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1. 发明申请

US20120115236A1 Device and Method For Indirect Electronic Condition Control in Biomolecule Detection Platforms 有权
标题翻译：生物分子检测平台间接电子状态控制的装置与方法
公开(公告)号：US20120115236A1
公开(公告)日：2012-05-10
申请号：US13348727
申请日：2012-01-12
申请人： Michael Chen , Vincent Chen , Sam Kavusi , Christoph Lang
发明人： Michael Chen , Vincent Chen , Sam Kavusi , Christoph Lang
IPC分类号： G01N33/50
CPC分类号： G01N33/54393 , C08F20/56 , G01N33/5306 , Y10T436/11 , Y10T436/115831
摘要： A system and method of indirectly modifying an environmental condition at a test site in one embodiment includes providing a test site on a substrate, providing a hydrogel composition loaded with a chemical factor at the test site, providing an actuator configured to activate the hydrogel composition to release a chemical factor at the test site, controlling the actuator to activate the hydrogel composition to release a chemical factor at the test site, and modifying the local chemical environment at the test site with the chemical factor.
摘要翻译：在一个实施方案中间接改变测试部位的环境条件的系统和方法包括在基底上提供测试部位，在测试部位提供装载有化学因子的水凝胶组合物，提供构造成将水凝胶组合物活化的致动器在试验现场释放化学因子，控制致动器激活水凝胶组合物以释放在试验部位的化学因子，并用化学因子改变试验部位的局部化学环境。

2. 发明授权

US09063138B2 Device and method for indirect electronic condition control in biomolecule detection platforms 有权
标题翻译：生物分子检测平台间接电子状态控制的装置和方法
公开(公告)号：US09063138B2
公开(公告)日：2015-06-23
申请号：US13348727
申请日：2012-01-12
申请人： Michael Chen , Vincent Chen , Sam Kavusi , Christoph Lang
发明人： Michael Chen , Vincent Chen , Sam Kavusi , Christoph Lang
IPC分类号： G01N33/53 , G01N33/543 , C08F20/56
CPC分类号： G01N33/54393 , C08F20/56 , G01N33/5306 , Y10T436/11 , Y10T436/115831
摘要： A system and method of indirectly modifying an environmental condition at a test site in one embodiment includes providing a test site on a substrate, providing a hydrogel composition loaded with a chemical factor at the test site, providing an actuator configured to activate the hydrogel composition to release a chemical factor at the test site, controlling the actuator to activate the hydrogel composition to release a chemical factor at the test site, and modifying the local chemical environment at the test site with the chemical factor.
摘要翻译：在一个实施方案中间接改变测试部位的环境条件的系统和方法包括在基底上提供测试部位，在测试部位提供装载有化学因子的水凝胶组合物，提供构造成将水凝胶组合物活化的致动器在试验现场释放化学因子，控制致动器激活水凝胶组合物以释放在试验部位的化学因子，并用化学因子改变试验部位的局部化学环境。

3. 发明申请

US20190176014A1 Protective Glove for Athletes 审中-公开
公开(公告)号：US20190176014A1
公开(公告)日：2019-06-13
申请号：US15894490
申请日：2018-02-12
申请人： Vincent Chen
发明人： Vincent Chen , Andy Lung
IPC分类号： A63B71/14 , A41D19/015 , A41D31/00
摘要： A protective glove for athletes includes: a glove body including a palm portion and a plurality of finger portions, wherein the glove body has an inner side defined as a palm side and an outer side opposite to the inner side defined as a back side; and at least one protective layer structure having one side surface disposed on the inner side of the glove body and the other side surface provided with an anti-slip buffer layer, wherein the protective layer structure is adhesively disposed on the palm portion and the plurality of finger portions of the glove body in such a manner to define the palm side as a buffer protective surface. The protective layer structure of the protective glove can entirely enclose the palm portions and the finger portions and thus can protect the fingers, but will not affect the moving flexibility and the touching sensitivity of the fingers.

