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1. 发明申请

US20070152537A1 Micro electro mechanical system, semiconductor device, and manufacturing method thereof 有权
标题翻译：微机电系统，半导体器件及其制造方法
公开(公告)号：US20070152537A1
公开(公告)日：2007-07-05
申请号：US11549310
申请日：2006-10-13
申请人： Mayumi YAMAGUCHI , Konami IZUMI , Fuminori TATEISHI
发明人： Mayumi YAMAGUCHI , Konami IZUMI , Fuminori TATEISHI
IPC分类号： H01L41/00
CPC分类号： B60C23/0493 , A61B5/02444 , A61B5/681 , B60C23/04 , B60C23/0408 , B60C23/0411 , B60C23/0413 , B60C23/20 , B81C1/0023 , G01L1/16 , G01L17/00 , H01L21/02118 , H01L21/02175 , H01L21/02183 , H01L21/02186 , H01L21/02189 , H01L21/54 , H01L24/93 , H01L27/20 , H01L35/34 , H01L41/25 , H01L41/311 , H01L41/313 , H01L2924/0002 , H01L2924/12044 , H01L2924/13091 , H01L2924/14 , H01L2924/1461 , H01L2924/15788 , Y10T29/42 , H01L2924/00
摘要： The present invention provides a MEMS and a sensor having the MEMS which can be formed without a process of etching a sacrifice layer. The MEMS and the sensor having the MEMS are formed by forming an interspace using a spacer layer. In the MEMS in which an interspace is formed using a spacer layer, a process for forming a sacrifice layer and an etching process of the sacrifice layer are not required. As a result, there is no restriction on the etching time, and thus the yield can be improved.
摘要翻译：本发明提供一种具有MEMS的MEMS和传感器，该传感器可以在没有蚀刻牺牲层的工艺的情况下形成。具有MEMS的MEMS和传感器通过使用间隔层形成间隙而形成。在使用间隔层形成间隙的MEMS中，不需要用于形成牺牲层的工艺和牺牲层的蚀刻工艺。结果，蚀刻时间没有限制，可以提高成品率。

2. 发明申请

US20070093045A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：US20070093045A1
公开(公告)日：2007-04-26
申请号：US11552369
申请日：2006-10-24
申请人： Mayumi YAMAGUCHI , Konami IZUMI
发明人： Mayumi YAMAGUCHI , Konami IZUMI
IPC分类号： H01L21/3205 , H01L27/12 , H01L27/01 , H01L21/4763 , H01L31/0392
CPC分类号： H01L27/1203 , B81C1/00547 , B81C2201/0135 , H01L21/84 , H01L27/016 , H01L27/12 , H01L27/13
摘要： It is an object of the present invention to manufacture a micromachine having a plurality of structural bodies with different functions and to shorten the time required for sacrifice layer etching in a process of manufacturing the micromachine. Another object of the present invention is to prevent a structural layer from being attached to a substrate after the sacrifice layer etching. In other words, an object of the present invention is to provide an inexpensive and high-value-added micromachine by improving throughput and yield. The sacrifice layer etching is conducted in multiple steps. In the multiple steps of the sacrifice layer etching, a part of the sacrifice layer that does not overlap with the structural layer is removed by the earlier sacrifice layer etching and a part of the sacrifice layer that is under the structural layer is removed by the later sacrifice layer etching.
摘要翻译：本发明的目的是制造具有多个具有不同功能的结构体的微型机械，并且缩短在制造微机械过程中牺牲层蚀刻所需的时间。本发明的另一个目的是在牺牲层蚀刻之后防止结构层附着到基底上。换句话说，本发明的目的是通过提高生产量和产量来提供廉价和高附加值的微机械。牺牲层蚀刻以多个步骤进行。在牺牲层蚀刻的多个步骤中，通过较早的牺牲层蚀刻去除与结构层不重叠的牺牲层的一部分，并且在结构层之下的部分牺牲层被后面的部分去除牺牲层蚀刻。

