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1. 发明授权

US10199350B2 Apparatus for heating a substrate during die bonding 有权
公开(公告)号：US10199350B2
公开(公告)日：2019-02-05
申请号：US13480622
申请日：2012-05-25
申请人： Ming Yeung Luke Wan , Chi Wai Cheung , Chin Tung So
发明人： Ming Yeung Luke Wan , Chi Wai Cheung , Chin Tung So
IPC分类号： F27D3/00 , F27D15/02 , H01L23/00
摘要： An apparatus for heating a substrate during die bonding is disclosed. The apparatus comprises: a substrate carrier configured to hold the substrate; a heating device configured to heat the substrate; a first actuator for effecting relative motion between the substrate carrier and the heating device such that the substrate is relatively indexed with respect to the heating device; a second actuator for effecting relative motion between the substrate carrier and the heating device such that the heating device contacts the substrate to heat different portions of the substrate. In particular, the second actuator is operative to separate the heating device from the substrate in order for the first actuator to relatively index the substrate across the heating device. A method of heating a substrate during die bonding is also disclosed.

2. 发明授权

US07727800B2 High precision die bonding apparatus 有权
标题翻译：高精度贴片装置
公开(公告)号：US07727800B2
公开(公告)日：2010-06-01
申请号：US11301121
申请日：2005-12-12
申请人： Ming Yeung Luke Wan , Wing Fai Lam
发明人： Ming Yeung Luke Wan , Wing Fai Lam
IPC分类号： H01L21/00
CPC分类号： H01L21/67144 , H01L21/681 , Y10T29/53091
摘要： A die bonding apparatus and a bonding method are provided wherein the apparatus comprises a bond head movable between a supply of semiconductor dice and a die bonding site, a pick-up tool attached to the bond head for holding a die to be bonded at the die bonding site and an optical assembly positioned for viewing an orientation of the die bonding site. The bond head is configured such that an orientation of the die being held by the pick-up tool between the optical assembly and the die bonding site is viewable by the optical assembly, whereby the orientation of the die may be aligned with the orientation of the die bonding site.
摘要翻译：提供了一种管芯接合装置和接合方法，其中该设备包括可在半导体晶片的供给和芯片接合位置之间移动的接合头，附接到接合头的拾取工具，用于保持待接合的管芯的模具粘合部位和用于观察芯片焊接部位的取向的光学组件。结合头被构造成使得由拾取工具保持的模具在光学组件和芯片粘合位置之间的取向可由光学组件观察，由此模具的取向可以与模具的取向对齐芯片焊接部位。

3. 发明授权

US06616031B2 Apparatus and method for bond force control 有权
公开(公告)号：US06616031B2
公开(公告)日：2003-09-09
申请号：US09905906
申请日：2001-07-17
申请人： Sun Kuen Wong , Ming Yeung Luke Wan
发明人： Sun Kuen Wong , Ming Yeung Luke Wan
IPC分类号： B23K3102
CPC分类号： H01L21/67092 , B23K20/02 , B23K2101/40
摘要： An apparatus and method are disclosed for providing bond force in a die bonding operation. The apparatus comprises means such as a compression spring for generating a primary bond force, and additionally means such as a voice coil for generating a compensatory bond force. The compensatory bond force can be controlled by varying the current to the voice coil so as to add to or reduce the bond force whereby a bond force comprising the sum of the primary bond force and the compensatory bond force may be controlled.

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