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    • 1. 发明授权
    • Distributed electrostatic discharge protection circuit with varying clamp size
    • 具有不同钳位尺寸的分布式静电放电保护电路
    • US07589945B2
    • 2009-09-15
    • US11513638
    • 2006-08-31
    • James W. MillerMelanie EthertonMichael G. KhazhinskyMichael Stockinger
    • James W. MillerMelanie EthertonMichael G. KhazhinskyMichael Stockinger
    • H02H9/00
    • H02H9/046H01L2924/0002H01L2924/00
    • An integrated circuit includes a first I/O cell disposed at a substrate, the first I/O cell including a first electrostatic discharge (ESD) clamp transistor device. The first ESD clamp transistor device includes a control electrode, a first current electrode coupled to a first voltage reference bus, and second current electrode coupled to a second voltage reference bus. The first ESD clamp transistor device has a first channel width. The integrated circuit further includes a second I/O cell including a second ESD clamp transistor device. The second ESD clamp transistor device includes a control electrode, a first current electrode coupled to the first voltage reference bus, and second current electrode coupled to the second voltage reference bus. The second ESD clamp transistor device has a second channel width different than the first channel width.
    • 集成电路包括设置在基板上的第一I / O单元,第一I / O单元包括第一静电放电(ESD)钳位晶体管器件。 第一ESD钳位晶体管器件包括控制电极,耦合到第一电压参考总线的第一电流电极和耦合到第二电压参考总线的第二电流电极。 第一ESD钳位晶体管器件具有第一通道宽度。 集成电路还包括具有第二ESD钳位晶体管器件的第二I / O单元。 第二ESD钳位晶体管器件包括控制电极,耦合到第一电压参考总线的第一电流电极和耦合到第二电压参考总线的第二电流电极。 第二ESD钳位晶体管器件具有与第一通道宽度不同的第二通道宽度。
    • 8. 发明授权
    • Electrostatic discharge protection circuit and method of operation
    • 静电放电保护电路及操作方法
    • US06970336B2
    • 2005-11-29
    • US10684112
    • 2003-10-10
    • Michael StockingerJames W. Miller
    • Michael StockingerJames W. Miller
    • H01L27/02H02H3/20H02H3/22H02H9/00H02H9/04
    • H01L27/0251H01L27/0292H01L2924/0002H01L2924/00
    • An ESD protection circuit (201) is for use with a high-voltage tolerant I/O circuit in an IC. This is accomplished by providing a small ESD diode (217) from the I/O pad to a relatively small boosted voltage bus (BOOST BUS). The BOOST BUS is used to power a trigger circuit (203). This path has very little current flow during an ESD event due to minimal current dissipation in the trigger circuit. There is a diode drop but only very little IR voltage drop from the I/O pad to the trigger circuit (203). The trigger circuit (203) controls relatively large cascoded clamp NMOSFETs (207, 209). The net result is that a gate-to-source voltage (VGS) of both of the clamp NMOSFETs is increased thus increasing the conductivity of the cascoded clamp NMOSFETs (207, 209). This reduces the on-resistance of each of the NMOSFETS (207, 209), thereby improving the ESD performance, and reducing the layout area required to implement robust ESD protection circuits.
    • ESD保护电路(201)用于IC中的高耐压I / O电路。 这是通过从I / O焊盘到相对较小的升压电压总线(BOOST BUS)提供一个小型ESD二极管(217)来实现的。 BOOST BUS用于为触发电路(203)供电。 由于触发电路中的电流消耗最小,因此在ESD事件期间该路径具有非常小的电流。 存在二极管压降,但是从I / O焊盘到触发电路(203)仅有很少的IR电压降。 触发电路(203)控制相对较大的级联钳位NMOSFET(207,209)。 最终的结果是两个钳位NMOSFET的栅极 - 源极电压(VGS)增加,从而增加了级联钳位NMOSFET(207,209)的电导率。 这降低了每个NMOSFET(207,209)的导通电阻,从而提高了ESD性能,并且减少了实现鲁棒ESD保护电路所需的布局面积。