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1. 发明申请

US20100224983A1 SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF 审中-公开
标题翻译：半导体封装结构及其制造方法
公开(公告)号：US20100224983A1
公开(公告)日：2010-09-09
申请号：US12625848
申请日：2009-11-25
申请人： Min-Lung Huang , Chih-Yuan Cheng
发明人： Min-Lung Huang , Chih-Yuan Cheng
IPC分类号： H01L23/36 , H01L23/48 , H01L21/78
CPC分类号： H01L24/96 , H01L21/568 , H01L21/6835 , H01L23/3128 , H01L23/4334 , H01L24/97 , H01L2221/68331 , H01L2224/12105 , H01L2224/97 , H01L2924/01033 , H01L2924/15311 , H01L2924/181 , H01L2924/00
摘要： A manufacturing method of a semiconductor package structure includes the following steps. Firstly, a carrier having an adhesion tape is provided. Next, a plurality of chips are disposed on the adhesion tape. Then, a molding compound is dispensed on the adhesion tape, so that the molding compound covers the chips. Afterwards, a heat spreader is disposed on a plurality of chips. Then, the molding compound is solidified as an encapsulant to fix the heat spreader on the chips. After that, the carrier and the adhesion tape are removed to expose the active surfaces of the chips. Then, a redistribution layer is formed adjacent to the active surfaces of the chips. Next, a plurality of solder balls are disposed on the redistribution layer. Lastly, a plurality of packages are formed by cutting the redistribution layer, the encapsulant and the heat spreader according to the positions of the chip.
摘要翻译：半导体封装结构的制造方法包括以下步骤。首先，提供具有粘合带的载体。接下来，在粘合带上设置多个芯片。然后，在粘合带上分配模塑料，使得模塑料覆盖芯片。之后，将散热器设置在多个芯片上。然后，将模塑料作为密封剂固化，将散热器固定在芯片上。之后，移除载体和粘合带以暴露芯片的活性表面。然后，在芯片的有源表面附近形成再分布层。接下来，在再分配层上设置多个焊球。最后，通过根据芯片的位置切割再分配层，密封剂和散热器来形成多个封装。

2. 发明申请

US20050288064A1 CONTROL SYSTEM OF FUNCTION KEYS AND CONTROLLING METHOD THEREOF 审中-公开
标题翻译：功能控制系统及其控制方法
公开(公告)号：US20050288064A1
公开(公告)日：2005-12-29
申请号：US10904025
申请日：2004-10-19
申请人： Cheng-Shuo Lin , Chih-Yuan Cheng
发明人： Cheng-Shuo Lin , Chih-Yuan Cheng
IPC分类号： G06F3/023 , G06F3/048 , G06F9/44 , H04B1/38
CPC分类号： G06F3/0238 , G06F3/0489 , G06F9/451
摘要： A function key control system integrating a function reminder menu, an assistant description menu and a function set-up menu and a controlling method thereof are provided. The controlling method comprises steps of using an embedded controller in an electronic equipment to detect that a first key is activated. The embedded controller transmits a trigger signal to fire up an application program. The application program opens and displays a function reminder menu. The embedded controller detects that a second key is activated and diagnoses a type of the second key. According to the type of the second key, either a function corresponding to the second key is performed or an assistant description menu and a function set-up menu are opened or the application program is terminated.
摘要翻译：提供集成功能提醒菜单，辅助描述菜单和功能设置菜单的功能键控制系统及其控制方法。控制方法包括在电子设备中使用嵌入式控制器来检测第一密钥被激活的步骤。嵌入式控制器发送触发信号以启动应用程序。应用程序打开并显示功能提醒菜单。嵌入式控制器检测到第二个键被激活并诊断第二个键的类型。根据第二密钥的类型，执行对应于第二密钥的功能，或者打开辅助描述菜单和功能设置菜单或者终止应用程序。

3. 外观设计

USD510324S1 Thermal module 失效
标题翻译：散热模块
公开(公告)号：USD510324S1
公开(公告)日：2005-10-04
申请号：US29196439
申请日：2003-12-31
申请人： Chi-Chang Lin , Chih-Yuan Cheng , Heng-Tsung Wang
设计人： Chi-Chang Lin , Chih-Yuan Cheng , Heng-Tsung Wang

