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1. 发明授权

US07469788B2 Airtight semiconductor transferring container 有权
标题翻译：密封半导体转移容器
公开(公告)号：US07469788B2
公开(公告)日：2008-12-30
申请号：US11161754
申请日：2005-08-16
申请人： Ming-Lung Chiu , Yu-Chian Yan
发明人： Ming-Lung Chiu , Yu-Chian Yan
IPC分类号： B65D85/86
CPC分类号： H01L21/67376 , G03F1/66 , H01L21/67393 , H01L21/67396
摘要： An airtight semiconductor transferring container is disclosed to included a container base, an elastically deformable packing member covered on the top surface of the container base, and a top cover closed on the container base, the top cover having an outer cover body, and an elastically deformable inner lining shell fitted into the outer cover body, the elastically deformable inner lining shell having a downwardly protruding peripheral flange, which is pressed on the border area of the elastically deformable packing member to keep the inside space of the airtight semiconductor transferring container in an airtight status after closing of the top cover on the container base.
摘要翻译：公开了一种气密半导体转移容器，其包括容器基座，覆盖在容器基座的顶表面上的可弹性变形的填充构件和封闭在容器基座上的顶盖，顶盖具有外盖主体和弹性可弹性变形的内衬壳体具有向下突出的周边凸缘，该凸缘被压在可弹性变形的衬垫构件的边界区域上，以将气密半导体转移容器的内部空间保持在关闭集装箱基座顶盖后的气密状态。

2. 发明申请

US20060127205A1 [AIRTIGHT SEMICONDUCTOR TRANSFERRING CONTAINER] 有权
标题翻译： [空气半导体转移容器]
公开(公告)号：US20060127205A1
公开(公告)日：2006-06-15
申请号：US11161754
申请日：2005-08-16
申请人： Ming-Lung Chiu , Yu-Chian Yan
发明人： Ming-Lung Chiu , Yu-Chian Yan
IPC分类号： B65B69/00 , B65B21/02 , B65G65/04 , B65G65/34
CPC分类号： H01L21/67376 , G03F1/66 , H01L21/67393 , H01L21/67396
摘要： An airtight semiconductor transferring container is disclosed to included a container base, an elastically deformable packing member covered on the top surface of the container base, and a top cover closed on the container base, the top cover having an outer cover body, and an elastically deformable inner lining shell fitted into the outer cover body, the elastically deformable inner lining shell having a downwardly protruding peripheral flange, which is pressed on the border area of the elastically deformable packing member to keep the inside space of the airtight semiconductor transferring container in an airtight status after closing of the top cover on the container base.
摘要翻译：公开了一种气密半导体转移容器，其包括容器基座，覆盖在容器基座的顶表面上的可弹性变形的填充构件和封闭在容器基座上的顶盖，顶盖具有外盖主体和弹性可弹性变形的内衬壳体具有向下突出的周边凸缘，该凸缘被压在可弹性变形的衬垫构件的边界区域上，以将气密半导体转移容器的内部空间保持在关闭集装箱基座顶盖后的气密状态。

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