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    • 1. 发明授权
    • Optical proximity correction for phase shifting photolithographic masks
    • 用于相移光刻掩模的光学邻近校正
    • US06721938B2
    • 2004-04-13
    • US10082697
    • 2002-02-25
    • Christophe PierratMichel Luc Côté
    • Christophe PierratMichel Luc Côté
    • G06F1750
    • G03F1/30G03F1/36G03F1/70
    • A method for producing a computer readable definition of photolithographic mask used to define a target pattern is provided. The phase shift mask patterns include phase shift windows, and the trim mask patterns include trim shapes, which have boundaries defined by such sets of line segments. For a particular pair of phase shift windows used to define a target feature in a target pattern, each of the phase shift windows in the pair can be considered to have a boundary that includes at least one line segment that abuts the target feature. Likewise, a complementary trim shape used in definition of the target feature, for example by including a transmissive region used to clear an unwanted phase transition between the particular pair of phase shift windows, includes at least one line segment that can be considered to abut the target feature. Proximity correction is provided by adjusting the position of the at least one line segment on the boundary of a phase shift windows in said pair which abuts the target feature, and by adjusting the position of the at least one line segment on the boundary of the complementary trim shape which abuts the target feature.
    • 提供了一种用于产生用于定义目标图案的光刻掩模的计算机可读定义的方法。 相移掩模图案包括相移窗口,并且修剪掩模图案包括具有由这些线段集合限定的边界的修剪形状。 对于用于定义目标图案中的目标特征的特定的一对相移窗口,该对中的每个相移窗口可以被认为具有包括至少一个邻接目标特征的线段的边界。 类似地,在目标特征的定义中使用的互补的修剪形状,例如通过包括用于清除特定的一对相移窗口之间的不需要的相变的透射区域,包括至少一个可被认为邻接 目标特征。 通过调整邻接目标特征的所述对中的相移窗口的边界上的至少一个线段的位置,并且通过调整互补的边界上的至少一个线段的位置来提供接近校正 贴合目标特征的修剪形状。
    • 2. 发明授权
    • Accelerated layout processing using OPC pre-processing
    • 使用OPC预处理加速布局处理
    • US06807663B2
    • 2004-10-19
    • US10253204
    • 2002-09-23
    • Michel Luc CôtéChristophe PierratPhilippe Hurat
    • Michel Luc CôtéChristophe PierratPhilippe Hurat
    • G06F1750
    • G03F1/36G06F17/5068
    • Performing optical proximity correction (OPC) is typically done during a critical time, wherein even small delays in finishing OPC can have significant adverse effects on product introduction and/or market exposure. In accordance with one feature of the invention, sets of repeating structures in library elements and/or layout data can be identified during a non-critical time, e.g. early in cell library development, possibly years prior to the direct application of OPC to a final layout. OPC can be performed on repeating structures during this non-critical time. Later, during the critical time (e.g. during tape out), an OPC tool can use the pre-processed structures in conjunction with a chip layout to more quickly generate a modified layout, thereby saving valuable time as a chip moves from design to production.
    • 执行光学邻近校正(OPC)通常在关键时间完成,其中甚至在整理OPC中的小延迟可能对产品引入和/或市场暴露具有显着的不利影响。 根据本发明的一个特征,可以在非关键时间期间识别库元素和/或布局数据中的重复结构集合,例如, 早期的细胞库开发,可能在OPC直接应用到最终布局之前的几年。 在这个非关键时刻,可以对重复结构执行OPC。 之后,在关键时刻(例如在磁带输出期间),OPC工具可以将预处理的结构与芯片布局一起使用,以更快地生成修改的布局,从而在芯片从设计转移到生产时节省宝贵的时间。
    • 6. 发明授权
    • Phase conflict resolution for photolithographic masks
    • 光刻掩模的相位冲突分辨率
    • US07169515B2
    • 2007-01-30
    • US10834623
    • 2004-04-29
    • Christophe PierratMichel Luc Côté
    • Christophe PierratMichel Luc Côté
    • G03F9/00G06F17/50
    • G03F7/70466G03F1/26G03F7/70425G03F7/70433G03F7/70558
    • A photolithographic mask used for defining a layer in an integrated circuit, or other work piece, where the layer comprises a pattern including a plurality of features to be implemented with phase shifting in phase shift regions is laid out including for patterns comprising high density, small dimension features, and for “full shift” patterns. The method includes identifying cutting areas for phase shift regions based on characteristics of the pattern. Next, the process cuts the phase shift regions in selected ones of the cutting areas to define phase shift windows, and assigns phase values to the phase shift windows. The phase shift values assigned comprise φ and θ, so that destructive interference is caused in transitions between adjacent phase shift windows having respective phase shift values of φ and θ. In the preferred embodiment, φ is equal to approximately θ+180 degrees. Results of the cutting and assigning steps are stored in a computer readable medium, used for manufacturing a mask, and used for manufacturing an integrated circuit. By identifying the cutting areas based on characteristics of the pattern to be formed, the problem of dividing phase shift regions into phase shift windows, and assigning phase shift values to the windows is simplified.
