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1. 发明授权

US06470594B1 Highly moisture-sensitive electronic device element and method for fabrication utilizing vent holes or gaps 有权
标题翻译：高度湿度敏感的电子设备元件和利用排气孔或间隙的制造方法
公开(公告)号：US06470594B1
公开(公告)日：2002-10-29
申请号：US09960677
申请日：2001-09-21
申请人： Michael L. Boroson , John Schmittendorf , Peter G. Bessey , Jeffrey P. Serbicki
发明人： Michael L. Boroson , John Schmittendorf , Peter G. Bessey , Jeffrey P. Serbicki
IPC分类号： F26B300
CPC分类号： H01L23/564 , H01L23/08 , H01L23/10 , H01L23/26 , H01L27/14618 , H01L27/14806 , H01L51/524 , H01L51/5246 , H01L51/5259 , H01L2251/566 , H01L2924/0002 , H01L2924/01079 , H01L2924/09701 , H01L2924/12044 , H01L2924/15151 , H01L2924/16152 , H01L2924/16195 , H01L2924/00
摘要： A highly moisture-sensitive element and method of making such element includes an encapsulation enclosure encapsulating all of the highly moisture-sensitive electronic devices on a substrate and a sealing material positioned between the substrate and the encapsulation enclosure to form a complete seal between the substrate and the encapsulation enclosure around each highly moisture-sensitive electronic device or around groups of highly moisture-sensitive electronic devices, wherein the substrate or encapsulation enclosure, or both, contain vent holes and vent hole seal material or wherein the seal material contains gaps prior to spacing the substrate and the encapsulation enclosure within a predetermined range and the gaps are filled in by spreading the sealing material.
摘要翻译：高度湿度敏感元件和制造这种元件的方法包括将基底上的所有高湿度敏感电子器件封装的封装外壳和位于基底和封装外壳之间的密封材料，以在基底和封装外壳之间形成完整密封每个高度湿度敏感的电子设备周围的封装外壳或高度湿度敏感的电子设备的组，其中衬底或封装外壳或两者包含通气孔和通气孔密封材料，或者其中密封材料在间隔之前包含间隙衬底和封装外壳处于预定范围内，并通过铺展密封材料来填充间隙。

2. 发明授权

US06594916B2 Highly moisture-sensitive electronic device element and method for fabrication utilizing vent holes or gaps 有权
公开(公告)号：US06594916B2
公开(公告)日：2003-07-22
申请号：US10150029
申请日：2002-05-17
申请人： Michael L. Boroson , John Schmittendorf , Peter G. Bessey , Jeffrey P. Serbicki
发明人： Michael L. Boroson , John Schmittendorf , Peter G. Bessey , Jeffrey P. Serbicki
IPC分类号： F26B300
CPC分类号： H01L23/564 , H01L23/08 , H01L23/10 , H01L23/26 , H01L27/14618 , H01L27/14806 , H01L51/524 , H01L51/5246 , H01L51/5259 , H01L2251/566 , H01L2924/0002 , H01L2924/01079 , H01L2924/09701 , H01L2924/12044 , H01L2924/15151 , H01L2924/16152 , H01L2924/16195 , H01L2924/00
摘要： A highly moisture-sensitive element and method of making such element includes an encapsulation enclosure encapsulating all of the highly moisture-sensitive electronic devices on a substrate and a sealing material positioned between the substrate and the encapsulation enclosure to form a complete seal between the substrate and the encapsulation enclosure around each highly moisture-sensitive electronic device or around groups of highly moisture-sensitive electronic devices, wherein the substrate or encapsulation enclosure, or both, contain vent holes and vent hole seal material or wherein the seal material contains gaps prior to spacing the substrate and the encapsulation enclosure within a predetermined range and the gaps are filled in by spreading the sealing material.

