224/0401
摘要： According to one embodiment, an electronic device includes a printed circuit board housed in a housing, a surface mount part soldered to the printed circuit board, a cooling mechanism which covers the surface mount part from an opposite side to the printed circuit board, a reinforcing portion formed by supplying an adhesive to an outer peripheral edge of the surface mount part and the printed circuit board such as to be across each other, which reinforces a solder joint portion provided between the surface mount part and the printed circuit board and a spacer formed of the adhesive, which is set between the surface mount part and the cooling mechanism and supports the cooling mechanism.
摘要翻译：根据一个实施例，电子设备包括容纳在壳体中的印刷电路板，焊接到印刷电路板的表面安装部分，从印刷电路板的相对侧覆盖表面安装部分的冷却机构，通过将粘合剂供给到表面安装部分和印刷电路板的外周边缘而形成，以便彼此相对，这加强了设置在表面安装部分和印刷电路板之间的焊接部分和形成的间隔件该粘合剂被安置在表面安装部分和冷却机构之间并支撑冷却机构。

4. 发明申请

US20100309628A1 ELECTRONIC DEVICE 有权
标题翻译：电子设备
公开(公告)号：US20100309628A1
公开(公告)日：2010-12-09
申请号：US12732037
申请日：2010-03-25
申请人： Minoru Takizawa , Takahisa Funayama
发明人： Minoru Takizawa , Takahisa Funayama
IPC分类号： H05K7/20
CPC分类号： H01L23/36 , H01L21/50 , H01L23/40 , H01L23/49816 , H01L2224/16 , H01L2924/00011 , H01L2924/00014 , H01L2224/0401
摘要： According to one embodiment, an electronic device includes a printed circuit board housed in a housing, a surface mount part soldered to the printed circuit board, a cooling mechanism which covers the surface mount part from an opposite side to the printed circuit board, a reinforcing portion formed by supplying an adhesive to an outer peripheral edge of the surface mount part and the printed circuit board such as to be across each other, which reinforces a solder joint portion provided between the surface mount part and the printed circuit board and a spacer formed of the adhesive, which is set between the surface mount part and the cooling mechanism and supports the cooling mechanism.
摘要翻译：根据一个实施例，电子设备包括容纳在壳体中的印刷电路板，焊接到印刷电路板的表面安装部分，从印刷电路板的相对侧覆盖表面安装部分的冷却机构，通过将粘合剂供给到表面安装部分和印刷电路板的外周边缘而形成，以便彼此相对，这加强了设置在表面安装部分和印刷电路板之间的焊接部分和形成的间隔件该粘合剂被安置在表面安装部分和冷却机构之间并支撑冷却机构。

5. 发明申请

US20110242781A1 Module and Electronic Device 失效
标题翻译：模块和电子设备
公开(公告)号：US20110242781A1
公开(公告)日：2011-10-06
申请号：US13034520
申请日：2011-02-24
申请人： Takahisa Funayama , Nobuhiro Yamamoto
发明人： Takahisa Funayama , Nobuhiro Yamamoto
IPC分类号： H05K7/00
CPC分类号： H05K7/00 , G01R31/2853 , G01R31/31717
摘要： According to one embodiment, a module includes a circuit substrate having a circuit pattern which is formed of a first conductor and which includes a signal circuit, a bonding member formed of a second conductor different from the first conductor, a passive element and an active element bonded to the circuit pattern with the bonding member to implement the circuit substrate, and a detection circuit provided separately from the signal circuit on the circuit substrate. The detection circuit includes a detector having the first conductor and the second conductor which are provided on the circuit substrate and which are electrically connected to each other, a power source configured to supply current to the detector, and a measuring instrument interposed between one of the first and the second conductors in the detector and the power source and configured to measure electrical characteristics between the first and the second conductors.
摘要翻译：根据一个实施例，模块包括具有由第一导体形成的电路图案的电路基板，该电路图形包括信号电路，由不同于第一导体的第二导体形成的接合部件，无源元件和有源元件利用所述接合部件与所述电路图案接合以实现所述电路基板，以及与所述电路基板上的所述信号电路分开设置的检测电路。检测电路包括具有第一导体和第二导体的检测器，其设置在电路基板上并彼此电连接;电源，被配置为向检测器提供电流;以及测量仪器，检测器和电源中的第一和第二导体，并且被配置为测量第一和第二导体之间的电特性。