4. 发明授权

US09060645B2 Beverage brewing device and method 有权
标题翻译：饮料酿造装置及方法
公开(公告)号：US09060645B2
公开(公告)日：2015-06-23
申请号：US13006834
申请日：2011-01-14
申请人： Vincent Chen , Curt Morgan
发明人： Vincent Chen , Curt Morgan
IPC分类号： A47J31/38
CPC分类号： A47J31/38
摘要： This invention is a manually operated beverage brewer that is powered by a user articulating or turning a lever a multiple of times. The lever forces a small piston into a cylinder, which in turn pressurizing a hot liquid poured into the machine. The pressurized liquid flows through a pack of coffee grounds and out of the machine after the user has generated a minimum pressure to overcome an under-pressure valve. The user continues to articulate or turn the lever until the desired amount of coffee exits the machine.
摘要翻译：本发明是一种手动操作的饮料冲泡机，其由使用者将操作杆多次铰接或转动的用户提供动力。杠杆将一个小活塞推入一个气缸，这反过来加压了流入机器的热液体。加压液体在用户已经产生最小压力以克服低压阀之后流过一包咖啡渣并离开机器。用户继续铰接或转动杠杆，直到所需量的咖啡离开机器。

5. 发明申请

US20090324716A1 Coated Particles Containing Pharmaceutically Active Agents 有权
标题翻译：包含药物活性剂的包衣颗粒
公开(公告)号：US20090324716A1
公开(公告)日：2009-12-31
申请号：US12490465
申请日：2009-06-24
申请人： Robert Shen , Vincent Chen , Del-Yang Lee
发明人： Robert Shen , Vincent Chen , Del-Yang Lee
IPC分类号： A61K9/26 , A61K9/16 , A61K47/32
CPC分类号： A61K9/2081 , A61K9/5078
摘要： The present invention features a tablet including particles containing a pharmaceutically active agent, wherein the particles are coated with (a) a first film layer containing a modified release polymer; and (b) a second film layer containing (i) a first polymer, wherein the first polymer is a polymer of ethyl acrylate and methyl methacrylate and (ii) a second polymer, wherein the second polymer is a polymer of methyl acrylate, methyl methacrylate and methacrylic acid.
摘要翻译：本发明的特征在于包含含有药物活性剂的颗粒的片剂，其中所述颗粒涂覆有（a）含有改性释放聚合物的第一膜层; 和（b）含有（i）第一聚合物的第二膜层，其中第一聚合物是丙烯酸乙酯和甲基丙烯酸甲酯的聚合物和（ii）第二聚合物，其中第二聚合物是丙烯酸甲酯，甲基丙烯酸甲酯和甲基丙烯酸。

6. 发明申请

US20090179664A1 Method and Apparatus for Controlling Leakage in a Circuit 审中-公开
标题翻译：控制电路泄漏的方法和装置
公开(公告)号：US20090179664A1
公开(公告)日：2009-07-16
申请号：US11972215
申请日：2008-01-10
申请人： Janet Wang , Vincent Chen , Vahid Manian
发明人： Janet Wang , Vincent Chen , Vahid Manian
IPC分类号： H03K19/003
CPC分类号： H03K19/0016
摘要： A system includes an apparatus for reducing leakage in a circuit. The apparatus includes one or more active devices connected to form a main circuit portion and at least one other active device coupled between the main circuit portion and one from the group including ground and Vdd, the other active device being configured to control leakage in the main circuit portion. A gate length, a gate oxide, and a threshold voltage of the other active device are optimized for low leakage.
摘要翻译：一种系统包括用于减少电路中的泄漏的装置。该装置包括连接以形成主电路部分的一个或多个有源装置和耦合在主电路部分之间的至少一个其它有源装置和来自包括地线和Vdd的组中的至少一个有源装置，另一个有源装置被配置为控制主电路部分中的泄漏电路部分。针对低泄漏优化了另一个有源器件的栅极长度，栅极氧化物和阈值电压。

