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1. 发明申请

US20050230370A1 Laser beam machining equipment and method for machining by using laser beam 审中-公开
标题翻译：激光束加工设备及使用激光束加工的方法
公开(公告)号：US20050230370A1
公开(公告)日：2005-10-20
申请号：US11091761
申请日：2005-03-29
申请人： Michio Kameyama , Sumitomo Inomata , Eiji Kumagai , Tetsuaki Kamiya , Takashi Ogata , Tsuyoshi Hayakawa
发明人： Michio Kameyama , Sumitomo Inomata , Eiji Kumagai , Tetsuaki Kamiya , Takashi Ogata , Tsuyoshi Hayakawa
IPC分类号： B23K26/00 , B23K26/04 , B23K26/38
CPC分类号： B23K26/046 , B23K26/384
摘要： A method for machining an object includes the steps of: forming a hole in the object by a laser beam having a first focus point; and reforming the hole by the laser beam having a second focus point, which is different from the first focus point. The first and the second focus points are disposed on a same light axis. In at least one of the step of forming the hole and the step of reforming the hole, the object is machined by a diffusion and a condensation of the laser beam in the object.
摘要翻译：一种用于加工物体的方法包括以下步骤：通过具有第一焦点的激光束在物体中形成孔; 并且通过具有与第一焦点不同的第二焦点的激光束对该孔进行重整。第一和第二焦点位于相同的光轴上。在形成孔的步骤和重整孔的步骤中的至少一个中，通过激光束在物体中的扩散和冷凝来加工物体。

2. 发明申请

US20060065648A1 Method and device for removing burr by high-density energy beam 审中-公开
标题翻译：用高密度能量束去除毛刺的方法和装置
公开(公告)号：US20060065648A1
公开(公告)日：2006-03-30
申请号：US11159263
申请日：2005-06-23
申请人： Michio Kameyama , Sumitomo Inomata , Terukazu Fukaya , Eiji Kumagai , Hiromichi Morita
发明人： Michio Kameyama , Sumitomo Inomata , Terukazu Fukaya , Eiji Kumagai , Hiromichi Morita
IPC分类号： B23K26/38
CPC分类号： B23K26/046 , B23K26/0093 , B23K26/361
摘要： A burr removing device for removing a burr, which is formed at a connection between a first hole and a second hole that are angled relative to each other inside a workpiece. According to the burr removing device, a generated high-density energy beam is converged by a converging lens, which is located outside of the first and second holes of the workpiece. Then, the converged high-density energy beam is reflected toward the burr by a one reflecting mirror, which is located in one of the first and second holes.
摘要翻译：一种用于除去毛刺的毛刺去除装置，其形成在第一孔和第二孔之间的连接处，所述连接在工件内相对于彼此成角度。根据毛刺去除装置，产生的高密度能量束由位于工件的第一和第二孔外侧的会聚透镜会聚。然后，会聚的高密度能量束通过位于第一孔和第二孔之一中的一个反射镜朝向毛刺反射。

3. 发明授权

US06495796B2 High density energy beam machining method and apparatus for the same 有权
标题翻译：高密度能量束加工方法及装置相同
公开(公告)号：US06495796B2
公开(公告)日：2002-12-17
申请号：US09912058
申请日：2001-07-25
申请人： Terukazu Fukaya , Takashi Nakayama , Sumitomo Inomata , Michio Kameyama , Seiji Tachibana
发明人： Terukazu Fukaya , Takashi Nakayama , Sumitomo Inomata , Michio Kameyama , Seiji Tachibana
IPC分类号： B23K2638
CPC分类号： B23K26/1438 , B23K26/1435 , B23K26/1476 , B23K26/16 , B23K26/382 , B23K26/40 , B23K26/704 , B23K2103/50
摘要： A discharging nozzle is provided in an inside space of a metal cylinder for supplying an assist gas from an inside of the metal cylinder. The gas discharging nozzle shuts a high density energy beam intruding into the inside space of the metal cylinder through a hole, so that the energy beam is prevented from being emitted to an opposite side inner surface of the metal cylinder. Dross formed during the cut-machining is drifted and swept to the outside by an assist gas flowing out from the inside space of the metal cylinder through the hole, and is blown out by the assist gas flowing on an outside surface of the metal cylinder around the hole, thereby preventing the dross from sticking to peripheral area of the hole.
摘要翻译：在金属筒的内部空间设置有排出喷嘴，用于从金属缸的内部供给辅助气体。气体排出喷嘴关闭通过孔侵入金属筒的内部空间的高密度能量束，防止能量束向金属筒的相对侧内面喷射。在切削加工期间形成的浮渣通过从金属圆筒的内部空间流出的辅助气体穿过该孔而漂移并扫过外部，并且被在金属圆筒的外表面上流动的辅助气体吹出从而防止浮渣粘附到孔的周边区域。

