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1. 发明申请

US20130037310A1 EPOXY RESIN COMPOSITION FOR CIRCUIT BOARD, PREPREG, LAMINATE, RESIN SHEET, LAMINATED BASE MATERIAL FOR PRINTED WIRING BOARD, PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE 审中-公开
标题翻译：电路板环氧树脂组合物，PREPREG，层压板，树脂片，印刷电路板，印刷电路板和半导体器件的层压材料
公开(公告)号：US20130037310A1
公开(公告)日：2013-02-14
申请号：US13642944
申请日：2011-05-02
申请人： Michio Kimura , Nobuki Tanaka , Tadasuke Endo
发明人： Michio Kimura , Nobuki Tanaka , Tadasuke Endo
IPC分类号： C08L63/00 , B32B27/38 , H05K1/03 , B32B15/092
CPC分类号： C08J5/24 , C08J2363/00 , C08K3/013 , C08K5/549 , C08L63/00 , H01L2224/16225 , H05K1/0366 , H05K1/0373 , H05K2201/0209 , Y10T428/31511 , Y10T428/31529
摘要： Provided is an epoxy resin composition for a circuit board including an epoxy resin (A); an inorganic filler (B); and a cyclic or cage-shape siloxane compound (C) having at least two Si—H bonds or two Si—OH bonds.
摘要翻译：提供一种用于包含环氧树脂（A）的电路板的环氧树脂组合物; 无机填料（B）; 和具有至少两个Si-H键或两个Si-OH键的环状或笼状硅氧烷化合物（C）。

2. 发明授权

US08294268B2 Resin composition, prepreg, laminated board, multilayer printed wiring board and semiconductor device 有权
标题翻译：树脂组合物，预浸料，层压板，多层印刷线路板和半导体器件
公开(公告)号：US08294268B2
公开(公告)日：2012-10-23
申请号：US12594879
申请日：2008-04-07
申请人： Tadasuke Endo
发明人： Tadasuke Endo
IPC分类号： H01L23/14 , B32B27/04 , B32B27/38 , C08L63/00 , C08K5/08
CPC分类号： H05K1/0373 , C08G59/08 , C08G59/4014 , C08G59/621 , C08J5/24 , C08J2363/00 , C08K3/013 , C08K5/0041 , H05K1/0269 , H05K2201/0209 , H05K2203/161 , Y10T428/24994 , Y10T428/31511
摘要： Provided are a resin composition whose storability is not reduced, a prepreg which uses the resin composition and which is uniformly colored, a laminated board, a multilayer printed wiring board having excellent results in reliability tests such as a thermal shock test and the like, and a semiconductor device. The resin composition is a resin composition for a multilayer printed wiring board, comprising (A) a novolac type epoxy resin, (B) a curing agent, (C) an inorganic filler, and (D) a colorant, wherein the exothermic peak temperature of the resin composition, as measured by DSC, is within ±5° C. of the exothermic peak temperature of a resin composition composed of (A) a novolac type epoxy resin, (B) a curing agent, and (C) an inorganic filler.
摘要翻译：提供了不降低保存性的树脂组合物，使用该树脂组合物且均匀着色的预浸料，层压板，在热冲击试验等可靠性试验中具有优异结果的多层印刷线路板，以及半导体器件。该树脂组合物是一种多层印刷线路板用树脂组合物，其包含（A）酚醛清漆型环氧树脂，（B）固化剂，（C）无机填料和（D）着色剂，其中放热峰温度由（A）酚醛清漆型环氧树脂，（B）固化剂和（C）无机物形成的树脂组合物的放热峰温度在DSC±5℃以内的树脂组合物的±5℃以内，填料。

