专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US5972811A Polybutadiene and polyisoprene thermosetting compositions and method of manufacture thereof 失效
标题翻译：聚丁二烯和聚异戊二烯热固性组合物及其制备方法
公开(公告)号：US5972811A
公开(公告)日：1999-10-26
申请号：US90789
申请日：1998-06-04
申请人： Michael E. St. Lawrence , Doris I. Hand , Vincent R. Landi , Robert H. Walker , Samuel Gazit , Raymond R. Miskiavitch
发明人： Michael E. St. Lawrence , Doris I. Hand , Vincent R. Landi , Robert H. Walker , Samuel Gazit , Raymond R. Miskiavitch
IPC分类号： C08J5/08 , C08J5/10 , C08J5/24 , C08K3/00 , C08K3/10 , C08K3/22 , C08K3/24 , C08K3/34 , C08K3/38 , C08K3/40 , C08K5/00 , C08K5/02 , C08K5/06 , C08K5/3417 , C08K7/00 , C08K7/02 , C08K7/14 , C08K7/16 , C08K7/20 , C08L9/00 , C08L21/00 , C08L27/18 , C08L47/00 , C08L53/00 , C08L53/02 , C08L77/10 , H01B3/30 , H05K1/02 , H05K1/03 , H05K1/16 , B32B7/00
CPC分类号： C08J5/24 , C08K3/22 , C08K3/34 , C08K3/40 , C08K5/0066 , C08K7/14 , C08L9/00 , H05K1/032 , H05K1/0366 , H05K1/0373 , C08J2309/00 , C08L15/00 , C08L23/04 , C08L53/00 , C08L7/00 , C08L9/02 , C08L9/06 , H05K1/0203 , H05K1/162 , H05K2201/012 , H05K2201/0133 , H05K2201/0158 , H05K2201/0209 , H05K2201/0212 , H05K2201/0251 , H05K2201/0278 , H05K2201/029 , H05K2201/0293 , Y10T442/2934 , Y10T442/2992 , Y10T442/3423 , Y10T442/3431 , Y10T442/3455
摘要： An electrical substrate material is presented comprising a thermosetting matrix of polybutadiene or polyisoprene and a co-curable second resin distinct from the first resin. A peroxide cure initiator and/or crosslinking agent may optionally be added. The presence of a very high surface area particulate filler, preferably fumed silica, is also preferred, in that its presence results in a prepreg which has very little tackiness and can therefore be easily handled by operators. This low tackiness feature allows for the use of conventional automated layup processing, including foil cladding, using one or more known roll laminators. While the prepreg of this invention is tack-free enough to be handled relatively easily by hand, it is also tacky enough to be tacked to itself using a roll laminator (e.g., nip roller) at room temperature. The composition of this invention is particularly well suited for making electrical circuit substrates for microwave and digital circuits, typically in the form of the thermosetting composition being laminated onto one or both opposed surfaces to a metal conductive foil such as copper.
摘要翻译：提供了一种电气基材材料，其包含聚丁二烯或聚异戊二烯的热固性基质和不同于第一树脂的可共固化的第二树脂。可以任选地加入过氧化物固化引发剂和/或交联剂。存在非常高的表面积的颗粒填料，优选热解法二氧化硅也是优选的，因为其存在导致预浸料，其具有非常小的粘性，因此可以容易地由操作者处理。这种低粘性特征允许使用一种或多种已知的辊式层压机来使用常规的自动铺层处理，包括箔包层。虽然本发明的预浸料无粘性足以用手相对容易地处理，但是它也是粘性足以在室温下使用辊式层压机（例如夹辊）粘合到其自身上。本发明的组合物特别适用于制造用于微波和数字电路的电路基板，通常将热固性组合物的形式层压在诸如铜的金属导电箔的一个或两个相对的表面上。