3. 发明申请

US20100244250A1 SEMICONDUCTOR INTEGRATED CIRCUIT, MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR DEVICE USING SEMICONDUCTOR INTEGRATED CIRCUIT 有权
标题翻译：半导体集成电路及其制造方法以及使用半导体集成电路的半导体器件
公开(公告)号：US20100244250A1
公开(公告)日：2010-09-30
申请号：US12797192
申请日：2010-06-09
申请人： Mayumi YAMAGUCHI , Konami IZUMI
发明人： Mayumi YAMAGUCHI , Konami IZUMI
IPC分类号： H01L23/52 , H01L23/538
CPC分类号： H01L27/1266 , H01L21/6835 , H01L21/8221 , H01L21/84 , H01L23/4985 , H01L23/49855 , H01L23/5389 , H01L25/105 , H01L27/0688 , H01L27/12 , H01L27/124 , H01L2224/24145 , H01L2224/76155 , H01L2924/01019 , H01L2924/07811 , H01L2924/12032 , H01L2924/12044 , H01L2924/1305 , H01L2924/13091 , H01L2924/00
摘要： A step of forming a through hole in a semiconductor substrate, or a step of polishing the semiconductor substrate from its back surface requires a very long time and causes decrease of productivity. In addition, when semiconductor substrates are stacked, a semiconductor integrated circuit which is formed of the stack is thick and has poor mechanical flexibility. A release layer is formed over each of a plurality of substrates, layers each having a semiconductor element and an opening for forming a through wiring are formed over each of the release layers. Then, layers each having the semiconductor element are peeled off from the substrates, and then overlapped and stacked, a conductive layer is formed in the opening, and the through wiring is formed; thus, a semiconductor integrated circuit is formed.
摘要翻译：在半导体衬底中形成通孔的步骤或从其背面抛光半导体衬底的步骤需要很长时间并且导致生产率降低。此外，当堆叠半导体衬底时，由堆叠形成的半导体集成电路厚并且机械灵活性差。在多个基板的每一个上形成剥离层，每个剥离层上形成有各自具有半导体元件的层和用于形成贯通布线的开口。然后，将具有半导体元件的层从基板剥离，然后重叠堆叠，在开口中形成导电层，形成贯通布线; 从而形成半导体集成电路。

4. 发明申请

US20070143048A1 TEST METHOD OF MICROSCTRUCTURE BODY AND MICROMACHINE 有权
标题翻译：微结构体和微生物测试方法
公开(公告)号：US20070143048A1
公开(公告)日：2007-06-21
申请号：US11565135
申请日：2006-11-30
申请人： Mayumi YAMAGUCHI , Konami IZUMI , Fuminori TATEISHI
发明人： Mayumi YAMAGUCHI , Konami IZUMI , Fuminori TATEISHI
IPC分类号： G01R19/00
CPC分类号： B81C99/004 , G01R31/3025
摘要： It is an object to provide a test method of a process, an electric characteristic, and a mechanical characteristic of a structure body in a micromachine without contact. A structure body including a first conductive layer, a second conductive layer provided in parallel to the first conductive layer, and a sacrifice layer or a space provided between the first conductive layer and the second conductive layer is provided; an antenna connected to the structure body is provided; electric power is supplied to the structure body wirelessly through the antenna; and an electromagnetic wave generated from the antenna is detected as a characteristic of the structure body.
摘要翻译：本发明的目的是提供一种微机械结构体的过程，电特性和机械特性的测试方法。提供一种结构体，包括第一导电层，与第一导电层平行设置的第二导电层，以及设置在第一导电层和第二导电层之间的牺牲层或空间。提供连接到结构体的天线; 电力通过天线无线地提供给结构体; 并且从天线产生的电磁波被检测为结构体的特征。

5. 发明申请

US20070111365A1 MANUFACTURING METHOD OF MICROSTRUCTURE AND MICROELECTROMECHANICAL SYSTEM 有权
标题翻译：微结构和微电子系统的制造方法
公开(公告)号：US20070111365A1
公开(公告)日：2007-05-17
申请号：US11557353
申请日：2006-11-07
申请人： Fuminori TATEISHI , Konami IZUMI , Mayumi YAMAGUCHI
发明人： Fuminori TATEISHI , Konami IZUMI , Mayumi YAMAGUCHI
IPC分类号： H01L21/00
CPC分类号： B81C1/00476
摘要： To reduce the number of photomasks which are used to form sacrificial layers for producing spaces of a microstructure, thereby reducing the manufacturing cost. Sacrificial layers are formed by using resist masks which are patterned with the same photomask. Specifically, after forming a first sacrificial layer by etching using a resist mask, a second sacrificial layer is formed by etching using a resist mask which is pattered with same photomask as the resist mask of the first sacrificial layer. By deforming one of the resist masks before etching its corresponding sacrificial layer, for example by increasing or reducing the external dimension of the resist mask, sacrificial layers having different sizes from each other can be formed.
摘要翻译：为了减少用于形成用于形成微结构的空间的牺牲层的光掩模的数量，从而降低制造成本。牺牲层通过使用用相同光掩模图案化的抗蚀剂掩模形成。具体而言，在使用抗蚀剂掩模蚀刻形成第一牺牲层之后，通过使用与第一牺牲层的抗蚀剂掩模相同的光掩模图案化的抗蚀剂掩模进行蚀刻来形成第二牺牲层。在蚀刻其相应的牺牲层之前，通过使抗蚀剂掩模之一变形，例如通过增加或减小抗蚀剂掩模的外部尺寸，可以形成具有彼此不同尺寸的牺牲层。