3. 发明授权

US06590157B2 Sealing structure for highly moisture-sensitive electronic device element and method for fabrication 有权
标题翻译：高湿度敏感电子元件元件的密封结构及其制造方法
公开(公告)号：US06590157B2
公开(公告)日：2003-07-08
申请号：US09957856
申请日：2001-09-21
申请人： Michael L. Boroson , John Schmittendorf , Peter G. Bessey , Jeffrey P. Serbicki
发明人： Michael L. Boroson , John Schmittendorf , Peter G. Bessey , Jeffrey P. Serbicki
IPC分类号： H05K500
CPC分类号： H01L23/26 , B81B7/0038 , H01L23/08 , H01L23/10 , H01L27/14618 , H01L51/524 , H01L51/5246 , H01L51/5253 , H01L51/5259 , H01L2251/566 , H01L2924/0002 , H01L2924/09701 , H01L2924/12044 , H01L2924/00
摘要： A highly moisture-sensitive element and method of making such element includes an encapsulation enclosure encapsulating all of the highly moisture-sensitive electronic devices on a substrate and a sealing material positioned between the substrate and the encapsulation enclosure to form a partial seal (later to be filled) between the substrate and the encapsulation enclosure around each highly moisture-sensitive electronic device or around groups of highly moisture-sensitive electronic devices.
摘要翻译：高度湿度敏感的元件和制造这种元件的方法包括将基底上的所有高湿度敏感电子器件封装的封装外壳和位于基底和封装外壳之间的密封材料以形成部分密封（稍后为填充）在每个高度湿度敏感的电子设备周围的基底和封装外壳之间或围绕几组高度湿度敏感的电子设备。

4. 发明授权

US06226890B1 Desiccation of moisture-sensitive electronic devices 有权
标题翻译：湿度敏感电子设备的干燥
公开(公告)号：US06226890B1
公开(公告)日：2001-05-08
申请号：US09543973
申请日：2000-04-07
申请人： Michael L. Boroson , Jeffrey P. Serbicki , Peter G. Bessey
发明人： Michael L. Boroson , Jeffrey P. Serbicki , Peter G. Bessey
IPC分类号： F26B300
CPC分类号： F26B21/083 , H01L51/5259
摘要： A method of desiccating an environment surrounding a moisture-sensitive electronic device sealed within an enclosure, includes selecting a desiccant comprised of solid particles having a particle size range 0.1 to 200 micrometers, the desiccant selected to provide an equilibrium minimum humidity level lower than a humidity level to which the device is sensitive within the sealed enclosure; choosing a binder that maintains or enhances the moisture absorption rate of the desiccant for blending the selected desiccant therein, the binder being in liquid phase or dissolved in a liquid; forming a castable blend including at least the desiccant particles and the binder, the blend having a preferred weight fraction of the desiccant particles in the blend in a range of 10% to 90%; casting a measured amount of the blend onto a portion of an interior surface of an enclosure to form a desiccant layer thereover, the enclosure having a sealing flange; solidifying the desiccant layer to a solid; and sealing the electronic device with the enclosure along the sealing flange.
摘要翻译：一种干燥密封在外壳内的湿度敏感电子设备的环境的方法，包括选择由粒度范围为0.1至200微米的固体颗粒组成的干燥剂，选择干燥剂以提供低于湿度的平衡最小湿度水平在密封的外壳内设备敏感的水平; 选择粘合剂，其维持或提高用于混合所选择的干燥剂的干燥剂的吸湿率，所述粘合剂处于液相或溶解在液体中; 形成包含至少干燥剂颗粒和粘合剂的可浇铸混合物，所述共混物在共混物中的干燥剂颗粒的优选重量分数在10％至90％的范围内; 将测量量的共混物浇铸到外壳的内表面的一部分上以在其上形成干燥剂层，外壳具有密封凸缘; 将干燥剂层固化成固体; 并且沿着密封凸缘将具有外壳的电子设备密封。

5. 发明授权

US06740145B2 Desiccants and desiccant packages for highly moisture-sensitive electronic devices 有权
标题翻译：用于高湿度敏感电子设备的干燥剂和干燥剂包装
公开(公告)号：US06740145B2
公开(公告)日：2004-05-25
申请号：US09924778
申请日：2001-08-08
申请人： Michael L. Boroson , Jeffrey P. Serbicki , Peter G. Bessey , Glen C. Irvin , Lawrence A. Rowley , Cheryl J. Kaminsky
发明人： Michael L. Boroson , Jeffrey P. Serbicki , Peter G. Bessey , Glen C. Irvin , Lawrence A. Rowley , Cheryl J. Kaminsky
IPC分类号： B01D5304
CPC分类号： F26B21/083 , H01L23/26 , H01L2924/0002 , H01L2924/09701 , H01L2924/12044 , H01L2924/00
摘要： An effective desiccant for use in a package which has a material including at least in part solid particles of one or more materials, at least one of such materials having an average particle size range 0.001 to 0.1 micrometers to provide a high rate of water absorption and to provide an equilibrium minimum humidity level lower than a humidity level to which a highly moisture sensitive electronic device is sensitive within a sealed enclosure.
摘要翻译：一种用于包装的有效干燥剂，其具有包括至少部分一种或多种材料的固体颗粒的材料，至少一种这样的材料，其平均粒度范围为0.001至0.1微米，以提供高吸水率，以及以提供低于在密封的外壳内高度湿度敏感的电子设备敏感的湿度水平的平衡最小湿度水平。