6. 发明授权

US09007779B2 Electronic apparatus and hard disk drive 有权
标题翻译：电子设备和硬盘驱动器
公开(公告)号：US09007779B2
公开(公告)日：2015-04-14
申请号：US13358432
申请日：2012-01-25
申请人： Nobuhiro Yamamoto , Takahisa Funayama
发明人： Nobuhiro Yamamoto , Takahisa Funayama
IPC分类号： H05K5/00 , H05K7/00 , H05K1/16 , H05K1/02 , G11B25/04 , H05K3/40
CPC分类号： H05K1/0215 , G11B25/043 , H05K3/4007 , H05K2201/0305 , H05K2201/10409
摘要： According to one embodiment, an electronic apparatus includes a case, a printed circuit board contained in the case and having a through-hole, and a fixing member including a shaft portion inserted in the through-hole and a head portion located at one end of the shaft portion. The electronic apparatus also includes copper foil provided on the printed circuit board, and a cover film including an opening portion configured to expose part of the copper foil. The opening portion is located at a position which is to be covered with the head portion, and the cover film covers the copper foil at positions other than the position where the opening portion is located. The electronic apparatus further includes a conductive material provided on the copper foil inside the opening portion and configured to electrically connect the head portion and the copper foil to each other.
摘要翻译：根据一个实施例，电子设备包括壳体，容纳在壳体中并具有通孔的印刷电路板，以及包括插入通孔中的轴部分的固定构件和位于通孔的一端的头部轴部分。电子设备还包括设置在印刷电路板上的铜箔，以及覆盖膜，其包括被配置为暴露铜箔的一部分的开口部分。开口部位于要被头部覆盖的位置，并且覆盖膜在位于开口部的位置以外的位置处覆盖铜箔。电子设备还包括设置在开口部分内的铜箔上的导电材料，并被配置为将头部部分和铜箔彼此电连接。

7. 发明申请

US20120085575A1 Electronic Apparatus Manufacturing Method, Electronic Component, and Electronic Apparatus 审中-公开
标题翻译：电子设备制造方法，电子部件和电子设备
公开(公告)号：US20120085575A1
公开(公告)日：2012-04-12
申请号：US13093641
申请日：2011-04-25
申请人： Nobuhiro Yamamoto , Takahisa Funayama
发明人： Nobuhiro Yamamoto , Takahisa Funayama
IPC分类号： H05K1/11 , H05K3/34
CPC分类号： H01L24/92 , H01L24/14 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L2224/131 , H01L2224/14155 , H01L2224/16225 , H01L2224/16227 , H01L2224/29012 , H01L2224/29015 , H01L2224/29034 , H01L2224/29078 , H01L2224/29082 , H01L2224/2919 , H01L2224/2929 , H01L2224/30131 , H01L2224/32225 , H01L2224/73103 , H01L2224/73104 , H01L2224/73204 , H01L2224/81191 , H01L2224/81815 , H01L2224/83191 , H01L2224/83192 , H01L2224/83862 , H01L2224/9211 , H01L2924/01029 , H05K3/3436 , H05K3/3489 , H05K2201/10977 , Y10T29/49144 , H01L2924/00012 , H01L2924/00 , H01L2924/0665 , H01L2924/00014 , H01L2224/81 , H01L2224/83 , H01L2924/014
摘要： According to one embodiment, a manufacturing method for an electronic apparatus, which includes a housing, a substrate, pads on the substrate, and an electronic component, which includes a component body including a bottom surface, terminals arranged on the bottom surface of the component body, and a thermosetting resin disposed on the bottom surface of the component body and configured to remove an oxide film when heated, and is mounted on the substrate, the method includes putting the electronic component on the substrate, heating the electronic component, thereby softening the resin, causing the softened resin to flow, thereby forcing out a gas between the electronic component and the substrate and filling the resin between the electronic component and the substrate, and further heating the electronic component, thereby solder-bonding the terminals and the pads to one another and curing the resin between the electronic component and the substrate.
摘要翻译：根据一个实施例，一种电子设备的制造方法，其包括壳体，基板，基板上的焊盘和电子部件，其包括具有底表面的部件主体，布置在部件的底表面上的端子主体和热固性树脂，其设置在所述部件主体的底面上并且被构造为在加热时除去氧化膜，并且安装在所述基板上，所述方法包括将所述电子部件放置在所述基板上，加热所述电子部件，由此软化树脂，使软化树脂流动，从而在电子部件和基板之间排出气体，并且在电子部件和基板之间填充树脂，并且进一步加热电子部件，从而焊接端子和焊盘并固化电子部件和基板之间的树脂。

