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    • 4. 发明授权
    • Positive working photoresist composition
    • 正工作光致抗蚀剂组成
    • US06395450B1
    • 2002-05-28
    • US09583547
    • 2000-06-01
    • Jae-Geun ParkChang-Ho NohBong-Seok MoonSang-Kyun LeeSeong-Yun Moon
    • Jae-Geun ParkChang-Ho NohBong-Seok MoonSang-Kyun LeeSeong-Yun Moon
    • G03F7004
    • G03F7/0045G03F7/0392Y10S430/122
    • A positive working photoresist composition includes at least one thermally cross-linkable photoacid generator, a binder polymer, and a solvent in which the binder polymer and photoacid generator are dissolved. The photoacid generator is represented by the general formula (I): wherein X is methanesulfonate, trifluoromethanesulfonate, 4-toluenesulfonate, 10-camphorsulfonate, cyclohexane sulfamate, perfluoro-1-butanesulfonate, perfluorooctanesulfonate, F, Cl, Br, SbF6, BF4, PF4, or AsF6, R1 is hydrogen or methyl, and R2 is alkyl of C1-10 or vinyloxyethyl. The binder polymer represented by the general formula (II): wherein R1 and R2 are different from each other and are selected from the group consisting of acid labile groups, hydrogen, methoxy, ethoxy, n-butoxy and t-butoxy, R3 is hydrogen or alkyl of C1-10, R4 is hydrogen or methyl, 0
    • 正性光致抗蚀剂组合物包括至少一种可热交联的光酸产生剂,粘合剂聚合物和其中溶解有粘合剂聚合物和光致酸产生剂的溶剂。 光致酸发生剂由通式(I)表示:其中X为甲磺酸酯,三氟甲磺酸酯,4-甲苯磺酸酯,10-樟脑磺酸酯,环己烷氨基磺酸酯,全氟-1-丁磺酸酯,全氟辛烷磺酸酯,F,Cl,Br,SbF6,BF4,PF4, 或AsF 6,R 1是氢或甲基,R 2是C 1-10的烷基或乙烯氧基乙基。由通式(II)表示的粘合剂聚合物:其中R1和R2彼此不同,并且选自酸不稳定 基团,氢,甲氧基,乙氧基,正丁氧基和叔丁氧基,R 3是氢或C 1-10的烷基,R 4是氢或甲基,0 <0 <= 0,1 <= p <= 0.7,0 < q <= 0.7,0 <= r <= 0.3,其中p,q和r不同时为0。