3. 发明申请

US20130105200A1 PREPREG, WIRING BOARD, AND SEMICONDUCTOR DEVICE 审中-公开
标题翻译： PREPREG，接线板和半导体器件
公开(公告)号：US20130105200A1
公开(公告)日：2013-05-02
申请号：US13807254
申请日：2011-06-29
申请人： Noriyuki Ohigashi , Tadasuke Endo
发明人： Noriyuki Ohigashi , Tadasuke Endo
IPC分类号： B32B19/02 , H05K1/02
CPC分类号： B32B19/02 , B32B17/04 , C08J5/24 , C08J2363/00 , H01L2224/16227 , H05K1/02 , H05K1/0366 , H05K3/4602 , H05K3/4655 , H05K2201/0129 , H05K2201/0195 , H05K2201/0209 , H05K2201/029 , H05K2201/0358 , Y10T428/24355 , Y10T428/2495 , Y10T428/252
摘要： An object of the invention is to provide a prepreg which can be thinner, and has both surfaces which have different application, function, performance or properties to each other, one of which has excellent adhesion to the conductive layer, and the conductive layer which is in contact with the one surface of the prepreg can form a fine circuit, and the present invention provides a prepreg including a core layer containing a fibrous base, a first resin layer which is formed on one surface of the core layer, a second layer which is formed on the other surface of the core layer, and a carrier film which is selected from the group consisting of a metal foil and a resin film and which is laminated on at least one of the surfaces of the first resin layer and the second resin layer, wherein the first resin layer contains a first epoxy resin composition containing silica nanoparticles having an average particle diameter of 1 to 100 nm; a thermoplastic resin selected from the group consisting of a polyimide resin, a polyamide resin, a phenoxy resin, a polyphenylene oxide resin, and a polyether sulfone resin; and an epoxy resin, and the first resin layer is in contact with the fibrous base or a part of the first resin layer is infiltrated into the fibrous base; the second resin layer contains a second epoxy resin composition containing an inorganic filler, and an epoxy resin, and a part of the second resin layer is infiltrated into the fibrous base.
摘要翻译：本发明的目的是提供一种可以更薄的预浸料，并且具有彼此具有不同应用，功能，性能或性质的两个表面，其中一个对导电层具有优异的粘附性，导电层是与预浸料坯的一个表面接触可以形成微细电路，本发明提供一种预浸料坯，其包括含有纤维基材的芯层，形成在芯层的一个表面上的第一树脂层，第二层，形成在芯层的另一个表面上，并且载体膜选自金属箔和树脂膜，并且层压在第一树脂层和第二树脂的至少一个表面上层，其中所述第一树脂层含有含有平均粒径为1〜100nm的二氧化硅纳米粒子的第一环氧树脂组合物; 选自聚酰亚胺树脂，聚酰胺树脂，苯氧基树脂，聚苯醚树脂和聚醚砜树脂的热塑性树脂; 和环氧树脂，所述第一树脂层与所述纤维基部接触，或者所述第一树脂层的一部分渗透到所述纤维基材中; 第二树脂层含有含有无机填料的第二环氧树脂组合物和环氧树脂，第二树脂层的一部分渗透到纤维基材中。

4. 发明申请

US20100044090A1 RESIN COMPOSITION, PREPREG, LAMINATED BOARD, MULTILAYER PRINTED WIRING BOARD AND SEMICONDUCTOR DEVICE 有权
标题翻译：树脂组合物，PREPREG，层压板，多层印刷线路板和半导体器件
公开(公告)号：US20100044090A1
公开(公告)日：2010-02-25
申请号：US12594879
申请日：2008-04-07
申请人： Tadasuke Endo
发明人： Tadasuke Endo
IPC分类号： H05K1/16 , C08L63/00 , C08K5/08 , C08K3/34 , C08K3/22 , H05K1/00
CPC分类号： H05K1/0373 , C08G59/08 , C08G59/4014 , C08G59/621 , C08J5/24 , C08J2363/00 , C08K3/013 , C08K5/0041 , H05K1/0269 , H05K2201/0209 , H05K2203/161 , Y10T428/24994 , Y10T428/31511
摘要： Provided are a resin composition whose storability is not reduced, a prepreg which uses the resin composition and which is uniformly colored, a laminated board, a multilayer printed wiring board having excellent results in reliability tests such as a thermal shock test and the like, and a semiconductor device. The resin composition is a resin composition for a multilayer printed wiring board, comprising (A) a novolac type epoxy resin, (B) a curing agent, (C) an inorganic filler, and (D) a colorant, wherein the exothermic peak temperature of the resin composition, as measured by DSC, is within ±5° C. of the exothermic peak temperature of a resin composition composed of (A) a novolac type epoxy resin, (B) a curing agent, and (C) an inorganic filler.
摘要翻译：提供了不降低保存性的树脂组合物，使用该树脂组合物且均匀着色的预浸料，层压板，在热冲击试验等可靠性试验中具有优异结果的多层印刷线路板，以及半导体器件。该树脂组合物是一种多层印刷线路板用树脂组合物，其包含（A）酚醛清漆型环氧树脂，（B）固化剂，（C）无机填料和（D）着色剂，其中放热峰温度由（A）酚醛清漆型环氧树脂，（B）固化剂和（C）无机物形成的树脂组合物的放热峰温度在DSC±5℃以内的树脂组合物的±5℃以内，填料。

