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1. 发明授权

US08643833B1 System for inspecting surface defects of a specimen and a method thereof 有权
标题翻译：用于检查试样的表面缺陷的系统及其方法
公开(公告)号：US08643833B1
公开(公告)日：2014-02-04
申请号：US13600726
申请日：2012-08-31
申请人： Min-Wei Hung , Hsin-Yi Tsai , Kuo-Cheng Huang , Chun-Yao Huang
发明人： Min-Wei Hung , Hsin-Yi Tsai , Kuo-Cheng Huang , Chun-Yao Huang
IPC分类号： G01N21/00
CPC分类号： G01N21/9501
摘要： An inspection system and method for inspecting the surface defects of the specimen is provided. The inspection system includes a laser focus module, a microscope objective module, an image pick-up module, and a process module. The laser focus module configured to emit laser beam on the specimen by a predetermined angle relative to a surface of the specimen, and to generate scattered light and reflected light when the laser beam irradiates on the surface defects of the specimen. The process module can calculate the real size of the defects by using the intensity information obtained from the image pick-up module and the microscope objective module or using the diameter information obtained from the reflected light image while the reflected light projects on a screen.
摘要翻译：提供了一种用于检查样品表面缺陷的检查系统和方法。检查系统包括激光聚焦模块，显微镜物镜模块，图像拾取模块和处理模块。所述激光聚焦模块被配置为相对于所述检体的表面在所述试样上发射预定角度的激光束，并且当所述激光束照射在所述试样的表面缺陷上时产生散射光和反射光。处理模块可以通过使用从图像拾取模块和显微镜物镜模块获得的强度信息或使用从反射光图像获得的直径信息来计算缺陷的实际大小，同时反射光投射在屏幕上。

2. 发明授权

US08643836B1 Inspection method for inspecting defects of wafer surface 有权
标题翻译：检查晶圆表面缺陷的检查方法
公开(公告)号：US08643836B1
公开(公告)日：2014-02-04
申请号：US13599479
申请日：2012-08-30
申请人： Hsin-Yi Tsai , Kuo-Cheng Huang , Ya-Cheng Liu , Min-Wei Hung
发明人： Hsin-Yi Tsai , Kuo-Cheng Huang , Ya-Cheng Liu , Min-Wei Hung
IPC分类号： G01N21/00
CPC分类号： G01N21/47 , G01N21/9501
摘要： The present invention provides an inspection method for inspecting defects of wafer surface. The method includes: encircling peripheral region of the wafer surface by a first light source set and a second light source set; using a control module to control the first light source set and the second light source set to irradiate the light alternately from different directions; using an image pick-up module to receive a scattered light image during each time when the first light source set or the second light source set irradiates the light on the wafer surface; and then using a process module to obtain an enhanced and clear defect image of wafer surface by processing each of the scattered light images.
摘要翻译：本发明提供了一种用于检查晶片表面缺陷的检查方法。该方法包括：通过第一光源组和第二光源组环绕晶片表面的周边区域; 使用控制模块来控制第一光源组和第二光源组，以从不同方向交替地照射光; 使用图像拾取模块在第一光源组或第二光源组照射晶片表面上的光的每个时间期间接收散射光图像; 然后使用处理模块通过处理每个散射光图像来获得晶片表面的增强和清晰的缺陷图像。

3. 发明申请

US20090120251A1 Machining method and apparatus for brittle material 审中-公开
标题翻译：脆性材料的加工方法和装置
公开(公告)号：US20090120251A1
公开(公告)日：2009-05-14
申请号：US12151187
申请日：2008-05-02
申请人： Min-Wei Hung , Wen-Hong Wu , Kuo-Cheng Huang , Chi Hung Huang
发明人： Min-Wei Hung , Wen-Hong Wu , Kuo-Cheng Huang , Chi Hung Huang
IPC分类号： B26D7/00 , B26D1/00
CPC分类号： B28D1/221 , C03B33/04 , C03B33/09 , Y10T83/04 , Y10T83/263
摘要： A machining method for a brittle material is provided. The machining method includes steps of heating the brittle material; providing a concentrated cold source; and spurting the concentrated cold source on a surface of the brittle material along a predetermined cutting path.
摘要翻译：提供了脆性材料的加工方法。该加工方法包括加热脆性材料的步骤; 提供浓缩冷源; 并且沿着预定的切割路径将浓缩的冷源喷射到脆性材料的表面上。

4. 发明申请

US20110235326A1 APPARATUS AND METHODS FOR CONTROLLING A THREE-DIMENSIONAL OPTICAL FIELD 有权
标题翻译：用于控制三维光学领域的装置和方法
公开(公告)号：US20110235326A1
公开(公告)日：2011-09-29
申请号：US13071561
申请日：2011-03-25
申请人： Jerliang Yeh , Ling-Yu Tsai , Min-Wei Hung , Chi-Hung Huang , Yu-Cheng Su
发明人： Jerliang Yeh , Ling-Yu Tsai , Min-Wei Hung , Chi-Hung Huang , Yu-Cheng Su
IPC分类号： F21V5/04
CPC分类号： F21V14/06 , G02B3/12 , G02B3/14 , G02B7/00 , G02B7/102 , G02B15/00 , G02B26/005 , G03B21/00 , G03B21/208
摘要： The present invention provides an apparatus for controlling a three-dimensional optical field. The apparatus includes a light-emission device and a set of zoom elements. The light-emission device emits a light. The set of zoom elements are disposed in front of the light-emission device, and focus the light from the light-emission device.
摘要翻译：本发明提供了一种用于控制三维光场的装置。该装置包括发光装置和一组变焦元件。发光装置发光。该组变焦元件设置在发光装置的前方，并且聚焦来自发光装置的光。

5. 发明授权

US08956009B2 Apparatus and methods for controlling a three-dimensional optical field 有权
标题翻译：用于控制三维光学场的装置和方法
公开(公告)号：US08956009B2
公开(公告)日：2015-02-17
申请号：US13071561
申请日：2011-03-25
申请人： Jerliang Yeh , Ling-Yu Tsai , Min-Wei Hung , Chi-Hung Huang , Yu-Cheng Su
发明人： Jerliang Yeh , Ling-Yu Tsai , Min-Wei Hung , Chi-Hung Huang , Yu-Cheng Su
IPC分类号： F21V5/04 , F21V14/00 , F21V14/06 , G02B3/12 , G02B3/14 , G02B7/00 , G02B7/10 , G02B15/00 , G02B26/00 , G03B21/00 , G03B21/20
CPC分类号： F21V14/06 , G02B3/12 , G02B3/14 , G02B7/00 , G02B7/102 , G02B15/00 , G02B26/005 , G03B21/00 , G03B21/208
摘要： The present invention provides an apparatus for controlling a three-dimensional optical field. The apparatus includes a light-emission device and a set of zoom elements. The light-emission device emits a light. The set of zoom elements are disposed in front of the light-emission device, and focus the light from the light-emission device.
摘要翻译：本发明提供了一种用于控制三维光场的装置。该装置包括发光装置和一组变焦元件。发光装置发光。该组变焦元件设置在发光装置的前方，并且聚焦来自发光装置的光。

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