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1. 发明申请

US20090080846A1 Optical Waveguide and Method for Manufacturing the Same 审中-公开
标题翻译：光波导及其制造方法
公开(公告)号：US20090080846A1
公开(公告)日：2009-03-26
申请号：US12019693
申请日：2008-01-25
申请人： Mingda Shao , Guoqing Yu , Qinqin Xu , Wenlong Wang , Wei Wang
发明人： Mingda Shao , Guoqing Yu , Qinqin Xu , Wenlong Wang , Wei Wang
IPC分类号： G02B6/036 , G02B6/02
CPC分类号： G02B6/136 , G02B6/1221 , G02B6/4214 , G02B6/43
摘要： The present invention provides a wafer level optical waveguide and a method for manufacturing the same, wherein it can be realized by employing manufacture process for semiconductor integrated circuits to manufacture a micron optical waveguide with a smooth interface, uniform thickness and a mirror-like end with any angle, and to remarkably reduce its manufacture cost at the meantime.
摘要翻译：本发明提供一种晶片级光波导及其制造方法，其可以通过采用半导体集成电路的制造工艺来制造具有平滑界面，均匀厚度和镜面端的微米光波导，任何角度，并同时显着降低其制造成本。

2. 发明授权

US07795074B2 WLCSP target and method for forming the same 有权
标题翻译： WLCSP目标和形成方法
公开(公告)号：US07795074B2
公开(公告)日：2010-09-14
申请号：US12352858
申请日：2009-01-13
申请人： Mingda Shao , Guoqing Yu , Wei Wang , Hanyu Li , Xiaohua Huang
发明人： Mingda Shao , Guoqing Yu , Wei Wang , Hanyu Li , Xiaohua Huang
IPC分类号： H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L23/3114 , H01L21/561 , H01L21/568 , H01L24/94 , H01L2924/01033 , H01L2924/01082 , H01L2924/14 , H01L2924/1461 , H01L2924/00
摘要： The invention provides a Wafer Level Chip Size Packaging (WLCSP) target and a method for forming it. A WLCSP target is formed by recombining single chips, wafer parts each including two or more chips or half finished packaging targets which have been subjected to at least one previous step of packaging onto a first substrate, or bonding a wafer part which is formed by dicing a whole wafer and includes at least two chips to a second substrate for bonding. Thus, a wafer with a larger size can be packaged through the WLCSP on a WLCSP apparatus with a smaller size while benefiting from the advantages of the WLCSP, the WLCSP apparatus remains applicable within a longer period of time, the cost is lowered, and enterprises may keep up with the development of the market and the increase of the wafer size without having to update the WLCSP apparatus substantially.
摘要翻译：本发明提供一种晶片级芯片尺寸封装（WLCSP）靶及其形成方法。通过将单个芯片，每个包括两个或更多个芯片的半成品包装靶或已经经受至少一个前述包装步骤的半成品封装目标的晶片部分重新组合到第一基板上，或者通过切割形成的晶片部分整个晶片，并且包括至少两个芯片到第二基板用于结合。因此，具有较大尺寸的晶片可以通过WLCSP封装在具有较小尺寸的WLCSP装置上，同时受益于WLCSP的优点，WLCSP装置在较长时间内保持适用，成本降低，企业可以跟上市场的发展和晶片尺寸的增加，而不必基本上更新WLCSP设备。