4. 发明授权

US08004079B2 Chip package structure and manufacturing method thereof 有权
标题翻译：芯片封装结构及其制造方法
公开(公告)号：US08004079B2
公开(公告)日：2011-08-23
申请号：US12464873
申请日：2009-05-13
申请人： Ra-Min Tain , Yu-Lin Chao , Shu-Jung Yang , Rong-Chang Fang , Wei Li , Chih-Yuan Cheng , Ming-Che Hsieh
发明人： Ra-Min Tain , Yu-Lin Chao , Shu-Jung Yang , Rong-Chang Fang , Wei Li , Chih-Yuan Cheng , Ming-Che Hsieh
IPC分类号： H01L23/10 , H01L23/34
CPC分类号： H01L25/105 , H01L23/3128 , H01L25/0657 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2225/0652 , H01L2225/06541 , H01L2225/06589 , H01L2225/1023 , H01L2225/1058 , H01L2225/1094 , H01L2924/10253 , H01L2924/15311 , H01L2924/00014 , H01L2924/00
摘要： A chip package structure includes a substrate, a chip, a thermal conductive layer, a plurality of signal contacts, and a molding compound. The substrate includes a plurality of first thermal conductive vias, a connecting circuit, and a plurality of signal vias electrically connected to the connecting circuit, and the substrate has a chip disposing region. The chip is disposed on the chip disposing region of the substrate and electrically connected to the signal vias through the connecting circuit. The thermal conductive layer is disposed over the substrate, connected to the first thermal conductive vias, and located above the chip disposing region. Besides, the thermal conductive layer has first openings exposing the signal vias. The signal contacts are respectively disposed in the first openings and connected to the signal vias. The molding compound encapsulates the chip.
摘要翻译：芯片封装结构包括衬底，芯片，导热层，多个信号触点和模塑料。衬底包括多个第一导热通孔，连接电路和电连接到连接电路的多个信号通孔，并且衬底具有芯片布置区域。芯片设置在基板的芯片布置区域上，并通过连接电路与信号通孔电连接。导热层设置在衬底上，连接到第一导热通孔，并且位于芯片布置区域的上方。此外，导热层具有暴露信号通孔的第一开口。信号触点分别设置在第一开口中并连接到信号通路。模塑料封装芯片。

5. 发明申请

US20090156001A1 Structure for reducing stress for vias and fabricating method thereof 失效
公开(公告)号：US20090156001A1
公开(公告)日：2009-06-18
申请号：US12379223
申请日：2009-02-17
申请人： Yung-Yu Hsu , Rong-Chang Feng , Ra-Min Tain , Shyi-Ching Liau , Ji-cheng Lin , Shan-Pu Yu , Shou-Lung Chen , Chih-Yuan Cheng
发明人： Yung-Yu Hsu , Rong-Chang Feng , Ra-Min Tain , Shyi-Ching Liau , Ji-cheng Lin , Shan-Pu Yu , Shou-Lung Chen , Chih-Yuan Cheng
IPC分类号： H01L21/768
CPC分类号： H05K1/115 , H01L21/486 , H01L23/49827 , H01L23/562 , H01L24/19 , H01L2224/04105 , H01L2224/12105 , H01L2224/20 , H01L2224/211 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/12044 , H01L2924/15311 , H01L2924/3025 , H01L2924/351 , H05K1/0271 , H05K3/4644 , H05K2201/068 , H05K2201/09509 , H05K2201/09563 , H05K2201/09781 , H05K2201/09909 , H01L2924/00
摘要： A structure for reducing stress for vias and a fabricating method thereof are provided. One or more wires or vias in the thickness direction are enframed with the use of a stress block in a lattice structure to be isolated from being directly contacted with the major portion of insulating materials with a high coefficient of thermal expansion. Thus, the shear stress resulting from temperature loading can be blocked or absorbed by the stress block.

6. 发明申请

US20060102320A1 Heat sink 审中-公开
标题翻译：散热器
公开(公告)号：US20060102320A1
公开(公告)日：2006-05-18
申请号：US11243057
申请日：2005-10-04
申请人： Chi-Chang Lin , Chih-Yuan Cheng , Heng-Tsung Wang
发明人： Chi-Chang Lin , Chih-Yuan Cheng , Heng-Tsung Wang
IPC分类号： H05K7/20
CPC分类号： F28F3/04 , F28D2021/0029 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat sink is disclosed. A plurality of fins is radially and uniformly connected to a central base. Each fin comprises a plurality of protrusions. The protrusions are uniformly formed on each fin around the circumference of the central base.
摘要翻译：公开了散热器。多个翅片径向均匀地连接到中心基座。每个翅片包括多个突起。突起部均匀地形成在中央基座的圆周周围的每个翅片上。

7. 发明授权

US08222728B2 Active solid heatsink device and fabricating method thereof 有权
标题翻译：主动固体散热装置及其制造方法
公开(公告)号：US08222728B2
公开(公告)日：2012-07-17
申请号：US12336320
申请日：2008-12-16
申请人： Chih-Kuang Yu , Chun-Kai Liu , Ming-Ji Dai , Chih-Yuan Cheng
发明人： Chih-Kuang Yu , Chun-Kai Liu , Ming-Ji Dai , Chih-Yuan Cheng
IPC分类号： H01L23/10 , H01L23/34
CPC分类号： H01L27/16 , H01L23/38 , H01L2924/0002 , H01S3/04 , H01S5/024 , H01S5/02476 , H01L2924/00
摘要： An active solid heatsink device and fabricating method thereof is related to a high-effective solid cooling device, where heat generated by a heat source with a small area and a high heat-generating density diffuses to a whole substrate using a heat conduction characteristic of hot electrons of a thermionic (TI) structure, and the thermionic (TI) structure and a thermo-electric (TE) structure share the substrate where the heat diffuses to. Further, the shared substrate serves as a cold end of the TE structure, and the heat diffusing to the shared substrate is pumped to another substrate of the TE structure serving as a hot end of the TE structure.
摘要翻译：一种活性固体散热装置及其制造方法涉及一种高效固体冷却装置，其中由具有小面积和高发热密度的热源产生的热量使用热的热传导特性扩散到整个基板热电子（TI）结构的电子和热电子（TI）结构和热电（TE）结构共享热扩散到的衬底。此外，共用衬底用作TE结构的冷端，并且向共享衬底的扩散的热量被泵送到TE结构的热端的另一个TE结构的衬底。