8. 发明申请

US20110188224A1 ELECTRONIC DEVICE 审中-公开
标题翻译：电子设备
公开(公告)号：US20110188224A1
公开(公告)日：2011-08-04
申请号：US12903060
申请日：2010-10-12
申请人： Takahiro Sugai , Takahisa Funayama
发明人： Takahiro Sugai , Takahisa Funayama
IPC分类号： H05K7/02
CPC分类号： H05K7/02
摘要： An electronic device includes: an insulting casing having a first wall part and a second wall part that extends in a direction intersecting the first wall part; a contained component contained in the casing and provided at the first wall part at a position in the vicinity of the second wall part; and a conductive adhesive provided at the first wall part and comprising a first end portion electrically connected to the contained component and a second end portion provided at a position different from that of the first end portion.
摘要翻译：电子装置包括：绝缘壳体，具有第一壁部分和与沿第一壁部分相交的方向延伸的第二壁部分; 包含在所述壳体中并且在所述第一壁部处设置在所述第二壁部附近的位置处的容纳部件; 以及导电粘合剂，其设置在第一壁部，并且包括电连接到容纳部件的第一端部和设置在与第一端部的位置不同的位置处的第二端部。

9. 发明授权

US08451614B2 Module and electronic device 失效
标题翻译：模块和电子设备
公开(公告)号：US08451614B2
公开(公告)日：2013-05-28
申请号：US13034520
申请日：2011-02-24
申请人： Takahisa Funayama , Nobuhiro Yamamoto
发明人： Takahisa Funayama , Nobuhiro Yamamoto
IPC分类号： H05K7/00
CPC分类号： H05K7/00 , G01R31/2853 , G01R31/31717
摘要： According to one embodiment, a module includes a circuit substrate having a circuit pattern which is formed of a first conductor and which includes a signal circuit, a bonding member formed of a second conductor different from the first conductor, a passive element and an active element bonded to the circuit pattern with the bonding member to implement the circuit substrate, and a detection circuit provided separately from the signal circuit on the circuit substrate. The detection circuit includes a detector having the first conductor and the second conductor which are provided on the circuit substrate and which are electrically connected to each other, a power source configured to supply current to the detector, and a measuring instrument interposed between one of the first and the second conductors in the detector and the power source and configured to measure electrical characteristics between the first and the second conductors.
摘要翻译：根据一个实施例，模块包括具有由第一导体形成的电路图案的电路基板，该电路图形包括信号电路，由不同于第一导体的第二导体形成的接合部件，无源元件和有源元件利用所述接合部件与所述电路图案接合以实现所述电路基板，以及与所述电路基板上的所述信号电路分开设置的检测电路。检测电路包括具有第一导体和第二导体的检测器，其设置在电路基板上并彼此电连接;电源，被配置为向检测器提供电流;以及测量仪器，检测器和电源中的第一和第二导体，并且被配置为测量第一和第二导体之间的电特性。

10. 发明申请

US20120250275A1 ELECTRONIC DEVICE, ELECTRONIC COMPONENT, AND METHOD OF MANUFACTURING CIRCUIT BOARD ASSEMBLY 审中-公开
标题翻译：电子设备，电子元件和制造电路板组件的方法
公开(公告)号：US20120250275A1
公开(公告)日：2012-10-04
申请号：US13300379
申请日：2011-11-18
申请人： Nobuhiro Yamamoto , Takahisa Funayama
发明人： Nobuhiro Yamamoto , Takahisa Funayama
IPC分类号： H05K5/00 , H05K3/00
CPC分类号： H05K5/062 , H01L21/563 , H01L23/13 , H01L23/32 , H01L24/16 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L2224/131 , H01L2224/16225 , H01L2224/26175 , H01L2224/2919 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/81007 , H01L2224/81138 , H01L2224/8114 , H01L2224/81191 , H01L2224/8121 , H01L2224/83191 , H01L2224/8321 , H01L2224/9211 , H01L2924/01029 , H05K1/183 , H05K3/3436 , H05K3/3489 , H05K2201/10977 , Y02P70/613 , Y10T29/49124 , H01L2924/00 , H01L2924/00014 , H01L2224/81 , H01L2224/83 , H01L2924/014
摘要： According to one embodiment, an electronic device includes a housing, a circuit board, an electronic component, a joint, a sealant, and a positioning member. The circuit board is provided in the housing, and includes a first surface and a first conductor on the first surface. The electronic component is located on the first surface of the circuit board, and includes a second surface facing the first surface and a second conductor on the second surface. The joint is located between the first surface and the second surface to electrically connect between the first conductor and the second conductor. The sealant is located at least between the first surface and the second surface. The sealant contains a reductant that reduces an oxide film and seals the joint. The positioning member positions the circuit board and the electronic component.
摘要翻译：根据一个实施例，电子设备包括壳体，电路板，电子部件，接头，密封剂和定位构件。电路板设置在壳体中，并且包括在第一表面上的第一表面和第一导体。电子部件位于电路板的第一表面上，并且包括面对第一表面的第二表面和在第二表面上的第二导体。接头位于第一表面和第二表面之间以电连接第一导体和第二导体之间。密封剂至少位于第一表面和第二表面之间。密封剂含有减少氧化膜并密封接头的还原剂。定位构件定位电路板和电子部件。

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