3. 发明申请

US20100171134A1 OPTICAL CONVERTER AND MANUFACTURING METHOD THEREOF AND LIGHT EMITTING DIODE 审中-公开
标题翻译：光转换器及其制造方法及其发光二极管
公开(公告)号：US20100171134A1
公开(公告)日：2010-07-08
申请号：US12482230
申请日：2009-06-10
申请人： Mingda Shao , Junjie Li , Hanyu Li , Qiuhong Zou , Zhiqi Wang , Guoqing Yu , Youjun Wang , Wei Wang
发明人： Mingda Shao , Junjie Li , Hanyu Li , Qiuhong Zou , Zhiqi Wang , Guoqing Yu , Youjun Wang , Wei Wang
IPC分类号： G02F1/35 , H01L33/00 , B32B17/00 , C03C27/10
CPC分类号： H01L33/507 , H01L2933/0041
摘要： The present invention relates to an optical converter and a manufacturing method thereof and a light emitting diode. An optical converter for a light emitting diode includes two substrates, in which, a annular first cavity wall is arranged between the two substrates, and an airtight space filled with an optical conversion substance is surrounded by the first cavity wall and the two substrates. The invention implements the encapsulation and manufacturing of the optical conversion substance for the LED. The structure and the manufacturing method according to the invention can be utilized to encapsulate an active optical conversion substance in the optical converter while avoiding the active optical conversion substance reacting to other active substance, e.g., oxygen, during manufacturing. Furthermore, the optical conversion substance is encapsulated with wafer level chip size packaging to thereby improve the efficiency of manufacturing the optical converter and reduce the cost.
摘要翻译：本发明涉及一种光转换器及其制造方法和发光二极管。用于发光二极管的光转换器包括两个基板，其中在两个基板之间布置环形第一空腔壁，并且填充有光学转换物质的气密空间被第一空腔壁和两个基板包围。本发明实现了用于LED的光转换物质的封装和制造。根据本发明的结构和制造方法可以用于在光学转换器中封装有源光学转换物质，同时避免在制造期间与其它活性物质例如氧反应的活性光学转换物质。此外，光学转换物质用晶片级芯片尺寸封装封装，从而提高了光转换器制造的效率并降低了成本。

4. 发明申请

US20100044857A1 WLCSP TARGET AND METHOD FOR FORMING THE SAME 有权
标题翻译： WLCSP目标及其形成方法
公开(公告)号：US20100044857A1
公开(公告)日：2010-02-25
申请号：US12352858
申请日：2009-01-13
申请人： Mingda Shao , Guoqing Yu , Wei Wang , Hanyu Li , Xiaohua Huang
发明人： Mingda Shao , Guoqing Yu , Wei Wang , Hanyu Li , Xiaohua Huang
IPC分类号： H01L21/78 , H01L23/00
CPC分类号： H01L23/3114 , H01L21/561 , H01L21/568 , H01L24/94 , H01L2924/01033 , H01L2924/01082 , H01L2924/14 , H01L2924/1461 , H01L2924/00
摘要： The invention provides a Wafer Level Chip Size Packaging (WLCSP) target and a method for forming it. A WLCSP target is formed by recombining single chips, wafer parts each including two or more chips or half finished packaging targets which have been subjected to at least one previous step of packaging onto a first substrate, or bonding a wafer part which is formed by dicing a whole wafer and includes at least two chips to a second substrate for bonding. Thus, a wafer with a larger size can be packaged through the WLCSP on a WLCSP apparatus with a smaller size while benefiting from the advantages of the WLCSP, the WLCSP apparatus remains applicable within a longer period of time, the cost is lowered, and enterprises may keep up with the development of the market and the increase of the wafer size without having to update the WLCSP apparatus substantially.
摘要翻译：本发明提供一种晶片级芯片尺寸封装（WLCSP）靶及其形成方法。通过将单个芯片，每个包括两个或更多个芯片的半成品包装靶或已经经受至少一个前面的包装步骤的半成品包装靶，将单个芯片，晶片部分重新组合形成WLCSP靶，或者通过切割形成的晶片部分整个晶片，并且包括至少两个芯片到第二基板用于结合。因此，具有较大尺寸的晶片可以通过WLCSP封装在具有较小尺寸的WLCSP装置上，同时受益于WLCSP的优点，WLCSP装置在较长时间内保持适用，成本降低，企业可以跟上市场的发展和晶片尺寸的增加，而不必基本上更新WLCSP设备。

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