2. 发明授权

US5571609A Polybutadiene and polyisoprene based thermosetting compositions and method of manufacture thereof 失效
标题翻译：聚丁二烯和聚异戊二烯基热固性组合物及其制备方法
公开(公告)号：US5571609A
公开(公告)日：1996-11-05
申请号：US322890
申请日：1994-10-13
申请人： Michael E. St. Lawrence , Vincent R. Landi , Doris I. Hand , Robert H. Walker , Samuel Gazit , Raymond R. Miskiavitch
发明人： Michael E. St. Lawrence , Vincent R. Landi , Doris I. Hand , Robert H. Walker , Samuel Gazit , Raymond R. Miskiavitch
IPC分类号： C08J5/24 , C08K3/00 , C08K3/22 , C08K3/34 , C08K3/40 , C08K5/00 , C08K5/02 , C08K7/00 , C08K7/14 , C08L9/00 , C08L21/00 , C08L53/00 , C08L53/02 , H05K1/02 , H05K1/03 , H05K1/16 , B32B7/00
CPC分类号： C08J5/24 , C08K3/22 , C08K3/34 , C08K3/40 , C08K5/0066 , C08K7/14 , C08L9/00 , H05K1/032 , H05K1/0366 , H05K1/0373 , C08J2309/00 , C08L15/00 , C08L23/04 , C08L53/00 , C08L7/00 , C08L9/02 , C08L9/06 , H05K1/0203 , H05K1/162 , H05K2201/012 , H05K2201/0133 , H05K2201/0158 , H05K2201/0209 , H05K2201/0212 , H05K2201/0251 , H05K2201/0278 , H05K2201/029 , H05K2201/0293 , Y10T442/3431 , Y10T442/3569
摘要： An electrical substrate material is presented which comprises a thermosetting matrix which includes a polybutadiene or polyisoprene resin and an unsaturated butadiene or isoprene containing polymer in an amount of 25 to 50 vol. %; a woven glass fabric in an amount of 10 to 40 vol. %; a particulate, preferably ceramic filler in an amount of from 5 to 60 vol. %; a flame retardant and a peroxide cure initiator. A preferred composition has 18% woven glass, 41% particulate filler and 30% thermosetting matrix. The foregoing component ratios and particularly the relatively high range of particulate filler is an important feature of this invention in that this filled composite material leads to a prepreg which has very little tackiness and can therefore be easily handled by operators. This low tackiness feature allows for the use of conventional automated layup processing, including foil cladding, using one or more known roll laminators. While the prepreg of this invention is tack-free enough to be handled relatively easily by hand, it is also tacky enough to be tacked to itself using a roll laminator (e.g., nip roller) at room temperature. In addition, another important feature of this invention is the low amount of glass fabric filler relative to the higher range of particulate filler which leads to improved (lower) CTE in the Z axis or thickness direction, improved electrical performance (e.g., dissipation factor), lower cost and the ability to tailor dielectric constant through appropriate selection of particulate fillers.
摘要翻译：提供了一种电气基材材料，其包括热固性基质，其包含聚丁二烯或聚异戊二烯树脂和含量为25至50体积％的不饱和丁二烯或含异戊二烯的聚合物。％; 10〜40体积％的编织玻璃织物。％; 粒度为5至60体积％的陶瓷填料。％; 阻燃剂和过氧化物固化引发剂。优选的组合物具有18％的玻璃织物，41％的颗粒填料和30％的热固性基质。上述组分比，特别是颗粒填料的相对高范围是本发明的重要特征，因为该填充的复合材料导致具有非常小的粘性的预浸料，因此可以容易地由操作者处理。这种低粘性特征允许使用一种或多种已知的辊式层压机来使用常规的自动铺层处理，包括箔包层。虽然本发明的预浸料无粘性足以用手相对容易地处理，但是它也是粘性足以在室温下使用辊式层压机（例如夹辊）粘合到其自身上。另外，本发明的另一个重要特征是玻璃织物填料相对于较高范围的颗粒填料的含量较低，这导致在Z轴或厚度方向上改进（降低）CTE，改善了电性能（例如耗散因子）更低的成本和通过适当选择颗粒填料来调整介电常数的能力。