8. 发明授权

US07791949B2 Refresh method for a non-volatile memory 有权
标题翻译：非易失性存储器的刷新方法
公开(公告)号：US07791949B2
公开(公告)日：2010-09-07
申请号：US12329626
申请日：2008-12-07
申请人： Ching-Fang Yen , Che-Heng Lai , Chih-Yuan Cheng
发明人： Ching-Fang Yen , Che-Heng Lai , Chih-Yuan Cheng
IPC分类号： G11C16/00
CPC分类号： G11C16/10 , G11C16/3431
摘要： A refresh method for a non-volatile memory for preventing disturb phenomenon includes reading data of a memory unit of the non-volatile memory at a first time point within a predefined period and storing the data in a buffer, determining whether data of the memory unit and data of the buffer are identical at a second time point within the predefined period, so as to generate a determination result, and refreshing the memory unit according to the determination result.
摘要翻译：用于防止干扰现象的非易失性存储器的刷新方法包括在预定时间段内的第一时间点读取非易失性存储器的存储器单元的数据，并将数据存储在缓冲器中，确定存储器单元的数据并且缓冲器的数据在预定时间段内的第二时间点相同，以便产生确定结果，并根据确定结果刷新存储器单元。

9. 发明授权

US07754599B2 Structure for reducing stress for vias and fabricating method thereof 失效
标题翻译：用于减小通孔应力的结构及其制造方法
公开(公告)号：US07754599B2
公开(公告)日：2010-07-13
申请号：US12379223
申请日：2009-02-17
申请人： Yung-Yu Hsu , Rong-Chang Feng , Ra-Min Tain , Shyi-Ching Liau , Ji-Cheng Lin , Shan-Pu Yu , Shou-Lung Chen , Chih-Yuan Cheng
发明人： Yung-Yu Hsu , Rong-Chang Feng , Ra-Min Tain , Shyi-Ching Liau , Ji-Cheng Lin , Shan-Pu Yu , Shou-Lung Chen , Chih-Yuan Cheng
IPC分类号： H01L21/44
CPC分类号： H05K1/115 , H01L21/486 , H01L23/49827 , H01L23/562 , H01L24/19 , H01L2224/04105 , H01L2224/12105 , H01L2224/20 , H01L2224/211 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/12044 , H01L2924/15311 , H01L2924/3025 , H01L2924/351 , H05K1/0271 , H05K3/4644 , H05K2201/068 , H05K2201/09509 , H05K2201/09563 , H05K2201/09781 , H05K2201/09909 , H01L2924/00
摘要： A structure for reducing stress for vias and a fabricating method thereof are provided. One or more wires or vias in the thickness direction are enframed with the use of a stress block in a lattice structure to be isolated from being directly contacted with the major portion of insulating materials with a high coefficient of thermal expansion. Thus, the shear stress resulting from temperature loading can be blocked or absorbed by the stress block.
摘要翻译：提供一种用于减小通孔应力的结构及其制造方法。使用栅格结构中的应力块与绝缘材料的主要部分直接接触，具有高的热膨胀系数，使厚度方向上的一个或多个导线或通孔被固定。因此，由温度加载引起的剪切应力可以被应力块阻挡或吸收。

10. 发明申请

US20100061153A1 Refresh Method for a Non-volatile Memory 审中-公开
标题翻译：非易失性存储器的刷新方法
公开(公告)号：US20100061153A1
公开(公告)日：2010-03-11
申请号：US12344288
申请日：2008-12-26
申请人： Ching-Fang Yen , Che-Heng Lai , Chih-Yuan Cheng
发明人： Ching-Fang Yen , Che-Heng Lai , Chih-Yuan Cheng
IPC分类号： G11C16/06
CPC分类号： G11C16/3418 , G11C16/3431
摘要： A refresh method for a non-volatile memory for preventing disturb phenomenon includes dividing a plurality of sectors of a block of the non-volatile memory into a plurality of groups, determining a first group of the plurality of groups according to a first value when a first sector of the plurality of sectors is performed an erase operation, and reading and rewriting data of sectors of the first group.
摘要翻译：用于防止干扰现象的非易失性存储器的刷新方法包括：将非易失性存储器的块的多个扇区划分成多个组，当根据第一个值确定多个组中的第一组时，执行多个扇区中的第一扇区的擦除操作，以及读取和重写第一组的扇区的数据。

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