6. 发明申请

US20070078228A1 MICRO-ELECTRO-MECHANICAL DEVICE AND MANUFACTURING METHOD FOR THE SAME 有权
标题翻译：微电子机械装置及其制造方法
公开(公告)号：US20070078228A1
公开(公告)日：2007-04-05
申请号：US11469125
申请日：2006-08-31
申请人： Fuminori TATEISHI , Konami IZUMI , Mayumi YAMAGUCHI
发明人： Fuminori TATEISHI , Konami IZUMI , Mayumi YAMAGUCHI
IPC分类号： C08F297/02
CPC分类号： C08F297/02 , A61J3/00 , B81C1/0023 , H01L27/1214 , H01L27/1218 , H01L27/1255 , H01L27/1262 , H01L27/1266 , Y02P20/582
摘要： It is an object of the present invention to provide a micro-electro-mechanical-device having a microstructure and a semiconductor element over one surface. In particular, it is an object of the present invention to provide a method for simplifying the process of forming the microstructure and the semiconductor element over one surface. A space in which the microstructure is moved, that is, a movable space for the microstructure is formed by processing an insulating layer which is formed in a process of forming the semiconductor element. The movable space can be formed by forming the insulating layer having a plurality of openings and making the openings face each other to be overlapped each other.
摘要翻译：本发明的目的是提供一种在一个表面上具有微结构和半导体元件的微机电装置。特别地，本发明的目的是提供一种简化在一个表面上形成微结构和半导体元件的工艺的方法。通过处理在形成半导体元件的工艺中形成的绝缘层来形成微结构移动的空间，即微结构的可移动空间。可移动空间可以通过形成具有多个开口的绝缘层并使开口彼此面对地彼此重叠而形成。

7. 发明申请

US20080238663A1 INDIVIDUAL MANAGEMENT SYSTEM 有权
标题翻译：个人管理系统
公开(公告)号：US20080238663A1
公开(公告)日：2008-10-02
申请号：US12053950
申请日：2008-03-24
申请人： Yumiko SAITO , Mayumi YAMAGUCHI , Konami IZUMI
发明人： Yumiko SAITO , Mayumi YAMAGUCHI , Konami IZUMI
IPC分类号： G08B1/08
CPC分类号： G01S13/751
摘要： To provide an individual management system for managing products with the use of an automatic identification technology using a wireless communication device. In the individual management system, an individual management device is attached to a managed object, an individual identification device can wirelessly communicate with the individual management device, and an individual information management device can communicate with the individual identification device. The individual management device includes a detection portion such as a sensor. The individual identification device includes a position analysis portion which calculates a distance between the individual management device and the individual identification device. Information on the distance between the individual management device and the individual identification device, and information from the detection portion included in the individual management device are transmitted to the individual identification device. Accordingly, a system user can specify a position of the individual management device accurately.
摘要翻译：提供使用无线通信设备的自动识别技术来管理产品的个人管理系统。在个人管理系统中，将单独的管理装置附加到被管理对象，个体识别装置可以与各个管理装置进行无线通信，个体信息管理装置能够与个体识别装置进行通信。个人管理装置包括诸如传感器的检测部分。个体识别装置包括计算个体管理装置与个体识别装置之间的距离的位置分析部。关于个人管理装置与个体识别装置之间的距离的信息以及来自单独管理装置中包括的检测部分的信息被发送到个体识别装置。因此，系统用户可以准确地指定个体管理装置的位置。

