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    • 4. 发明授权
    • Substrate lamination system and method
    • 基板层压体系及方法
    • US08691043B2
    • 2014-04-08
    • US12009375
    • 2008-01-18
    • James D. SampicaPaul R. NemethTracy J. BarnidgeVincent P. Marzen
    • James D. SampicaPaul R. NemethTracy J. BarnidgeVincent P. Marzen
    • B32B37/00
    • B32B37/1018B32B37/003B32B37/0046B32B37/12B32B2038/1891B32B2309/02B32B2309/04B32B2309/72B32B2315/08B32B2457/202
    • The present disclosure is directed to a substrate lamination system and method. A method for laminating substrates may comprise: (a) disposing a pressure-sensitive adhesive later between a substantially planar surface of a first substrate and a substantially planar surface of a second substrate; (b) disposing the first substrate, pressure-sensitive adhesive layer and second substrate within a vacuum chamber; (c) evacuating the vacuum chamber; (d) applying pressure to at least one of the first substrate and the second substrate. A system for laminating substrates may comprise: (a) means for disposing a pressure-sensitive adhesive layer between a substantially planar surface of a first substrate and a substantially planar surface of a second substrate; (b) means for disposing the first substrate, pressure-sensitive adhesive layer and second substrate within a vacuum chamber; (c) means for evacuating the vacuum chamber; (d) means for applying pressure to at least one of the first and second substrates.
    • 本公开涉及基板层压系统和方法。 层压基板的方法可以包括:(a)在第一基板的基本上平坦的表面和第二基板的基本上平坦的表面之间设置压敏粘合剂; (b)将第一基板,压敏粘合剂层和第二基板设置在真空室内; (c)抽真空室; (d)向第一基板和第二基板中的至少一个施加压力。 用于层压基板的系统可以包括:(a)用于在第一基板的基本上平坦的表面和第二基板的基本上平坦的表面之间设置压敏粘合剂层的装置; (b)将第一基板,压敏粘合剂层和第二基板设置在真空室内的装置; (c)抽真空室的装置; (d)向第一和第二基板中的至少一个施加压力的装置。