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    • 5. 发明授权
    • Semiconductor structure
    • 半导体结构
    • US08872233B2
    • 2014-10-28
    • US13419583
    • 2012-03-14
    • Taek LimRolf AidamLutz KirsteRuediger Quay
    • Taek LimRolf AidamLutz KirsteRuediger Quay
    • H01L29/66H01L21/338H01L29/778H01L27/06
    • H01L29/778H01L27/0605H01L29/2003H01L29/66431H01L29/7786
    • A semiconductor structure includes a barrier layer, a spacer structure, and a channel layer. The barrier layer includes a group III nitride. The spacer structure includes first and second aluminum nitride layers and an intermediate layer. The intermediate layer includes a group III nitride and is between the first and second aluminum nitride layers. The intermediate layer has a first free charge carrier density at an interface with the second aluminum nitride layer. The spacer structure is between the barrier layer and the channel layer. The channel layer includes a group III nitride and has a second free charge carrier density at an interface with the first aluminum nitride layer of the spacer structure. The first aluminum nitride layer, the intermediate layer, and the second aluminum nitride layer have layer thicknesses so the first free charge carrier density is less than 10% of the second free charge carrier density.
    • 半导体结构包括阻挡层,间隔结构和沟道层。 阻挡层包括III族氮化物。 间隔结构包括第一和第二氮化铝层和中间层。 中间层包括III族氮化物,并且位于第一和第二氮化铝层之间。 中间层在与第二氮化铝层的界面处具有第一自由电荷载流子密度。 间隔结构位于阻挡层和通道层之间。 沟道层包括III族氮化物,并且在与间隔物结构的第一氮化铝层的界面处具有第二自由电荷载流子密度。 第一氮化铝层,中间层和第二氮化铝层具有层厚度,使得第一自由载流子密度小于第二自由电荷载流子密度的10%。