3. 发明授权

US6071836A Polybutadiene and polyisoprene thermosetting compositions and method of manufacture thereof 有权
标题翻译：聚丁二烯和聚异戊二烯热固性组合物及其制造方法
公开(公告)号：US6071836A
公开(公告)日：2000-06-06
申请号：US176788
申请日：1998-10-22
申请人： Michael E. St. Lawrence , Doris I. Hand
发明人： Michael E. St. Lawrence , Doris I. Hand
IPC分类号： C08J5/24 , H05K1/02 , H05K1/03 , H05K1/16 , B32B7/00
CPC分类号： C08J5/24 , H05K1/032 , H05K1/0373 , C08J2309/00 , H05K1/0203 , H05K1/0366 , H05K1/162 , H05K2201/012 , H05K2201/0133 , H05K2201/0158 , H05K2201/0209 , H05K2201/0212 , H05K2201/0251 , H05K2201/0278 , H05K2201/029 , H05K2201/0293
摘要： An electrical substrate material is presented comprising a thermosetting matrix of polybutadiene or polyisoprene in an amount of about 15 to about 50 volume %; a fabric reinforcement in an amount of 0 to about 40 volume %; a particulate filler, preferably ceramic, in an amount of from 0 to about 60 volume %; microballoons in an amount from 0 to about 60 volume %; and optionally a flame retardant. A peroxide cure initiator and/or crosslinking agent may optionally be added. The presence of a very high surface area particulate filler, preferably fumed silica, is also preferred, in that its presence results in a prepreg which has very little tackiness and can therefore be easily handled by operators. This low tackiness feature allows for the use of conventional automated layup processing, including foil cladding, using one or more known roll laminators. While the prepreg of this invention is tack-free enough to be handled relatively easily by hand, it is also tacky enough to be tacked to itself using a roll laminator (e.g., nip roller) at room temperature. The composition of this invention is particularly well suited for making electrical circuit substrates for microwave and digital circuits, typically in the form of the thermosetting composition being laminated onto one or both opposed surfaces to a metal conductive foil such as copper.
摘要翻译：呈现的电气基材材料包含约15至约50体积％的量的聚丁二烯或聚异戊二烯的热固性基质; 织物增强物的量为0至约40体积％; 量为0至约60体积％的颗粒填料，优选陶瓷; 量为0至约60体积％的微球; 和任选的阻燃剂。可以任选加入过氧化物固化引发剂和/或交联剂。存在非常高的表面积的颗粒填料，优选热解法二氧化硅也是优选的，因为其存在导致预浸料，其具有非常小的粘性，因此可以容易地由操作者处理。这种低粘性特征允许使用一种或多种已知的辊式层压机来使用常规的自动铺层处理，包括箔包层。虽然本发明的预浸料无粘性足以用手相对容易地处理，但是它也是粘性足以在室温下使用辊式层压机（例如夹辊）粘合到其自身上。本发明的组合物特别适用于制造用于微波和数字电路的电路基板，通常将热固性组合物的形式层压在诸如铜的金属导电箔的一个或两个相对的表面上。