6. 发明授权

US06818479B2 Highly moisture-sensitive electronic device element and method for fabrication 有权
标题翻译：高湿度敏感电子元件及其制造方法
公开(公告)号：US06818479B2
公开(公告)日：2004-11-16
申请号：US10409840
申请日：2003-04-09
申请人： Michael L. Boroson , John Schmittendorf , Jeffrey P. Serbicki
发明人： Michael L. Boroson , John Schmittendorf , Jeffrey P. Serbicki
IPC分类号： H01L2144
CPC分类号： H01L23/26 , H01L23/08 , H01L23/10 , H01L51/524 , H01L51/5246 , H01L51/5253 , H01L51/5259 , H01L2251/566 , H01L2924/0002 , H01L2924/01079 , H01L2924/09701 , H01L2924/12044 , H01L2924/16152 , H01L2924/16195 , H01L2924/3011 , H01L2924/00
摘要： A highly moisture-sensitive element and method of making such element includes an encapsulation enclosure encapsulating all of the highly moisture-sensitive electronic devices on a substrate and a sealing material positioned between the substrate and the encapsulation enclosure to form a complete seal between the substrate and the encapsulation enclosure around each highly moisture-sensitive electronic device or around groups of highly moisture-sensitive electronic devices.
摘要翻译：高度湿度敏感元件和制造这种元件的方法包括将基底上的所有高湿度敏感电子器件封装的封装外壳和位于基底和封装外壳之间的密封材料，以在基底和封装外壳之间形成完整密封每个高度湿度敏感的电子设备周围的封装外壳或高湿度敏感电子设备的周围。

7. 发明授权

US07091605B2 Highly moisture-sensitive electronic device element and method for fabrication 有权
公开(公告)号：US07091605B2
公开(公告)日：2006-08-15
申请号：US09957851
申请日：2001-09-21
申请人： Michael L. Boroson , John Schmittendorf , Jeffrey P. Serbicki
发明人： Michael L. Boroson , John Schmittendorf , Jeffrey P. Serbicki
IPC分类号： H01L23/34
CPC分类号： H01L23/26 , H01L23/08 , H01L23/10 , H01L51/524 , H01L51/5246 , H01L51/5253 , H01L51/5259 , H01L2251/566 , H01L2924/0002 , H01L2924/01079 , H01L2924/09701 , H01L2924/12044 , H01L2924/16152 , H01L2924/16195 , H01L2924/3011 , H01L2924/00
摘要： A highly moisture-sensitive element and method of making such element includes an encapsulation enclosure encapsulating all of the highly moisture-sensitive electronic devices on a substrate and a sealing material positioned between the substrate and the encapsulation enclosure to form a complete seal between the substrate and the encapsulation enclosure around each highly moisture-sensitive electronic device or around groups of highly moisture-sensitive electronic devices.

