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    • 1. 发明授权
    • Fabrication of an optical component
    • 光学部件的制造
    • US6099389A
    • 2000-08-08
    • US166817
    • 1998-10-05
    • Michael A. NicholsDavid M. AikensDavid W. CampIan M. ThomasCraig KiikkaLynn M. SheehanMark R. Kozlowski
    • Michael A. NicholsDavid M. AikensDavid W. CampIan M. ThomasCraig KiikkaLynn M. SheehanMark R. Kozlowski
    • B24B1/00B24B9/14B24B13/00
    • B24B9/14B24B1/00B24B13/0037
    • A method for forming optical parts used in laser optical systems such as high energy lasers, high average power lasers, semiconductor capital equipment and medical devices. The optical parts will not damage during the operation of high power lasers in the ultra-violet light range. A blank is first ground using a fixed abrasive grinding method to remove the subsurface damage formed during the fabrication of the blank. The next step grinds and polishes the edges and forms bevels to reduce the amount of fused-glass contaminants in the subsequent steps. A loose abrasive grind removes the subsurface damage formed during the fixed abrasive or "blanchard" removal process. After repolishing the bevels and performing an optional fluoride etch, the surface of the blank is polished using a zirconia slurry. Any subsurface damage formed during the loose abrasive grind will be removed during this zirconia polish. A post polish etch may be performed to remove any redeposited contaminants. Another method uses a ceria polishing step to remove the subsurface damage formed during the loose abrasive grind. However, any residual ceria may interfere with the optical properties of the finished part. Therefore, the ceria and other contaminants are removed by performing either a zirconia polish after the ceria polish or a post ceria polish etch.
    • 用于形成用于诸如高能激光器,高平均功率激光器,半导体资本设备和医疗设备的激光光学系统中的光学部件的方法。 在紫外光范围内的大功率激光器的操作过程中,光学部件不会损坏。 使用固定的研磨研磨方法首先研磨坯料以去除在坯料制造期间形成的地下损伤。 下一步研磨和抛光边缘并形成斜面以减少随后步骤中熔融玻璃污染物的量。 松散的研磨研磨可消除在固定磨料或“漂白剂”去除过程中形成的地下损伤。 在重新抛光斜面并进行可选的氟化物蚀刻之后,使用氧化锆浆料对坯料的表面进行抛光。 在这种氧化锆抛光期间,在松散研磨研磨过程中形成的任何地下损伤将被去除。 可以进行后抛光蚀刻以去除任何再沉积的污染物。 另一种方法是使用二氧化铈抛光步骤来去除在磨料研磨过程中形成的地下损伤。 然而,任何残留的二氧化铈可能会干扰成品部件的光学性能。 因此,通过在二氧化铈抛光之后进行氧化锆抛光或氧化铈抛光蚀刻来除去二氧化铈和其它污染物。