4. 发明授权

US5858887A Single resin polybutadiene and polyisoprene thermosetting compositions and method of manufacture thereof 失效
标题翻译：单树脂聚丁二烯和聚异戊二烯热固性组合物及其制造方法
公开(公告)号：US5858887A
公开(公告)日：1999-01-12
申请号：US690929
申请日：1996-08-01
申请人： Michael E. St. Lawrence , Doris I. Hand
发明人： Michael E. St. Lawrence , Doris I. Hand
IPC分类号： C08J5/08 , C08J5/10 , C08J5/24 , C08K3/00 , C08K3/10 , C08K3/22 , C08K3/24 , C08K3/34 , C08K3/38 , C08K3/40 , C08K5/00 , C08K5/02 , C08K5/06 , C08K5/3417 , C08K7/00 , C08K7/02 , C08K7/14 , C08K7/16 , C08K7/20 , C08L9/00 , C08L21/00 , C08L27/18 , C08L47/00 , C08L53/00 , C08L53/02 , C08L77/10 , H01B3/30 , H05K1/02 , H05K1/03 , H05K1/16 , B32B7/00
CPC分类号： C08J5/24 , C08K3/22 , C08K3/34 , C08K3/40 , C08K5/0066 , C08K7/14 , C08L9/00 , H05K1/032 , H05K1/0366 , H05K1/0373 , C08J2309/00 , C08L15/00 , C08L23/04 , C08L53/00 , C08L7/00 , C08L9/02 , C08L9/06 , H05K1/0203 , H05K1/162 , H05K2201/012 , H05K2201/0133 , H05K2201/0158 , H05K2201/0209 , H05K2201/0212 , H05K2201/0251 , H05K2201/0278 , H05K2201/029 , H05K2201/0293 , Y10T442/2934 , Y10T442/2992 , Y10T442/3423 , Y10T442/3431 , Y10T442/3455
摘要： An electrical substrate material is presented comprising a thermosetting matrix of polybutadiene or polyisoprene in an amount of 25 to 50 volume %; a woven glass fabric in an amount of 10 to 40 volume %; a particulate, preferably ceramic filler, in an amount of from 5 to 60 volume %; and a flame retardant. Importantly, the composition comprises only a single resin, i.e., polybutadiene or polyisoprene. A peroxide cure initiator and/or crosslinking agent may optionally be added. The presence of a very high surface area particulate filler, preferably fumed silica, is also preferred, in that its presence results in a prepreg which has very little tackiness and can therefore be easily handled by operators. This low tackiness feature allows for the use of conventional automated layup processing, including foil cladding, using one or more known roll laminators. While the prepreg of this invention is tack-free enough to be handled relatively easily by hand, it is also tacky enough to be tacked to itself using a roll laminator (e.g., nip roller) at room temperature. The composition of this invention is particularly well suited for making electrical circuit substrates for microwave and digital circuits, typically in the form of the thermosetting composition being laminated onto one or both opposed surfaces to a metal conductive foil such as copper.
摘要翻译：提供的电气基材材料包含25至50体积％的聚丁二烯或聚异戊二烯的热固性基质; 10〜40体积％的编织玻璃织物; 一种颗粒状，优选陶瓷填料，其量为5-60体积％; 和阻燃剂。重要的是，组合物仅包含单一树脂，即聚丁二烯或聚异戊二烯。可以任选加入过氧化物固化引发剂和/或交联剂。存在非常高的表面积的颗粒填料，优选热解法二氧化硅也是优选的，因为其存在导致预浸料，其具有非常小的粘性，因此可以容易地由操作者处理。这种低粘性特征允许使用一种或多种已知的辊式层压机来使用常规的自动铺层处理，包括箔包层。虽然本发明的预浸料无粘性足以用手相对容易地处理，但是它也是粘性足以在室温下使用辊式层压机（例如夹辊）粘合到其自身上。本发明的组合物特别适用于制造用于微波和数字电路的电路基板，通常将热固性组合物的形式层压在诸如铜的金属导电箔的一个或两个相对的表面上。

5. 发明授权

US07549220B2 Method for making a multilayer circuit 有权
标题翻译：制造多层电路的方法
公开(公告)号：US07549220B2
公开(公告)日：2009-06-23
申请号：US10740382
申请日：2003-12-17
申请人： E. Clifford Roseen, Jr. , Scott D. Kennedy , Doris I. Hand , Michael S. White , Allen F. Horn, III
发明人： E. Clifford Roseen, Jr. , Scott D. Kennedy , Doris I. Hand , Michael S. White , Allen F. Horn, III
IPC分类号： H05K3/36
CPC分类号： H05K3/4626 , H05K3/0011 , H05K2201/0141 , H05K2203/1105 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155
摘要： A method for the manufacture of a multilayer circuit comprising a liquid crystalline polymer layer, the method comprising treating the multilayer circuit with an amount of heat effective to raise the crystalline to nematic melting point, as defined by the peak endotherm above the glass transition temperature in a differential scanning calorimeter measurement, of the liquid crystalline polymer layer by at least about 10° C.
摘要翻译：一种用于制造包括液晶聚合物层的多层电路的方法，所述方法包括以高于玻璃化转变温度以上的峰值吸热量定义的热量有效地处理所述多层电路，从而将所述结晶向向列熔点升高差示扫描量热计测量液晶聚合物层至少约10℃

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式