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    • 1. 发明授权
    • Cylinder locking apparatus
    • 气缸锁定装置
    • US4635536A
    • 1987-01-13
    • US734742
    • 1985-05-14
    • Ming LiuJohn F. BowbinRaymond L. GhislainStephen K. McDaniel
    • Ming LiuJohn F. BowbinRaymond L. GhislainStephen K. McDaniel
    • F15B15/26
    • F15B15/261
    • Locking apparatus for a piston and cylinder device includes a locking plunger connected to the piston and disposed between the piston and an end cap of the piston and cylinder device. The locking plunger includes a sleeve which carries a plurality of radially movable ball bearings. As the piston is moved toward an extreme position of the device, the ball bearings contact a spring loaded locking plug disposed in the head of the device, thereby moving the plug away from a first position. The piston and locking plunger continue to move the locking plug away from the first position until the balls are aligned with a circumferential groove or channel in the head. At this point the locking plug is moved to the first position under spring force, in turn moving the ball bearings radially outward into engagement with the channel or groove. The piston and piston rod of the device are thereby locked in position in the absence of fluid pressure. The locking plug includes surfaces against which pressurized fluid acts at the beginning of a return stroke to move the plug away from the first position and release the ball bearings from the channel. The piston is thereby unlocked and is free to move toward the other extreme position of the device.
    • 活塞和气缸装置的锁定装置包括连接到活塞并设置在活塞和活塞和气缸装置的端盖之间的锁定柱塞。 锁定柱塞包括承载多个可径向移动的滚珠轴承的套筒。 当活塞向装置的极限位置移动时,球轴承接触设置在装置的头部中的弹簧加载的锁定插头,从而将插头从第一位置移开。 活塞和锁定柱塞继续将锁定塞移动离开第一位置,直到球与头部中的周向凹槽或通道对准。 此时,锁定塞在弹簧力下移动到第一位置,从而径向向外移动球轴承以与通道或凹槽接合。 因此,在没有流体压力的情况下,装置的活塞和活塞杆被锁定就位。 锁定塞包括在返回行程开始时加压流体作用于其上的表面,以使塞子远离第一位置移动并从通道释放球轴承。 因此,活塞被解锁并且能够朝向装置的另一极限位置移动。
    • 8. 发明授权
    • Liquid crystal substrate cutting device and cutting method for liquid crystal substrate
    • 液晶基板切割装置及液晶基板切割方法
    • US08893598B2
    • 2014-11-25
    • US13575929
    • 2012-06-28
    • Zhen LiuMing LiuTao DingHyojung Park
    • Zhen LiuMing LiuTao DingHyojung Park
    • B26D7/10
    • C03B33/074C03B33/10G02F1/1303G02F1/133351Y02P40/57Y10T83/0414Y10T83/283Y10T83/541
    • The present invention provides a liquid crystal substrate cutting device used for cutting a liquid crystal substrate along a cutting line, and the liquid crystal substrate cutting device comprises a heating unit and a cutter unit. The heating unit moves along the cutting line and heats the liquid crystal substrate to soften a sealant covered on the cutting line, and the cutter unit moves along the cutting line to further cut the liquid crystal substrate. The present invention comprises the heating unit for heating the liquid crystal substrate along the cutting line to soften the sealant covered on the cutting line such that the cutter unit can precisely cut the liquid crystal substrate without abnormity of the feeding distance of the cutter unit which cause the liquid crystal substrate to break. Therefore, the scrap-rate is reduced.
    • 本发明提供一种用于沿着切割线切割液晶基板的液晶基板切割装置,并且液晶基板切割装置包括加热单元和切割单元。 加热单元沿着切割线移动并加热液晶基板以软化在切割线上覆盖的密封剂,并且切割器单元沿着切割线移动以进一步切割液晶基板。 本发明包括用于沿着切割线加热液晶基板的加热单元,以软化切割线上所覆盖的密封剂,使得切割单元能够精确地切割液晶基板,而不会导致切割单元的进给距离的异常 液晶基板破裂。 因此,废品率降低。