7. 发明申请

US20080222596A1 Method of shrinking semiconductor mask features for process improvement 失效
标题翻译：收缩半导体掩模特征的方法可用于工艺改进
公开(公告)号：US20080222596A1
公开(公告)日：2008-09-11
申请号：US12073685
申请日：2008-03-07
申请人： Vincent Chen , Vahid Manian
发明人： Vincent Chen , Vahid Manian
IPC分类号： G06F17/50
CPC分类号： G03F1/00
摘要： Provided is a method to design an integrated circuit. The method reduces a time delay between introduction of a new lithography process and a start of production. A first semiconductor mask is designed at a first process feature size. The first process feature size can be based on an anticipated process feature size of the new lithography process. A second semiconductor mask is created by enlarging the first semiconductor mask to a second process feature size for which production is available. Thus, the second process feature size is larger than the first process feature size. An integrated circuit (IC) is fabricated with the second semiconductor mask. After the new semiconductor process has been developed and is available for production, another IC is fabricated with the first semiconductor mask.
摘要翻译：提供一种设计集成电路的方法。该方法减少了引入新的光刻工艺和生产开始之间的时间延迟。以第一工艺特征尺寸设计第一半导体掩模。第一工艺特征尺寸可以基于新光刻工艺的预期工艺特征尺寸。通过将第一半导体掩模放大到可用于生产的第二工艺特征尺寸来创建第二半导体掩模。因此，第二处理特征尺寸大于第一处理特征尺寸。利用第二半导体掩模制造集成电路（IC）。在新的半导体工艺已经开发并且可用于生产之后，用第一半导体掩模制造另一个IC。

8. 发明申请

US20070102815A1 Bumping process with self-aligned A1-cap and the elimination of 2nd passivation layer 审中-公开
标题翻译：具有自对准A1盖的冲击过程和消除第二钝化层
公开(公告)号：US20070102815A1
公开(公告)日：2007-05-10
申请号：US11269455
申请日：2005-11-08
申请人： Matthew Kaufmann , Ray Huang , Vincent Chen
发明人： Matthew Kaufmann , Ray Huang , Vincent Chen
IPC分类号： H01L23/48 , H01L21/44
CPC分类号： H01L24/13 , H01L24/11 , H01L2224/05001 , H01L2224/05027 , H01L2224/05124 , H01L2224/05147 , H01L2224/05572 , H01L2224/056 , H01L2224/1134 , H01L2224/13099 , H01L2224/131 , H01L2924/0001 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01075 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/30105 , H01L2924/00014
摘要： The present invention provides a simplified process end flow for a flip chip device. This process flow, beginning with the deposition of a final metal layer for the IC, also includes the deposition of the UBM layer on top of the metal layer. The UBM layer and IC final metal layer are simultaneously patterned. This ensures alignment between the IC final metal layer and the UBM layer patterning and reduces processing steps. Such a process flow may eliminate the need for a second passivation deposition and patterning and the process of individually patterning the final metal layer.
摘要翻译：本发明提供了一种用于倒装芯片器件的简化的工艺流程。从IC的最终金属层的沉积开始，该工艺流程还包括在金属层的顶部沉积UBM层。 UBM层和IC最终金属层同时构图。这确保IC最终金属层和UBM层图案之间的对准并且减少加工步骤。这种工艺流程可以消除对第二钝化沉积和图案化的需要以及对最终金属层进行单独构图的工艺。