8. 发明申请

US20070001224A1 MINUTE STRUCTURE, MICROMACHINE, ORGANIC TRANSISTOR, ELECTRIC APPLIANCE, AND MANUFACTURING METHOD THEREOF 有权
标题翻译：分钟结构，微型金枪鱼，有机晶体管，电器及其制造方法
公开(公告)号：US20070001224A1
公开(公告)日：2007-01-04
申请号：US11425245
申请日：2006-06-20
申请人： Mayumi YAMAGUCHI , Konami IZUMI
发明人： Mayumi YAMAGUCHI , Konami IZUMI
IPC分类号： H01L27/12 , H01L21/84
CPC分类号： H01L51/0021 , H01L27/1214 , H01L27/1255 , H01L27/1266
摘要： A micromachine is generally formed using a semiconductor substrate such as a silicon wafer. One of the objects of the present invention is to realize further reduction in cost by integrating a minute structure and a semiconductor element controlling the minute structure over one insulating surface in one step. A minute structure has a structure in which a first layer formed into a frame-shape are provided over an insulating surface, a space is formed inside the frame, and a second layer is formed to cross over the first layer. Such a minute structure and a thin film transistor can be integrated over one insulating surface in one step.
摘要翻译：微机械通常使用诸如硅晶片的半导体衬底形成。本发明的目的之一是通过在一个步骤中将微结构和控制微结构的半导体元件集成在一个绝缘表面上来实现成本的进一步降低。微小结构具有这样的结构，其中形成为框架形状的第一层设置在绝缘表面上，在框架内部形成空间，并且形成第二层以跨越第一层。这样的微小结构和薄膜晶体管可以在一个步骤中集成在一个绝缘表面上。

9. 发明申请

US20120061841A1 SEMICONDUCTOR INTEGRATED CIRCUIT, MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR DEVICE USING SEMICONDUCTOR INTEGRATED CIRCUIT 有权
标题翻译：半导体集成电路及其制造方法以及使用半导体集成电路的半导体器件
公开(公告)号：US20120061841A1
公开(公告)日：2012-03-15
申请号：US13298505
申请日：2011-11-17
申请人： Mayumi YAMAGUCHI , Konami IZUMI
发明人： Mayumi YAMAGUCHI , Konami IZUMI
IPC分类号： H01L23/48
CPC分类号： H01L27/1266 , H01L21/6835 , H01L21/8221 , H01L21/84 , H01L23/4985 , H01L23/49855 , H01L23/5389 , H01L25/105 , H01L27/0688 , H01L27/12 , H01L27/124 , H01L2224/24145 , H01L2224/76155 , H01L2924/01019 , H01L2924/07811 , H01L2924/12032 , H01L2924/12044 , H01L2924/1305 , H01L2924/13091 , H01L2924/00
摘要： A step of forming a through hole in a semiconductor substrate, or a step of polishing the semiconductor substrate from its back surface requires a very long time and causes decrease of productivity. In addition, when semiconductor substrates are stacked, a semiconductor integrated circuit which is formed of the stack is thick and has poor mechanical flexibility. A release layer is formed over each of a plurality of substrates, layers each having a semiconductor element and an opening for forming a through wiring are formed over each of the release layers. Then, layers each having the semiconductor element are peeled off from the substrates, and then overlapped and stacked, a conductive layer is formed in the opening, and the through wiring is formed; thus, a semiconductor integrated circuit is formed.
摘要翻译：在半导体衬底中形成通孔的步骤或从其背面抛光半导体衬底的步骤需要很长时间并且导致生产率降低。此外，当堆叠半导体衬底时，由堆叠形成的半导体集成电路厚并且机械灵活性差。在多个基板的每一个上形成剥离层，每个剥离层上形成有各自具有半导体元件的层和用于形成贯通布线的开口。然后，将具有半导体元件的层从基板剥离，然后重叠堆叠，在开口中形成导电层，形成贯通布线; 从而形成半导体集成电路。

10. 发明申请

US20100141278A1 PARTICLE DETECTION SENSOR, METHOD FOR MANUFACTURING PARTICLE DETECTION SENSOR, AND METHOD FOR DETECTING PARTICLE USING PARTICLE DETECTION SENSOR 有权
标题翻译：颗粒检测传感器，用于制造颗粒检测传感器的方法和使用颗粒检测传感器检测颗粒的方法
公开(公告)号：US20100141278A1
公开(公告)日：2010-06-10
申请号：US12609328
申请日：2009-10-30
申请人： Mayumi YAMAGUCHI , Konami IZUMI , Fuminori TATEISHI
发明人： Mayumi YAMAGUCHI , Konami IZUMI , Fuminori TATEISHI
IPC分类号： G01R27/08 , H01L29/84
CPC分类号： G01N15/1031 , G01N15/1056
摘要： A compact sensor with which particles floating in the air can be easily detected. A sensor having a microstructure which detects a detection object by contact is used. A microstructure has an opening to be a detection hole corresponding to the size of a detection object, and a pair of electrodes having a bridge structure are provided thereabove or thereunder so as to partially contact with each other.
摘要翻译：可以容易地检测到一个紧凑的传感器，可以很容易地检测到浮在空中的颗粒。使用具有通过接触检测检测对象的微结构的传感器。微结构具有对应于检测对象尺寸的检测孔的开口，并且在其上方或其下方设置具有桥接结构的一对电极，以便彼此部分接触。

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