4. 发明授权

US08525064B2 Electric discharge machine and method of producing nozzle body using the same 有权
标题翻译：放电机及使用其的喷嘴体的制造方法
公开(公告)号：US08525064B2
公开(公告)日：2013-09-03
申请号：US12943092
申请日：2010-11-10
申请人： Akira Itoh , Yasuji Inobe , Hiroshi Adachi , Takeshi Oochi , Kazuhisa Ikuta , Michio Kameyama
发明人： Akira Itoh , Yasuji Inobe , Hiroshi Adachi , Takeshi Oochi , Kazuhisa Ikuta , Michio Kameyama
IPC分类号： B23H1/02 , B23H9/10 , B23H9/14
CPC分类号： B23H1/02
摘要： An electric discharge machine to process a work piece includes a plurality of electrodes, and a plurality of discharge power supply units. The plurality of electrodes generate a plurality of discharges with the work piece, respectively. The plurality of discharge power supply units apply voltages for the plurality of electrodes, respectively and independently.
摘要翻译：用于处理工件的放电机包括多个电极和多个放电电源单元。多个电极分别与工件产生多个放电。多个放电电源单元分别独立地施加多个电极的电压。

5. 发明授权

US06181301B2 Combined display panel 失效
标题翻译：组合显示面板
公开(公告)号：US06181301B2
公开(公告)日：2001-01-30
申请号：US08899569
申请日：1997-07-24
申请人： Kazuhiro Inoguchi , Yoichi Kotanshi , Michio Kameyama , Takeshi Ishikawa , Koji Ogusu
发明人： Kazuhiro Inoguchi , Yoichi Kotanshi , Michio Kameyama , Takeshi Ishikawa , Koji Ogusu
IPC分类号： B09G500
CPC分类号： B60K37/02 , B60K2350/1064 , B60K2350/2017
摘要： A transparent electroluminescent display panel overlaps at least a part of a conventional instrument panel, and forms a combined display panel assembly. Overlapping front and back panel displays are selectively displayed. The front electroluminescent panel displays additional information such as navigation maps, and is turned off when such additional information is not required while the back panel is turned on. The present invention eliminates undesirable reflected images of the back panel vaguely shown on the front panel when the front panel is on and the back panel is off. A light attenuator, eliminates the reflected images. It decreases the intensity of light emitted from the front panel to the back panel, and is disposed between the back and the front panels or built into the electroluminescent panel, so that the reflected images are eliminated.
摘要翻译：透明电致发光显示面板与常规仪表板的至少一部分重叠，并形成组合的显示面板组件。有选择地显示重叠的前后面板显示。前面的电致发光面板显示诸如导航地图的附加信息，并且当背面板打开时不需要这样的附加信息时，它被关闭。本发明消除了当前面板打开并且后面板关闭时在前面板上模糊地示出的后面板的不期望的反射图像。光衰减器消除了反射图像。它降低了从前面板到后面板发射的光的强度，并且设置在后面板和前面板之间或内置到电致发光面板中，从而消除了反射图像。

