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    • 8. 发明授权
    • Method for forming word line of semiconductor device
    • 半导体器件字线形成方法
    • US06787426B2
    • 2004-09-07
    • US10603611
    • 2003-06-26
    • Won Chang Lee
    • Won Chang Lee
    • H01L21336
    • H01L29/66545H01L21/76801
    • A method for forming word line of semiconductor device wherein a lower portion of the word line on the channel region is a I-type and a upper portion of the word line is a line-type is disclosed. The method comprises (a) forming a sacrificial insulation film on a semiconductor substrate including an active region; (b) etching the sacrificial insulation film to form an I-type sacrificial insulation film pattern whereon a channel region is to be formed; (c) forming a source/drain region; (d) forming a first interlayer insulation film; (e) planarizing the first interlayer insulation film to expose the sacrificial insulation film pattern; (f) sequentially forming a insulation film and a second interlayer insulation film; (g) etching the second interlayer insulation film and insulation film using a word line mask; (h) removing the sacrificial insulation film pattern; (i) growing a gate oxide film; (j) forming a conductive layer; and (k) planarizing the conductive layer.
    • 一种用于形成半导体器件的字线的方法,其中沟道区上的字线的下部是I型,并且字线的上部是线型。 该方法包括:(a)在包括有源区的半导体衬底上形成牺牲绝缘膜; (b)蚀刻牺牲绝缘膜以形成其中将形成沟道区的I型牺牲绝缘膜图案; (c)形成源/漏区; (d)形成第一层间绝缘膜; (e)平面化所述第一层间绝缘膜以暴露所述牺牲绝缘膜图案; (f)依次形成绝缘膜和第二层间绝缘膜; (g)使用字线掩模蚀刻第二层间绝缘膜和绝缘膜; (h)去除牺牲绝缘膜图案; (i)生长栅氧化膜; (j)形成导电层; 和(k)平坦化导电层。
    • 10. 发明授权
    • SOI device and method of fabricating the same
    • SOI器件及其制造方法
    • US06479865B1
    • 2002-11-12
    • US09595107
    • 2000-06-16
    • Won Chang LeeWoo Han Lee
    • Won Chang LeeWoo Han Lee
    • H01L2701
    • H01L29/66772H01L29/78609
    • Disclosed are an SOI device having no edge leakage current and a method of fabricating the same. The SOI device comprises: an SOI substrate of a stack structure of a base substrate, a buried oxide layer and a semiconductor layer; an oxide layer formed to be in contact with the buried oxide layer at the semiconductor layer portion corresponding to a field region so that an active region is defined; a gate electrode pattern having a gate oxide layer, the gate oxide layer only formed on the active region; a source region and a drain region formed inside the active region of the semiconductor layer of both sides of the gate electrode pattern; and a gate electrode line formed on the gate electrode pattern and on the field region so as to interconnect the gate electrode patterns of the respective active regions arranged in a line.
    • 公开了没有边缘漏电流的SOI器件及其制造方法。 SOI器件包括:基底衬底,掩埋氧化物层和半导体层的堆叠结构的SOI衬底; 形成为与所述半导体层部分处的与所述掩埋氧化物层接触的氧化物层,所述半导体层部分对应于场区域,从而限定有源区域; 具有栅极氧化层的栅极电极图案,仅在活性区域上形成栅极氧化物层; 源极区和漏极区,形成在栅电极图案的两侧的半导体层的有源区内; 以及形成在栅电极图案和场区上的栅极电极线,以使布置成一行的各个有源区的栅电极图案互连。