5. 发明授权

US08465837B2 Epoxy resin composition, prepreg, laminate board, multilayer printed wiring board, semiconductor device, insulating resin sheet, and process for manufacturing multilayer printed wiring board 有权
标题翻译：环氧树脂组合物，预浸料，层压板，多层印刷线路板，半导体装置，绝缘树脂片，以及多层印刷线路板的制造方法
公开(公告)号：US08465837B2
公开(公告)日：2013-06-18
申请号：US12531308
申请日：2008-04-09
申请人： Tadasuke Endo , Akihito Takahashi
发明人： Tadasuke Endo , Akihito Takahashi
IPC分类号： B32B27/38 , B32B27/04 , C08L63/00 , H01L23/00
CPC分类号： H05K1/0353 , C08K3/013 , C08K5/3445 , C08L61/32 , C08L63/00 , C08L79/04 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H05K1/0373 , H05K2201/0209 , Y10T428/24994 , Y10T428/31511 , Y10T428/31522 , Y10T428/31529 , C08L2666/20 , C08L2666/22 , H01L2224/0401
摘要： Disclosed is an epoxy resin composition essentially containing (A) an epoxy resin having a structure represented by the general formula (1), (B) a curing agent, (C) an inorganic filler and (D) a cyanate resin and/or a prepolymer thereof, wherein Ar represents a fused aromatic hydrocarbon group; r is an integer of 1 or more; X is a hydrogen or an epoxy group (glycidyl ether group); R1 represents one selected from the group consisting of a hydrogen, a methyl group, an ethyl group, a propyl group, a butyl group, a phenyl group and a benzyl group; n is an integer of 1 or more; p and q are an integer of 1 or more; and p's and q's in respective repeating units may be the same as or different from one another.
摘要翻译：公开了一种环氧树脂组合物，其基本上含有（A）具有由通式（1）表示的结构的环氧树脂，（B）固化剂，（C）无机填料和（D）氰酸酯树脂和/或其中Ar表示稠合芳族烃基; r为1以上的整数， X是氢或环氧基（缩水甘油基醚基）; R1表示选自氢，甲基，乙基，丙基，丁基，苯基和苄基的一个基团; n为1以上的整数， p和q是1或更大的整数; 各重复单元中的p和q可以相同或不同。