8. 发明授权

US6111357A Organic electroluminescent display panel having a cover with radiation-cured perimeter seal 失效
标题翻译：有机电致发光显示面板，其具有带辐射固化的周边密封的盖
公开(公告)号：US6111357A
公开(公告)日：2000-08-29
申请号：US112625
申请日：1998-07-09
申请人： Paul J. Fleming , Michael L. Boroson , Jeffrey P. Serbicki
发明人： Paul J. Fleming , Michael L. Boroson , Jeffrey P. Serbicki
IPC分类号： G09F9/30 , H01L27/32 , H01L51/50 , H01L51/52 , H05B33/02 , H05B33/04 , H05B33/06 , H05B33/10
CPC分类号： H01L51/5246 , H01L27/3276 , H01L27/3288 , H05B33/04 , H01L27/3237 , Y10S428/917
摘要： An organic electroluminescent (EL) display panel is disclosed which has a protective cover sealed thereon with a radiation-cured perimeter seal. The organic EL display panel is formed on a radiation-transmissive substrate, and includes at least one metallized leader which is in electrical contact with at least one anode electrode or with at least one cathode electrode. The metallized leader has a patterned seal zone which defines radiation-transmissive apertures. A perimeter seal band is formed over the substrate and extends through the patterned seal zone of the metallized leader. A protective cover has a perimeter seal flange which mates with the perimeter seal band. A bead of a radiation-curable resin is in contact with the seal flange and with the display panel at the perimeter seal band. A source of curing radiation is directed to the bead of radiation-curable resin through the substrate and through the patterned seal zone for curing the bead so as to seal the protective cover on the organic EL display panel with an electrically insulative radiation-cured perimeter seal.
摘要翻译：公开了一种有机电致发光（EL）显示面板，其具有密封在其上的具有辐射固化的周边密封的保护盖。有机EL显示面板形成在辐射透射基板上，并且包括与至少一个阳极电极或至少一个阴极电极电接触的至少一个金属化引线。金属化引导件具有限定辐射透射孔的图案化密封区域。周边密封带形成在衬底上并延伸穿过金属化引线的图案化密封区。保护盖具有与周边密封带配合的周边密封凸缘。辐射固化树脂的珠粒与密封凸缘接触，并且显示面板在周边密封带处。固化辐射源通过基底和通过图案化的密封区域引导到可辐射固化树脂的珠粒上，用于固化珠粒，以便用有机EL显示面板上的电绝缘辐射固化周边密封。

9. 发明申请

US20080202694A1 FLUID FLOW PATH IN MICROFLUIDIC DEVICE 审中-公开
标题翻译：微流化装置中的流体流路
公开(公告)号：US20080202694A1
公开(公告)日：2008-08-28
申请号：US11678647
申请日：2007-02-26
申请人： Jeffrey P. Serbicki , Mario J. Ciminelli , Randy J. Kennard
发明人： Jeffrey P. Serbicki , Mario J. Ciminelli , Randy J. Kennard
IPC分类号： B41J2/00
CPC分类号： B41J2/16 , B41J2/02 , B41J2/1623 , B41J2202/03 , B41J2202/22 , Y10T156/17
摘要： A fluid flow path, a microfluidic device including the fluid flow path, and methods of forming the same are described. The fluid flow path can include an inlet and at least one outlet, and is defined by a first substrate and a second substrate, each having one or more fluid via extending therethrough, and an adhesive sealant between the first substrate and the second substrate, wherein the adhesive sealant surrounds at least one via of each substrate such that fluid flows through the vias and an area bounded by the adhesive sealant between the substrates. The adhesive sealant can be a bismaleimide-containing compound.
摘要翻译：描述了流体流动路径，包括流体流动路径的微流体装置及其形成方法。流体流路可以包括入口和至少一个出口，并且由第一基底和第二基底限定，第一基底和第二基底各自具有一个或多个通过其延伸的流体通道，以及在第一基底和第二基底之间的粘合密封剂，其中粘合剂密封剂围绕每个基底的至少一个通孔，使得流体流过通孔和由基底之间的粘合剂密封剂界定的区域。粘合剂密封剂可以是含双马来酰亚胺的化合物。

10. 发明授权

US07135352B2 Method of fabricating a cover plate bonded over an encapsulated OLEDs 有权
标题翻译：制造封装在封装的OLED上的盖板的方法
公开(公告)号：US07135352B2
公开(公告)日：2006-11-14
申请号：US10787513
申请日：2004-02-26
申请人： Joseph E. Yokajty , Jeffrey P. Serbicki , Steven A. Van Slyke
发明人： Joseph E. Yokajty , Jeffrey P. Serbicki , Steven A. Van Slyke
IPC分类号： H01L21/00 , H01L29/16
CPC分类号： H01L51/5246 , H01L51/524 , H01L2251/5315 , H01L2251/566
摘要： A method of bonding a common cover plate over a plurality of OLED devices formed on a device substrate includes providing an unpatterned or a patterned layer of a pressure-sensitive adhesive (PSA) material over a surface of the cover plate; bonding the cover plate over the OLED devices; and singulating individual OLED devices having a bonded cover plate and permitting electrical access to electrical interconnects associated with each OLED device for attaching electrical leads thereto.
摘要翻译：将公共盖板粘合在形成在器件基板上的多个OLED器件上的方法包括在盖板的表面上提供未图案化的或压敏粘合剂（PSA）材料的图案化层; 将盖板结合在OLED器件上; 以及分离具有接合的盖板并且允许电连接到与每个OLED器件相关联的电互连件的单个OLED器件，用于将电引线附接到其上。

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