6. 发明授权

US08405218B2 Semiconductor device and method of patterning resin insulation layer on substrate of the same 有权
标题翻译：树脂绝缘层的图案化半导体装置及方法
公开(公告)号：US08405218B2
公开(公告)日：2013-03-26
申请号：US12887874
申请日：2010-09-22
申请人： Manabu Tomisaka , Michio Kameyama , Terukazu Fukaya , Kazuhito Katoh , Akira Tai , Kazuo Akamatsu , Yoshiko Fukuda , Yuji Fukuda , Mika Ootsuki
发明人： Manabu Tomisaka , Michio Kameyama , Terukazu Fukaya , Kazuhito Katoh , Yutaka Fukuda , Akira Tai , Kazuo Akamatsu
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L21/76804 , H01L23/293 , H01L23/3171 , H01L23/5226 , H01L24/03 , H01L24/11 , H01L24/741 , H01L2224/02166 , H01L2224/0384 , H01L2224/0391 , H01L2224/0401 , H01L2224/05022 , H01L2224/05027 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2224/05164 , H01L2224/05166 , H01L2224/0517 , H01L2224/05171 , H01L2224/05172 , H01L2224/05572 , H01L2224/05573 , H01L2224/05582 , H01L2224/05583 , H01L2224/05611 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/0566 , H01L2224/05669 , H01L2224/11505 , H01L2224/131 , H01L2224/16 , H01L2224/749 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/1461 , H01L2924/181 , H01L2924/00014 , H01L2924/01026 , H01L2924/01014 , H01L2924/00 , H01L2224/05552
摘要： In a method of manufacturing a semiconductor device, an electrode layer is formed on a surface of a semiconductor substrate, and a resin insulation layer is formed on the surface of the semiconductor substrate so that the electrode layer can be covered with the resin insulation layer. A tapered hole is formed in the insulation layer by using a tool bit having a rake angle of zero or a negative value. The tapered hole has an opening defined by the insulation layer, a bottom defined by the electrode layer, and a side wall connecting the opening to the bottom.
摘要翻译：在制造半导体器件的方法中，在半导体衬底的表面上形成电极层，并且在半导体衬底的表面上形成树脂绝缘层，使得可以用树脂绝缘层覆盖电极层。通过使用前角为零或负值的工具钻头，在绝缘层中形成锥形孔。锥形孔具有由绝缘层限定的开口，由电极层限定的底部和将开口连接到底部的侧壁。

7. 发明申请

US20110198733A1 SEMICONDUCTOR DEVICE AND METHOD OF PATTERNNING RESIN INSULATION LAYER ON SUBSTRATE OF THE SAME 有权
标题翻译：半导体器件及其基片上树脂绝缘层图案的方法
公开(公告)号：US20110198733A1
公开(公告)日：2011-08-18
申请号：US12887874
申请日：2010-09-22
申请人： Manabu Tomisaka , Michio Kameyama , Terukazu Fukaya , Kazuhito Katoh , Yutaka Fukuda , Akira Tai , Kazuo Akamatsu , Yoshiko Fukuda , Yuji Fukuda , Mika Ootsuki , Mayu Fukuda
发明人： Manabu Tomisaka , Michio Kameyama , Terukazu Fukaya , Kazuhito Katoh , Yutaka Fukuda , Akira Tai , Kazuo Akamatsu , Yoshiko Fukuda , Yuji Fukuda , Mika Ootsuki , Mayu Fukuda
IPC分类号： H01L29/06 , H01L21/66
CPC分类号： H01L21/76804 , H01L23/293 , H01L23/3171 , H01L23/5226 , H01L24/03 , H01L24/11 , H01L24/741 , H01L2224/02166 , H01L2224/0384 , H01L2224/0391 , H01L2224/0401 , H01L2224/05022 , H01L2224/05027 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2224/05164 , H01L2224/05166 , H01L2224/0517 , H01L2224/05171 , H01L2224/05172 , H01L2224/05572 , H01L2224/05573 , H01L2224/05582 , H01L2224/05583 , H01L2224/05611 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/0566 , H01L2224/05669 , H01L2224/11505 , H01L2224/131 , H01L2224/16 , H01L2224/749 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/1461 , H01L2924/181 , H01L2924/00014 , H01L2924/01026 , H01L2924/01014 , H01L2924/00 , H01L2224/05552
摘要： In a method of manufacturing a semiconductor device, an electrode layer is formed on a surface of a semiconductor substrate, and a resin insulation layer is formed on the surface of the semiconductor substrate so that the electrode layer can be covered with the resin insulation layer. A tapered hole is formed in the insulation layer by using a tool bit having a rake angle of zero or a negative value. The tapered hole has an opening defined by the insulation layer, a bottom defined by the electrode layer, and a side wall connecting the opening to the bottom.
摘要翻译：在制造半导体器件的方法中，在半导体衬底的表面上形成电极层，并且在半导体衬底的表面上形成树脂绝缘层，使得可以用树脂绝缘层覆盖电极层。通过使用前角为零或负值的工具钻头，在绝缘层中形成锥形孔。锥形孔具有由绝缘层限定的开口，由电极层限定的底部和将开口连接到底部的侧壁。

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