    • 布置用于在集成电路或其它工件中定义层的光刻掩模,其中该层包括在相移区域中实现相移的多个特征的图案,包括用于高密度,小的 尺寸特征和“全移”图案。 该方法包括基于图案的特性识别相移区域的切割区域。 接下来,该处理切割选择的切割区域中的相移区域以限定相移窗口,并将相位值分配给相移窗口。 分配的相移值包括phi和theta,使得在具有各自的phi和theta的相移值的相邻相移窗口之间的转变中引起相消干涉。 在优选实施例中,phi等于大约θ+ 180度。 切割和分配步骤的结果存储在用于制造掩模的计算机可读介质中,并用于制造集成电路。 通过基于要形成的图案的特性来识别切割区域,简化了将相移区域划分为相移窗口并将相移值分配给窗口的问题。
    • 8. 发明授权
    • Phase shifting design and layout for static random access memory
    • 静态随机存取存储器的相移设计和布局
    • US06681379B2
    • 2004-01-20
    • US09996973
    • 2001-11-15
    • Christophe PierratMichel Luc Côté
    • Christophe PierratMichel Luc Côté
    • G06F1750
    • G03F7/70433G03F1/26G03F1/30G03F1/36G03F1/70G03F7/70425G03F7/70466
    • Methods and apparatuses for fully defining static random access memory (SRAM) using phase shifting layouts are described. The approach includes identifying that a layout includes SRAM cells and defining phase shifting regions in a mask description to fully define the SRAM cells. The phase conflicts between adjacent phase shifters are resolved by selecting cutting patterns designed for the SRAM shape and functional structure. Additionally, the transistor gates of the SRAM cells can be reduced in size relative to the original SRAM layout design. Thus, an SRAM cell can be lithographically printed with small, consistent critical dimensions including extremely small gate lengths resulting in higher yields and improved performance.
    • 描述了使用相移布局完全定义静态随机存取存储器(SRAM)的方法和装置。 该方法包括识别布局包括SRAM单元并且在掩模描述中定义相移区域以完全限定SRAM单元。 通过选择为SRAM形状和功能结构设计的切割图案来解决相邻移相器之间的相位冲突。 另外,相对于原始的SRAM布局设计,SRAM单元的晶体管栅极的尺寸可以减小。 因此,SRAM单元可以被光刻印刷,具有小的,一致的临界尺寸,包括非常小的栅极长度,导致更高的产量和改进的性能。
    • 9. 发明授权
    • Handling of flat data for phase processing including growing shapes within bins to identify clusters
    • 处理平面数据用于相位处理,包括在箱内生长形状以识别集群
    • US07500217B2
    • 2009-03-03
    • US11083697
    • 2005-03-17
    • Michel Luc CôtéChristophe Pierrat
    • Michel Luc CôtéChristophe Pierrat
    • G06F17/50G06F9/455G06F1/00
    • G03F1/30G03F1/26G03F1/36G03F1/68G03F7/70425G03F7/70433G03F7/70466G03F7/70558
    • Definition of a phase shifting layout from an original layout can be time consuming. If the original layout is divided into useful groups, i.e. clusters that can be independently processed, then the phase shifting process can be performed more rapidly. If the shapes on the layout are enlarged, then the overlapping shapes can be grouped together to identify shapes that should be processed together. For large layouts, growing and grouping the shapes can be time consuming. Therefore, an approach that uses bins can speed up the clustering process, thereby allowing the phase shifting to be performed in parallel on multiple computers. Additional efficiencies result if identical clusters are identified and processing time saved so that repeated clusters of shapes only undergo the computationally expensive phase shifter placement and assignment process a single time.
    • 从原始布局定义相移布局可能是耗时的。 如果将原始布局分成有用的组,即可以被独立处理的集群,则可以更快地执行相移过程。 如果布局上的形状被放大,则可以将重叠的形状分组在一起以识别应该一起处理的形状。 对于大型布局,增长和分组形状可能是耗时的。 因此,使用箱体的方法可以加快聚类过程,从而允许在多个计算机上并行执行相移。 如果确定相同的集群并节省处理时间,则可以产生额外的效率,以便重复的形状集群只能在单次时间内经历计算上昂贵的移相器放置和分配过程。