6. 发明申请

US20110205721A1 RESIN COMPOSITION, RESIN SHEET, PREPREG, LAMINATE, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE 审中-公开
标题翻译：树脂组合物，树脂片，PREPREG，层压板，多层印刷布线板和半导体器件
公开(公告)号：US20110205721A1
公开(公告)日：2011-08-25
申请号：US13126093
申请日：2009-10-27
申请人： Tadasuke Endo
发明人： Tadasuke Endo
IPC分类号： H05K1/18 , B32B27/38 , B32B27/34 , B32B7/00 , C08L63/00 , C08K3/22 , C08K3/34 , C08L77/10 , C08L79/00 , H05K1/03 , B32B37/06 , B32B37/10
CPC分类号： H05K1/0353 , C08K3/013 , C08K3/22 , C08K3/34 , C08K3/36 , C08L63/00 , C08L77/00 , C08L77/10 , C08L79/04 , H05K1/036 , H05K3/4611 , H05K3/4676 , Y10T428/24355 , Y10T428/265 , Y10T428/31511 , Y10T428/31515 , Y10T428/31522 , C08L2666/14 , C08L2666/20 , C08L2666/22 , C08L2666/02
摘要： Disclosed is a resin composition having a low thermal expansion coefficient and a high glass transition temperature used for the insulating layer of a multilayer printed wiring board, capable of forming an insulating layer having fine roughened shapes and imparting sufficient plating peel strength. Also disclosed are a resin sheet, a prepreg, a laminate, a multilayer printed wiring board and a semiconductor device, all of which comprising the resin composition. The resin composition is a resin composition comprising (A) an epoxy resin, (B) a cyanate ester resin, (C) an aromatic polyamide resin containing at least one hydroxyl group and (D) an inorganic filler, as essential components.
摘要翻译：公开了一种树脂组合物，其具有低的热膨胀系数和高的玻璃化转变温度，用于多层印刷线路板的绝缘层，能够形成具有细小粗糙形状并赋予足够电镀剥离强度的绝缘层。还公开了包括树脂组合物的树脂片，预浸料，层压体，多层印刷线路板和半导体器件。树脂组合物是包含（A）环氧树脂，（B）氰酸酯树脂，（C）含有至少一个羟基的芳族聚酰胺树脂和（D）无机填料）作为必要成分的树脂组合物。

7. 发明申请

US20100227170A1 EPOXY RESIN COMPOSITION, PREPREG, LAMINATE BOARD, MULTILAYER PRINTED WIRING BOARD, SEMICONDUCTOR DEVICE, INSULATING RESIN SHEET, AND PROCESS FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD 有权
标题翻译：环氧树脂组合物，PREPREG，层压板，多层印刷接线板，半导体器件，绝缘树脂片和制造多层印刷线路板的方法
公开(公告)号：US20100227170A1
公开(公告)日：2010-09-09
申请号：US12531308
申请日：2008-04-09
申请人： Tadasuke Endo , Akihito Takahashi
发明人： Tadasuke Endo , Akihito Takahashi
IPC分类号： B32B27/38 , C08L63/00 , C08K3/22 , C08K3/34 , C08K3/36 , B29C65/02
CPC分类号： H05K1/0353 , C08K3/013 , C08K5/3445 , C08L61/32 , C08L63/00 , C08L79/04 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H05K1/0373 , H05K2201/0209 , Y10T428/24994 , Y10T428/31511 , Y10T428/31522 , Y10T428/31529 , C08L2666/20 , C08L2666/22 , H01L2224/0401
摘要： Disclosed is an epoxy resin composition essentially containing (A) an epoxy resin having a structure represented by the general formula (1), (B) a curing agent, (C) an inorganic filler and (D) a cyanate resin and/or a prepolymer thereof, wherein Ar represents a fused aromatic hydrocarbon group; r is an integer of 1 or more; X is a hydrogen or an epoxy group (glycidyl ether group); R1 represents one selected from the group consisting of a hydrogen, a methyl group, an ethyl group, a propyl group, a butyl group, a phenyl group and a benzyl group; n is an integer of 1 or more; p and q are an integer of 1 or more; and p's and q's in respective repeating units may be the same as or different from one another.
摘要翻译：公开了一种环氧树脂组合物，其基本上含有（A）具有由通式（1）表示的结构的环氧树脂，（B）固化剂，（C）无机填料和（D）氰酸酯树脂和/或其中Ar表示稠合芳族烃基; r为1以上的整数， X是氢或环氧基（缩水甘油基醚基）; R1表示选自氢，甲基，乙基，丙基，丁基，苯基和苄基的一个基团; n为1以上的整数， p和q是1或更大的整数; 各重复单元中的p和q可以相同或不同。

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