会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 1. 发明授权
    • High reliability logic circuit for radiation environment
    • 用于辐射环境的高可靠性逻辑电路
    • US5870332A
    • 1999-02-09
    • US635794
    • 1996-04-22
    • Michael D. LaheyDebra S. HarrisHarry N. GardnerMichael J. Barry
    • Michael D. LaheyDebra S. HarrisHarry N. GardnerMichael J. Barry
    • H03K19/20G11C5/00H03K3/037G11C11/40
    • H03K3/0375G11C5/005
    • A high reliability logic circuit designed to withstand a single event upset (SEU) induced by an ion transitioning through a semiconductor structure is embodied in a memory circuit which includes a first memory cell and a second memory cell. The first and second memory cells receive a first input signal and a second input signal. The memory cells contain a logic circuit for producing a logic signal output driven by either a pullup or pulldown driver when the first and second input signals are of a desired logic state and produces a high impedance output if either input signal is not of their respective desired logic states.The memory cells also have sufficient nodal capacitance such that the output from the first or second memory cell will not be corrupted by an SEU in the logic circuit of either the first or second memory cell.The outputs of the first memory cell and second memory cell are further summed in analog fashion to produce a single output from the memory circuit. The summing of the output signals from the first and second memory cell prevents a single error in either memory cell from propagating to a next stage.
    • 设计成承受由通过半导体结构转移的离子引起的单个事件不正常(SEU)的高可靠性逻辑电路体现在包括第一存储单元和第二存储单元的存储器电路中。 第一和第二存储单元接收第一输入信号和第二输入信号。 当第一和第二输入信号是期望的逻辑状态时,存储器单元包含用于产生由上拉驱动器或下拉驱动器驱动的逻辑信号输出的逻辑电路,并且如果任一输入信号不是它们各自期望的,则产生高阻抗输出 逻辑状态。 存储单元也具有足够的节点电容,使得来自第一或第二存储单元的输出不会被第一或第二存储单元的逻辑电路中的SEU所破坏。 第一存储器单元和第二存储器单元的输出进一步以模拟方式相加以产生来自存储器电路的单个输出。 来自第一和第二存储器单元的输出信号的相加防止任一存储器单元中的单个错误传播到下一级。
    • 3. 发明授权
    • Parameter adjustment in a MOS integrated circuit
    • MOS集成电路中的参数调整
    • US06346427B1
    • 2002-02-12
    • US09376246
    • 1999-08-18
    • Harry N. GardnerDebra S. HarrisMichael D. LaheyStacia L. PattonPeter M. Pohlenz
    • Harry N. GardnerDebra S. HarrisMichael D. LaheyStacia L. PattonPeter M. Pohlenz
    • H01L2100
    • H01L22/20H01L29/0692H01L29/4238
    • A method of manufacturing an integrated circuit including adjusting a parameter of the operation of the integrated circuit, such as power dissipation, after prototype testing by changing only one mask. If prototype testing indicates that the performance specification for power dissipation, for example, is not met, the power dissipation can be adjusted by changing the size of the active areas to change the channel width of the gates of the circuit, by changing the size of the patterns of the active area masks. To decrease power dissipation, the size of the active area is decreased. Only the active mask need be changed. Preferably, the active area around the original contacts are maintained so that the positions of the contacts need not be changed. Consequently, the mask for defining the position of the contacts and the masks for defining the metallization layers need not be changed. To increase power dissipation, the size of the active areas is increased. The values of other parameters may be changed, as well.
    • 一种制造集成电路的方法,包括通过仅改变一个掩模,在原型测试之后调整诸如功率消耗的集成电路的操作参数。 如果原型测试表明功率耗散的性能规格不符合要求,可以通过改变有源区域的尺寸来改变功率损耗,从而改变电路的栅极的通道宽度, 活动区域掩模的图案。 为了降低功耗,有效区域的尺寸减小。 只有主动面罩需要改变。 优选地,保持原始触点周围的有源区域,使得触点的位置不需要改变。 因此,用于限定触点的位置的掩模和用于限定金属化层的掩模不需要改变。 为了增加功耗,有效区域的大小增加。 其他参数的值也可以改变。