9. 发明授权

US5281166A Electrical connector with improved connector pin support and improved mounting to a PCB 失效
标题翻译：电连接器具有改进的连接器插脚支撑和改进的安装到PCB
公开(公告)号：US5281166A
公开(公告)日：1994-01-25
申请号：US783189
申请日：1991-10-28
申请人： Nobbert Yu , Yuan C. Lin , Vincent Chen
发明人： Nobbert Yu , Yuan C. Lin , Vincent Chen
IPC分类号： H01R12/70 , H01R12/71 , H01R13/00
CPC分类号： H01R12/7029 , H01R12/7047 , H01R12/707 , H01R12/714
摘要： A "through-hole mounting" boardlock fixture is adapted to secure an electrical connector to a Printed Circuit Board (PCB) employing a Surface Mounting Technology (SMT) procedure. In one aspect, the boardlock fixture comprises a rim defining an opening therethrough and a solder block dimensioned to be insertable within the opening. Furthermore, a plurality of fingers flexibly mounted to the rim extend, generally, downward therefrom. Each respective finger is dimensioned to support the boardlock when inserted in the opening. SMT is applied to melt the solder block to mount the connector to the PCB. In another aspect of the present invention, an electrical connector including a housing is mounted to a PCB. Further, the housing defines a row of apertures each of which a respective pin contact is positioned therein. Each pin contact includes a downward extension extending along a housing back region which terminates at a corresponding PCB circuit. A spacer, including an engagement region, engages the back region of the housing which collectively define a plurality of extension supports that support the respective downward extensions. A method for mounting an electrical component to a PCB comprises the steps of securing a through-hole mounting fixture to the component and inserting the fixture a mounting aperture defined by the PCB. The next step includes supporting a solder block to the fixture and applying a SMT reflow soldering procedure to melt the solder block and solder the fixture to the PCB.
摘要翻译： “通孔安装”板锁固定装置适用于使用表面贴装技术（SMT）程序将电连接器固定到印刷电路板（PCB）上。在一个方面，板锁固定件包括限定穿过其中的开口的边缘和尺寸设计成可插入开口内的焊接块。此外，柔性地安装到边缘的多个手指通常从其延伸。每个相应的手指的尺寸被设计成当插入开口时支撑板锁。应用SMT来熔化焊料块以将连接器安装到PCB上。在本发明的另一方面，包括壳体的电连接器安装在PCB上。此外，壳体限定一排孔，每个孔中相应的针接触件位于其中。每个销触点包括沿着壳体背部区域延伸的向下延伸，其终止于相应的PCB电路。包括接合区域的间隔件接合壳体的后部区域，其共同限定支撑相应的向下延伸部的多个延伸支撑件。将电气部件安装到PCB的方法包括以下步骤：将通孔安装固定件固定到部件上，并将固定装置插入由PCB限定的安装孔。下一步包括将焊料块支撑到夹具上并应用SMT回流焊接工艺来熔化焊料块并将固定装置焊接到PCB上。

10. 发明申请

US20220174441A1 LOUDSPEAKER HAVING WIRE DAMPER WITH LOCALLY ADJUSTABLE ELASTICITY AND METHOD FOR MANUFACTURING THE SAME 有权
公开(公告)号：US20220174441A1
公开(公告)日：2022-06-02
申请号：US17107960
申请日：2020-12-01
申请人： Vincent Chen
发明人： Vincent Chen
IPC分类号： H04R31/00 , D06N3/00 , D03D1/00 , H04R9/06 , H04R9/04
摘要： A method for manufacturing a loudspeaker having a wire damper with locally adjustable elasticity, including preparation, impregnating, drying, wire disposing, forming, cutting and assembling steps. Wherein, a wire damper including a main body and a wire is thermoformed on a base material. The main body includes a wave structure and a wire disposing area. The wave structure includes wave crest and trough, and inner and outer sidewalls. The wire disposing area forms a hollow portion in which the wire extends. The warp yarns at outside and inside of the wire disposing area form an elastic adjustment area. The hollow portion has smaller depths at the inner and outer sidewalls than at the wave crests and troughs. Thereby, the wire will not be damaged by thermal pressurization, and the hardness, elasticity and toughness of the combination of the wire disposing area and the wire are equal to that of other areas.

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